Document the compatible string for tsens found in msm8953.
Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220220201909.445468-3-luca@z3ntu.xyz
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert the Samsung Exynos SoC Thermal Management Unit bindings to DT
schema format.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220122132554.65192-2-krzysztof.kozlowski@canonical.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The 'phandle-array' type is a bit ambiguous. It can be either just an
array of phandles or an array of phandles plus args. Many schemas for
phandle-array properties aren't clear in the schema which case applies
though the description usually describes it.
The array of phandles case boils down to needing:
items:
maxItems: 1
The phandle plus args cases should typically take this form:
items:
- items:
- description: A phandle
- description: 1st arg cell
- description: 2nd arg cell
With this change, some examples need updating so that the bracketing of
property values matches the schema.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Acked-by: Vinod Koul <vkoul@kernel.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org>
Acked-by: Georgi Djakov <djakov@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Acked-by: Stephen Boyd <sboyd@kernel.org>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Link: https://lore.kernel.org/r/20220119015038.2433585-1-robh@kernel.org
Bindings:
- DT schema conversions for Samsung clocks, RNG bindings, Qcom Command
DB and rmtfs, gpio-restart, i2c-mux-gpio, i2c-mux-pinctl, Tegra I2C
and BPMP, pwm-vibrator, Arm DSU, and Cadence macb
- DT schema conversions for Broadcom platforms: interrupt controllers,
STB GPIO, STB waketimer, STB reset, iProc MDIO mux, iProc PCIe,
Cygnus PCIe PHY, PWM, USB BDC, BCM6328 LEDs, TMON, SYSTEMPORT, AMAC,
Northstar 2 PCIe PHY, GENET, moca PHY, GISB arbiter, and SATA
- Add binding schemas for Tegra210 EMC table, TI DC-DC converters,
- Clean-ups of MDIO bus schemas to fix 'unevaluatedProperties' issues
- More fixes due to 'unevaluatedProperties' enabling
- Data type fixes and clean-ups of binding examples found in preparation
to move to validating DTB files directly (instead of intermediate YAML
representation.
- Vendor prefixes for T-Head Semiconductor, OnePlus, and Sunplus
- Add various new compatible strings
DT core:
- Silence a warning for overlapping reserved memory regions
- Reimplement unittest overlay tracking
- Fix stack frame size warning in unittest
- Clean-ups of early FDT scanning functions
- Fix handling of "linux,usable-memory-range" on EFI booted systems
- Add support for 'fail' status on CPU nodes
- Improve error message in of_phandle_iterator_next()
- kbuild: Disable duplicate unit-address warnings for disabled nodes
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Merge tag 'devicetree-for-5.17' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- DT schema conversions for Samsung clocks, RNG bindings, Qcom
Command DB and rmtfs, gpio-restart, i2c-mux-gpio, i2c-mux-pinctl,
Tegra I2C and BPMP, pwm-vibrator, Arm DSU, and Cadence macb
- DT schema conversions for Broadcom platforms: interrupt
controllers, STB GPIO, STB waketimer, STB reset, iProc MDIO mux,
iProc PCIe, Cygnus PCIe PHY, PWM, USB BDC, BCM6328 LEDs, TMON,
SYSTEMPORT, AMAC, Northstar 2 PCIe PHY, GENET, moca PHY, GISB
arbiter, and SATA
- Add binding schemas for Tegra210 EMC table, TI DC-DC converters,
- Clean-ups of MDIO bus schemas to fix 'unevaluatedProperties' issues
- More fixes due to 'unevaluatedProperties' enabling
- Data type fixes and clean-ups of binding examples found in
preparation to move to validating DTB files directly (instead of
intermediate YAML representation.
- Vendor prefixes for T-Head Semiconductor, OnePlus, and Sunplus
- Add various new compatible strings
DT core:
- Silence a warning for overlapping reserved memory regions
- Reimplement unittest overlay tracking
- Fix stack frame size warning in unittest
- Clean-ups of early FDT scanning functions
- Fix handling of "linux,usable-memory-range" on EFI booted systems
- Add support for 'fail' status on CPU nodes
- Improve error message in of_phandle_iterator_next()
- kbuild: Disable duplicate unit-address warnings for disabled nodes"
* tag 'devicetree-for-5.17' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (114 commits)
dt-bindings: net: mdio: Drop resets/reset-names child properties
dt-bindings: clock: samsung: convert S5Pv210 to dtschema
dt-bindings: clock: samsung: convert Exynos5410 to dtschema
dt-bindings: clock: samsung: convert Exynos5260 to dtschema
dt-bindings: clock: samsung: extend Exynos7 bindings with UFS
dt-bindings: clock: samsung: convert Exynos7 to dtschema
dt-bindings: clock: samsung: convert Exynos5433 to dtschema
dt-bindings: i2c: maxim,max96712: Add bindings for Maxim Integrated MAX96712
dt-bindings: iio: adi,ltc2983: Fix 64-bit property sizes
dt-bindings: power: maxim,max17040: Fix incorrect type for 'maxim,rcomp'
dt-bindings: interrupt-controller: arm,gic-v3: Fix 'interrupts' cell size in example
dt-bindings: iio/magnetometer: yamaha,yas530: Fix invalid 'interrupts' in example
dt-bindings: clock: imx5: Drop clock consumer node from example
dt-bindings: Drop required 'interrupt-parent'
dt-bindings: net: ti,dp83869: Drop value on boolean 'ti,max-output-impedance'
dt-bindings: net: wireless: mt76: Fix 8-bit property sizes
dt-bindings: PCI: snps,dw-pcie-ep: Drop conflicting 'max-functions' schema
dt-bindings: i2c: st,stm32-i2c: Make each example a separate entry
dt-bindings: net: stm32-dwmac: Make each example a separate entry
dt-bindings: net: Cleanup MDIO node schemas
...
- Add new TSU driver and DT bindings for the Renesas RZ/G2L platform
(Biju Das).
- Fix missing check when calling reset_control_deassert() in the
rz2gl thermal driver (Biju Das).
- In preparation for FORTIFY_SOURCE performing compile-time and
run-time field bounds checking for memcpy(), avoid intentionally
writing across neighboring fields in the int340x thermal control
driver (Kees Cook).
- Fix RFIM mailbox write commands handling in the int340x thermal
control driver (Sumeet Pawnikar).
- Fix PM issue occurring in the iMX thermal control driver during
suspend/resume by implementing PM runtime support in it (Oleksij
Rempel).
- Add 'const' annotation to thermal_cooling_ops in the Intel
powerclamp driver (Rikard Falkeborn).
- Fix missing ADC bit set in the iMX8MP thermal driver to enable the
sensor (Paul Gerber).
- Drop unused local variable definition from tmon (ran jianping).
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Merge tag 'thermal-5.17-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These add a new driver for Renesas RZ/G2L TSU, update a few existing
thermal control drivers and clean up the tmon utility.
Specifics:
- Add new TSU driver and DT bindings for the Renesas RZ/G2L platform
(Biju Das).
- Fix missing check when calling reset_control_deassert() in the
rz2gl thermal driver (Biju Das).
- In preparation for FORTIFY_SOURCE performing compile-time and
run-time field bounds checking for memcpy(), avoid intentionally
writing across neighboring fields in the int340x thermal control
driver (Kees Cook).
- Fix RFIM mailbox write commands handling in the int340x thermal
control driver (Sumeet Pawnikar).
- Fix PM issue occurring in the iMX thermal control driver during
suspend/resume by implementing PM runtime support in it (Oleksij
Rempel).
- Add 'const' annotation to thermal_cooling_ops in the Intel
powerclamp driver (Rikard Falkeborn).
- Fix missing ADC bit set in the iMX8MP thermal driver to enable the
sensor (Paul Gerber).
- Drop unused local variable definition from tmon (ran jianping)"
* tag 'thermal-5.17-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/int340x: Fix RFIM mailbox write commands
thermal/drivers/rz2gl: Add error check for reset_control_deassert()
thermal/drivers/imx8mm: Enable ADC when enabling monitor
thermal/drivers: Add TSU driver for RZ/G2L
dt-bindings: thermal: Document Renesas RZ/G2L TSU
thermal/drivers/intel_powerclamp: Constify static thermal_cooling_device_ops
thermal/drivers/imx: Implement runtime PM support
thermal: tools: tmon: remove unneeded local variable
thermal: int340x: Use struct_group() for memcpy() region
Convert the Tegra186 (and later) BPMP thermal device tree bindings from
the free-form text format to json-schema.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Document the Thermal Sensor Unit(TSU) in the RZ/G2L SoC.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211130155757.17837-2-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When converting the thermal-zones bindings to yaml the definition of the
contribution property changed. The intention is the same, an integer
value expressing a ratio of a sum on how much cooling is provided by the
device to the zone. But after the conversion the integer value is
limited to the range 0 to 100 and expressed as a percentage.
This is problematic for two reasons.
- This do not match how the binding is used. Out of the 18 files that
make use of the property only two (ste-dbx5x0.dtsi and
ste-hrefv60plus.dtsi) sets it at a value that satisfy the binding,
100. The remaining 16 files set the value higher and fail to validate.
- Expressing the value as a percentage instead of a ratio of the sum is
confusing as there is nothing to enforce the sum in the zone is not
greater then 100.
This patch restore the pre yaml conversion description and removes the
value limitation allowing the usage of the bindings to validate.
Fixes: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Reported-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20211109103045.1403686-1-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Rob Herring <robh@kernel.org>
Not all @st.com email address are concerned, only people who have
a specific @foss.st.com email will see their entry updated.
For some people, who left the company, remove their email.
Cc: Alexandre Torgue <alexandre.torgue@foss.st.com>
Cc: Arnaud Pouliquen <arnaud.pouliquen@foss.st.com>
Cc: Fabien Dessenne <fabien.dessenne@foss.st.com>
Cc: Christophe Roullier <christophe.roullier@foss.st.com>
Cc: Gabriel Fernandez <gabriel.fernandez@foss.st.com>
Cc: Lionel Debieve <lionel.debieve@foss.st.com>
Cc: Amelie Delaunay <amelie.delaunay@foss.st.com>
Cc: Pierre-Yves MORDRET <pierre-yves.mordret@foss.st.com>
Cc: Ludovic Barre <ludovic.barre@foss.st.com>
Cc: Christophe Kerello <christophe.kerello@foss.st.com>
Cc: pascal Paillet <p.paillet@foss.st.com>
Cc: Erwan Le Ray <erwan.leray@foss.st.com>
Cc: Philippe CORNU <philippe.cornu@foss.st.com>
Cc: Yannick Fertre <yannick.fertre@foss.st.com>
Cc: Fabrice Gasnier <fabrice.gasnier@foss.st.com>
Cc: Olivier Moysan <olivier.moysan@foss.st.com>
Cc: Hugues Fruchet <hugues.fruchet@foss.st.com>
Signed-off-by: Patrice Chotard <patrice.chotard@foss.st.com>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/r/20211110150144.18272-6-patrice.chotard@foss.st.com
Signed-off-by: Rob Herring <robh@kernel.org>
Remove redundent comments from rockchip-thermal.yaml
Sort compatibles in alphabetical order.
Signed-off-by: Johan Jonker <jbx6244@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930110517.14323-2-jbx6244@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The tsadc node in rk356x.dtsi has more resets defined then currently
allowed by rockchip-thermal.yaml, so fix that in the documentation.
The driver now uses the devm_reset_control_array_get() function,
so reset-names is no longer required, but keep it for legacy reasons.
Signed-off-by: Johan Jonker <jbx6244@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930110517.14323-1-jbx6244@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The HC generation of the ADC Thermal Monitor is quite similar to the 5th
generation, but differs in valid values for a few properties. Create a
new binding for the HC version of the hardware, rather than sprinkle
conditionals throughout the existing binding.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211005032531.2251928-2-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
tegra by adding a dependency on ARCH_TEGRA along with COMPILE_TEST
(Dmitry Osipenko)
- Fix the error code for the exynos when devm_get_clk() fails (Dan
Carpenter)
- Add the TCC cooling support for AlderLake platform (Sumeet Pawnikar)
- Add support for hardware trip points for the rcar gen3 thermal
driver and store TSC id as unsigned int (Niklas Söderlund)
- Replace the deprecated CPU-hotplug functions get_online_cpus() and
put_online_cpus (Sebastian Andrzej Siewior)
- Add the thermal tools directory in the MAINTAINERS file (Daniel
Lezcano)
- Fix the Makefile and the cross compilation flags for the userspace
'tmon' tool (Rolf Eike Beer)
- Allow to use the IMOK independently from the GDDV on Int340x (Sumeet
Pawnikar)
- Fix the stub thermal_cooling_device_register() function prototype
which does not match the real function (Arnd Bergmann)
- Make the thermal trip point optional in the DT bindings (Maxime
Ripard)
- Fix a typo in a comment in the core code (Geert Uytterhoeven)
- Reduce the verbosity of the trace in the SoC thermal tegra driver
(Dmitry Osipenko)
- Add the support for the LMh (Limit Management hardware) driver on
the QCom platforms (Thara Gopinath)
- Allow processing of HWP interrupt by adding a weak function in the
Intel driver (Srinivas Pandruvada)
- Prevent an abort of the sensor probe is a channel is not used
(Matthias Kaehlcke)
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Merge tag 'thermal-v5.15-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add the tegra3 thermal sensor and fix the compilation testing on
tegra by adding a dependency on ARCH_TEGRA along with COMPILE_TEST
(Dmitry Osipenko)
- Fix the error code for the exynos when devm_get_clk() fails (Dan
Carpenter)
- Add the TCC cooling support for AlderLake platform (Sumeet Pawnikar)
- Add support for hardware trip points for the rcar gen3 thermal driver
and store TSC id as unsigned int (Niklas Söderlund)
- Replace the deprecated CPU-hotplug functions get_online_cpus() and
put_online_cpus (Sebastian Andrzej Siewior)
- Add the thermal tools directory in the MAINTAINERS file (Daniel
Lezcano)
- Fix the Makefile and the cross compilation flags for the userspace
'tmon' tool (Rolf Eike Beer)
- Allow to use the IMOK independently from the GDDV on Int340x (Sumeet
Pawnikar)
- Fix the stub thermal_cooling_device_register() function prototype
which does not match the real function (Arnd Bergmann)
- Make the thermal trip point optional in the DT bindings (Maxime
Ripard)
- Fix a typo in a comment in the core code (Geert Uytterhoeven)
- Reduce the verbosity of the trace in the SoC thermal tegra driver
(Dmitry Osipenko)
- Add the support for the LMh (Limit Management hardware) driver on the
QCom platforms (Thara Gopinath)
- Allow processing of HWP interrupt by adding a weak function in the
Intel driver (Srinivas Pandruvada)
- Prevent an abort of the sensor probe is a channel is not used
(Matthias Kaehlcke)
* tag 'thermal-v5.15-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/drivers/qcom/spmi-adc-tm5: Don't abort probing if a sensor is not used
thermal/drivers/intel: Allow processing of HWP interrupt
dt-bindings: thermal: Add dt binding for QCOM LMh
thermal/drivers/qcom: Add support for LMh driver
firmware: qcom_scm: Introduce SCM calls to access LMh
thermal/drivers/tegra-soctherm: Silence message about clamped temperature
thermal: Spelling s/scallbacks/callbacks/
dt-bindings: thermal: Make trips node optional
thermal/core: Fix thermal_cooling_device_register() prototype
thermal/drivers/int340x: Use IMOK independently
tools/thermal/tmon: Add cross compiling support
thermal/tools/tmon: Improve the Makefile
MAINTAINERS: Add missing userspace thermal tools to the thermal section
thermal/drivers/intel_powerclamp: Replace deprecated CPU-hotplug functions.
thermal/drivers/rcar_gen3_thermal: Store TSC id as unsigned int
thermal/drivers/rcar_gen3_thermal: Add support for hardware trip points
drivers/thermal/intel: Add TCC cooling support for AlderLake platform
thermal/drivers/exynos: Fix an error code in exynos_tmu_probe()
thermal/drivers/tegra: Correct compile-testing of drivers
thermal/drivers/tegra: Add driver for Tegra30 thermal sensor
Even though the previous binding made it a required child node, the
implementation in Linux never made it mandatory and just ignored thermal
zones without trip points.
This was even effectively encouraged, since the thermal core wouldn't
allow a thermal sensor to probe without a thermal zone.
In the case where you had a thermal device that had multiple sensors but
with enough knowledge to provide trip points for only a few of them,
this meant that the only way to make that driver probe was to provide a
thermal zone without the trips node required by the binding.
This obviously led to a fair number of device trees doing exactly that,
making the initial binding requirement ineffective.
Let's make it clear by dropping that requirement.
Cc: Amit Kucheria <amitk@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Maxime Ripard <maxime@cerno.tech>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210721140424.725744-34-maxime@cerno.tech
This will enable temperature reporting for various SoC
components.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@somainline.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Link: https://lore.kernel.org/r/20210728222542.54269-15-konrad.dybcio@somainline.org
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
- Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan
Zhang)
- Export additionnal attributes for the int340x thermal processor
(Srinivas Pandruvada)
- Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra
Kamble)
- Fix kernel documentation for thermal_zone_device_unregister() and
use devm_platform_get_and_ioremap_resource() (Yang Yingliang)
- Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas
Söderlund)
- Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven)
- Add missing of_node_put() for the iMX and Spreadtrum sensors
(Krzysztof Kozlowski)
- Add tegra3 thermal sensor DT bindings (Dmitry Osipenko)
- Stop the thermal zone monitoring when unregistering it to prevent a
temperature update without the 'get_temp' callback (Dmitry Osipenko)
- Add rk3568 DT bindings, convert bindings to yaml schemas and add the
corresponding compatible in the Rockchip sensor (Ezequiel Garcia)
- Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson)
- Use the find_first_zero_bit() function instead of custom code (Andy
Shevchenko)
- Fix the kernel doc for the device cooling device (Yang Li)
- Reorg the processor thermal int340x to set the scene for the PCI
mmio driver (Srinivas Pandruvada)
- Add PCI MMIO driver for the int340x processor thermal driver
(Srinivas Pandruvada)
- Add hwmon sensors for the mediatek sensor (Frank Wunderlich)
- Fix warning for return value reported by Smatch for the int340x
thermal processor (Srinivas Pandruvada)
- Fix wrong register access and decoding for the int340x thermal
processor (Srinivas Pandruvada)
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Merge tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add rk3568 sensor support (Finley Xiao)
- Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan
Zhang)
- Export additionnal attributes for the int340x thermal processor
(Srinivas Pandruvada)
- Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra
Kamble)
- Fix kernel documentation for thermal_zone_device_unregister() and use
devm_platform_get_and_ioremap_resource() (Yang Yingliang)
- Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas
Söderlund)
- Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven)
- Add missing of_node_put() for the iMX and Spreadtrum sensors
(Krzysztof Kozlowski)
- Add tegra3 thermal sensor DT bindings (Dmitry Osipenko)
- Stop the thermal zone monitoring when unregistering it to prevent a
temperature update without the 'get_temp' callback (Dmitry Osipenko)
- Add rk3568 DT bindings, convert bindings to yaml schemas and add the
corresponding compatible in the Rockchip sensor (Ezequiel Garcia)
- Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson)
- Use the find_first_zero_bit() function instead of custom code (Andy
Shevchenko)
- Fix the kernel doc for the device cooling device (Yang Li)
- Reorg the processor thermal int340x to set the scene for the PCI mmio
driver (Srinivas Pandruvada)
- Add PCI MMIO driver for the int340x processor thermal driver
(Srinivas Pandruvada)
- Add hwmon sensors for the mediatek sensor (Frank Wunderlich)
- Fix warning for return value reported by Smatch for the int340x
thermal processor (Srinivas Pandruvada)
- Fix wrong register access and decoding for the int340x thermal
processor (Srinivas Pandruvada)
* tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (23 commits)
thermal/drivers/int340x/processor_thermal: Fix tcc setting
thermal/drivers/int340x/processor_thermal: Fix warning for return value
thermal/drivers/mediatek: Add sensors-support
thermal/drivers/int340x/processor_thermal: Add PCI MMIO based thermal driver
thermal/drivers/int340x/processor_thermal: Split enumeration and processing part
thermal: devfreq_cooling: Fix kernel-doc
thermal/drivers/intel/intel_soc_dts_iosf: Switch to use find_first_zero_bit()
dt-bindings: thermal: tsens: Add sc8180x compatible
dt-bindings: rockchip-thermal: Support the RK3568 SoC compatible
dt-bindings: thermal: convert rockchip-thermal to json-schema
thermal/core/thermal_of: Stop zone device before unregistering it
dt-bindings: thermal: Add binding for Tegra30 thermal sensor
thermal/drivers/sprd: Add missing of_node_put for loop iteration
thermal/drivers/imx_sc: Add missing of_node_put for loop iteration
thermal/drivers/rcar_gen3_thermal: Do not shadow rcar_gen3_ths_tj_1
thermal/drivers/rcar_gen3_thermal: Fix coefficient calculations
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
thermal/core: Correct function name thermal_zone_device_unregister()
dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
thermal/drivers/int340x: processor_thermal: Export additional attributes
...
Add a new compatible for the thermal sensor device on RK3568 SoCs.
Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210506175514.168365-4-ezequiel@collabora.com
All NVIDIA Tegra30 SoCs have on-chip sensors which monitor temperature
and voltage of the SoC. Sensors also controls CPU x2 freq throttle and
emits emergency shutdown signal. TSENSOR has has two separate channels
for each sensor placed in a different parts of the SoC. Add binding for
the sensor hardware.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Dmitry Osipenko <digetx@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210616190417.32214-2-digetx@gmail.com
If a property has an 'items' list, then a 'minItems' or 'maxItems' with the
same size as the list is redundant and can be dropped. Note that is DT
schema specific behavior and not standard json-schema behavior. The tooling
will fixup the final schema adding any unspecified minItems/maxItems.
This condition is partially checked with the meta-schema already, but
only if both 'minItems' and 'maxItems' are equal to the 'items' length.
An improved meta-schema is pending.
Cc: Jens Axboe <axboe@kernel.dk>
Cc: Stephen Boyd <sboyd@kernel.org>
Cc: Herbert Xu <herbert@gondor.apana.org.au>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: David Airlie <airlied@linux.ie>
Cc: Daniel Vetter <daniel@ffwll.ch>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Kamal Dasu <kdasu.kdev@gmail.com>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: Marc Zyngier <maz@kernel.org>
Cc: Joerg Roedel <joro@8bytes.org>
Cc: Mauro Carvalho Chehab <mchehab@kernel.org>
Cc: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Cc: Jakub Kicinski <kuba@kernel.org>
Cc: Wolfgang Grandegger <wg@grandegger.com>
Cc: Andrew Lunn <andrew@lunn.ch>
Cc: Vivien Didelot <vivien.didelot@gmail.com>
Cc: Vladimir Oltean <olteanv@gmail.com>
Cc: Bjorn Helgaas <bhelgaas@google.com>
Cc: Kishon Vijay Abraham I <kishon@ti.com>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: "Uwe Kleine-König" <u.kleine-koenig@pengutronix.de>
Cc: Lee Jones <lee.jones@linaro.org>
Cc: Ohad Ben-Cohen <ohad@wizery.com>
Cc: Mathieu Poirier <mathieu.poirier@linaro.org>
Cc: Paul Walmsley <paul.walmsley@sifive.com>
Cc: Palmer Dabbelt <palmer@dabbelt.com>
Cc: Albert Ou <aou@eecs.berkeley.edu>
Cc: Alessandro Zummo <a.zummo@towertech.it>
Cc: Alexandre Belloni <alexandre.belloni@bootlin.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Wim Van Sebroeck <wim@linux-watchdog.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # for MMC
Acked-by: Jassi Brar <jassisinghbrar@gmail.com>
Acked-By: Vinod Koul <vkoul@kernel.org>
Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Reviewed-by: Arnaud Pouliquen <arnaud.pouliquen@st.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Wolfram Sang <wsa@kernel.org> # for I2C
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Link: https://lore.kernel.org/r/20210615191543.1043414-1-robh@kernel.org
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas
Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of
a couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał
Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well
as the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of
cleanups and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
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Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Remove duplicate error message for the amlogic driver (Tang Bin)
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of a
couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well as
the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of cleanups
and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
* tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Lock the thermal zone while looping over instances
thermal/core/power_allocator: Update once cooling devices when temp is low
thermal/core/power_allocator: Maintain the device statistics from going stale
thermal/core: Create a helper __thermal_cdev_update() without a lock
dt-bindings: thermal: tsens: Document ipq8064 bindings
thermal/drivers/tsens: Add support for ipq8064-tsens
thermal/drivers/tsens: Drop unused define for msm8960
thermal/drivers/tsens: Replace custom 8960 apis with generic apis
thermal/drivers/tsens: Fix bug in sensor enable for msm8960
thermal/drivers/tsens: Use init_common for msm8960
thermal/drivers/tsens: Add VER_0 tsens version
thermal/drivers/tsens: Convert msm8960 to reg_field
thermal/drivers/tsens: Don't hardcode sensor slope
Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
thermal/core: Remove thermal_notify_framework
iwlwifi: mvm: tt: Replace thermal_notify_framework
dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
...
Document the use of bindings used for msm8960 tsens based devices.
msm8960 use the same gcc regs and is set as a child of the qcom gcc.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-10-ansuelsmth@gmail.com
This property is required for every thermal sensor as it's used when
using phandles.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210415112121.4999-1-zajec5@gmail.com
Users of common properties shouldn't have a type definition as the
common schemas already have one. Drop all the unnecessary type
references in the tree.
A meta-schema update to catch these is pending.
Cc: Maxime Ripard <mripard@kernel.org>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Krzysztof Kozlowski <krzk@kernel.org>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: Jakub Kicinski <kuba@kernel.org>
Cc: Ohad Ben-Cohen <ohad@wizery.com>
Cc: Cheng-Yi Chiang <cychiang@chromium.org>
Cc: Benson Leung <bleung@chromium.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Stefan Wahren <wahrenst@gmx.net>
Cc: Masahiro Yamada <yamada.masahiro@socionext.com>
Cc: Odelu Kukatla <okukatla@codeaurora.org>
Cc: linux-gpio@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-can@vger.kernel.org
Cc: netdev@vger.kernel.org
Cc: linux-remoteproc@vger.kernel.org
Cc: alsa-devel@alsa-project.org
Cc: linux-usb@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Dmity Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Suman Anna <s-anna@ti.com>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Reviewed-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org>
Acked-by: Maxime Ripard <maxime@cerno.tech>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Link: https://lore.kernel.org/r/20210316194858.3527845-1-robh@kernel.org
Properties with standard unit suffixes already have a type and don't need
type references. Fix a few more cases which have gotten added.
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: Kevin Tsai <ktsai@capellamicro.com>
Cc: linux-iio@vger.kernel.org
Cc: linux-input@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Dmity Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: Luca Ceresoli <luca@lucaceresoli.net>
Acked-by: Sebastian Reichel <sre@kernel.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Link: https://lore.kernel.org/r/20210316194824.3526913-1-robh@kernel.org
When adding support for V3U (r8a779a0) it was incorrectly recorded it
supports four nodes, while in fact it supports five. The fifth node is
named TSC0 and breaks the existing naming schema starting at 1. Work
around this by separately defining the reg property for V3U and others.
Restore the maximum number of nodes to three for other compatibles as
it was before erroneously increasing it for V3U.
Fixes: d7fdfb6541 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a779a0 support")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210310110716.3297544-1-niklas.soderlund+renesas@ragnatech.se
- Sync dtc to upstream version v1.6.0-51-g183df9e9c2b9 and build
host fdtoverlay
- Add kbuild support to build DT overlays (%.dtbo)
- Drop NULLifying match table in of_match_device(). In preparation for
this, there are several driver cleanups to use
(of_)?device_get_match_data().
- Drop pointless wrappers from DT struct device API
- Convert USB binding schemas to use graph schema and remove old plain
text graph binding doc
- Convert spi-nor and v3d GPU bindings to DT schema
- Tree wide schema fixes for if/then schemas, array size constraints,
and undocumented compatible strings in examples
- Handle 'no-map' correctly for already reserved memblock regions
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Merge tag 'devicetree-for-5.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
- Sync dtc to upstream version v1.6.0-51-g183df9e9c2b9 and build host
fdtoverlay
- Add kbuild support to build DT overlays (%.dtbo)
- Drop NULLifying match table in of_match_device().
In preparation for this, there are several driver cleanups to use
(of_)?device_get_match_data().
- Drop pointless wrappers from DT struct device API
- Convert USB binding schemas to use graph schema and remove old plain
text graph binding doc
- Convert spi-nor and v3d GPU bindings to DT schema
- Tree wide schema fixes for if/then schemas, array size constraints,
and undocumented compatible strings in examples
- Handle 'no-map' correctly for already reserved memblock regions
* tag 'devicetree-for-5.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (35 commits)
driver core: platform: Drop of_device_node_put() wrapper
of: Remove of_dev_{get,put}()
dt-bindings: usb: Change descibe to describe in usbmisc-imx.txt
dt-bindings: can: rcar_canfd: Group tuples in pin control properties
dt-bindings: power: renesas,apmu: Group tuples in cpus properties
dt-bindings: mtd: spi-nor: Convert to DT schema format
dt-bindings: Use portable sort for version cmp
dt-bindings: ethernet-controller: fix fixed-link specification
dt-bindings: irqchip: Add node name to PRUSS INTC
dt-bindings: interconnect: Fix the expected number of cells
dt-bindings: Fix errors in 'if' schemas
dt-bindings: iommu: renesas,ipmmu-vmsa: Make 'power-domains' conditionally required
dt-bindings: Fix undocumented compatible strings in examples
kbuild: Add support to build overlays (%.dtbo)
scripts: dtc: Remove the unused fdtdump.c file
scripts: dtc: Build fdtoverlay tool
scripts/dtc: Update to upstream version v1.6.0-51-g183df9e9c2b9
scripts: dtc: Fetch fdtoverlay.c from external DTC project
dt-bindings: thermal: sun8i: Fix misplaced schema keyword in compatible strings
dt-bindings: iio: dac: Fix AD5686 references
...
Add bindings for thermal monitor, part of Qualcomm PMIC5 chips. It is a
close counterpart of VADC part of those PMICs.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210205000118.493610-2-dmitry.baryshkov@linaro.org
The zte zx platform is getting removed, so this driver is no
longer needed.
Cc: Jun Nie <jun.nie@linaro.org>
Cc: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org
The tango platform is getting removed, so the driver is no
longer needed.
Cc: Marc Gonzalez <marc.w.gonzalez@free.fr>
Cc: Mans Rullgard <mans@mansr.com>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mans Rullgard <mans@mansr.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org
Add support for R-Car V3U. The V3U IP differs a bit from its siblings in
such way that it have 4 TSC nodes and the interrupts are not routed to
the INTC-AP but to the ECM.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201126223028.3119044-2-niklas.soderlund+renesas@ragnatech.se
- Factor out common required properties,
- "interrupts", "clocks", and "power-domains" are required on R-Mobile
APE6, too,
- Invert logic to simplify descriptions.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund@ragnatech.se>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201028153541.1736279-1-geert+renesas@glider.be
Add binding documentation for the MediaTek MT8516 SoC.
The SoC thermal IP is similar to MT2701.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201021164231.3029956-2-fparent@baylibre.com
MT8516 Thermal IP does not support reset. Make the resets property
optional in order to be able to support MT8516 SoC.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201021164231.3029956-1-fparent@baylibre.com
- Use dev_error_probe() to simplify the error handling on imx and imx8
platforms (Anson Huang)
- Use dedicated kobj_to_dev() instead of container_of() in the sysfs
core code (Tian Tao)
- Fix coding style by adding braces to a one line conditional
statement on rcar (Geert Uytterhoeven)
- Add DT binding documentation for the r8a774e1 platform and update
the Kconfig description supporting RZ/G2 SoCs (Lad Prabhakar)
- Simplify the return expression of stm_thermal_prepare on the stm32
platform (Qinglang Miao)
- Fix the unit in the function documentation for the idle injection
cooling device (Zhuguang Qing)
- Remove an unecessary mutex_init() in the core code (Qinglang Miao)
- Add support for keep alive events in the core code and the specific
int340x (Srinivas Pandruvada)
- Remove unused thermal zone variable in devfreq and cpufreq cooling
devices (Zhuguang Qing)
- Add the A100's THS controller support (Yangtao Li)
- Add power management on the omap3's bandgap sensor (Adam Ford)
- Fix a missing nlmsg_free in the netlink core error path (Jing Xiangfeng)
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Merge tag 'thermal-v5.10-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Fix Kconfig typo "acces" -> "access" (Colin Ian King)
- Use dev_error_probe() to simplify the error handling on imx and imx8
platforms (Anson Huang)
- Use dedicated kobj_to_dev() instead of container_of() in the sysfs
core code (Tian Tao)
- Fix coding style by adding braces to a one line conditional statement
on rcar (Geert Uytterhoeven)
- Add DT binding documentation for the r8a774e1 platform and update the
Kconfig description supporting RZ/G2 SoCs (Lad Prabhakar)
- Simplify the return expression of stm_thermal_prepare on the stm32
platform (Qinglang Miao)
- Fix the unit in the function documentation for the idle injection
cooling device (Zhuguang Qing)
- Remove an unecessary mutex_init() in the core code (Qinglang Miao)
- Add support for keep alive events in the core code and the specific
int340x (Srinivas Pandruvada)
- Remove unused thermal zone variable in devfreq and cpufreq cooling
devices (Zhuguang Qing)
- Add the A100's THS controller support (Yangtao Li)
- Add power management on the omap3's bandgap sensor (Adam Ford)
- Fix a missing nlmsg_free in the netlink core error path (Jing
Xiangfeng)
* tag 'thermal-v5.10-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal: core: Adding missing nlmsg_free() in thermal_genl_sampling_temp()
thermal: ti-soc-thermal: Enable addition power management
thermal: sun8i: Add A100's THS controller support
thermal: sun8i: add TEMP_CALIB_MASK for calibration data in sun50i_h6_ths_calibrate
dt-bindings: thermal: sun8i: Add binding for A100's THS controller
thermal: cooling: Remove unused variable *tz
thermal: int340x: Add keep alive response method
thermal: core: Add new event for sending keep alive notifications
thermal: int340x: Provide notification for OEM variable change
thermal: core: remove unnecessary mutex_init()
thermal/idle_inject: Fix comment of idle_duration_us and name of latency_ns
thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config
thermal: stm32: simplify the return expression of stm_thermal_prepare()
dt-bindings: thermal: rcar-gen3-thermal: Add r8a774e1 support
thermal: rcar_thermal: Add missing braces to conditional statement
thermal: Use kobj_to_dev() instead of container_of()
thermal: imx8mm: Use dev_err_probe() to simplify error handling
thermal: imx: Use dev_err_probe() to simplify error handling
drivers: thermal: Kconfig: fix spelling mistake "acces" -> "access"
In order to add meta-schema checks for additional/unevaluatedProperties
being present, all schema need to make this explicit. As common/shared
schema are included by other schemas, they should always allow for
additionalProperties.
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Sebastian Reichel <sre@kernel.org>
Acked-by: Chanwoo Choi <cw00.choi@samsung.com>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Link: https://lore.kernel.org/r/20201005183830.486085-5-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
DTSes with new i.MX 8M SoCs introduce their own compatibles so add them
to fix dtbs_check warnings like:
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible:0: 'fsl,imx8mn-tmu' is not one of ['fsl,imx8mm-tmu', 'fsl,imx8mp-tmu']
From schema: Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible: ['fsl,imx8mn-tmu', 'fsl,imx8mm-tmu'] is too long
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible: Additional items are not allowed ('fsl,imx8mm-tmu' was unexpected)
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
drivers cleanup (Andrzej Pietrasiewicz)
- Add generic netlink support for userspace notifications: events, temperature
and discovery commands (Daniel Lezcano)
- Fix redundant initialization for a ret variable (Colin Ian King)
- Remove the clock cooling code as it is used nowhere (Amit Kucheria)
- Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian Rotariu)
- Replace all references to thermal.txt in the documentation to the
corresponding yaml files (Amit Kucheria)
- Add maintainer entry for the IPA (Lukasz Luba)
- Add support for MSM8939 for the tsens (Shawn Guo)
- Update power allocator and devfreq cooling to SPDX licensing (Lukasz Luba)
- Add Cannon Lake Low Power PCH support (Sumeet Pawnikar)
- Add tsensor support for V2 mediatek thermal system (Henry Yen)
- Fix thermal zone lookup by ID for the core code (Thierry Reding)
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Merge tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add support to enable/disable the thermal zones resulting on core
code and drivers cleanup (Andrzej Pietrasiewicz)
- Add generic netlink support for userspace notifications: events,
temperature and discovery commands (Daniel Lezcano)
- Fix redundant initialization for a ret variable (Colin Ian King)
- Remove the clock cooling code as it is used nowhere (Amit Kucheria)
- Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian
Rotariu)
- Replace all references to thermal.txt in the documentation to the
corresponding yaml files (Amit Kucheria)
- Add maintainer entry for the IPA (Lukasz Luba)
- Add support for MSM8939 for the tsens (Shawn Guo)
- Update power allocator and devfreq cooling to SPDX licensing (Lukasz
Luba)
- Add Cannon Lake Low Power PCH support (Sumeet Pawnikar)
- Add tsensor support for V2 mediatek thermal system (Henry Yen)
- Fix thermal zone lookup by ID for the core code (Thierry Reding)
* tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (40 commits)
thermal: intel: intel_pch_thermal: Add Cannon Lake Low Power PCH support
thermal: mediatek: Add tsensor support for V2 thermal system
thermal: mediatek: Prepare to add support for other platforms
thermal: Update power allocator and devfreq cooling to SPDX licensing
MAINTAINERS: update entry to thermal governors file name prefixing
thermal: core: Add thermal zone enable/disable notification
thermal: qcom: tsens-v0_1: Add support for MSM8939
dt-bindings: tsens: qcom: Document MSM8939 compatible
thermal: core: Fix thermal zone lookup by ID
thermal: int340x: processor_thermal: fix: update Jasper Lake PCI id
thermal: imx8mm: Support module autoloading
thermal: ti-soc-thermal: Fix reversed condition in ti_thermal_expose_sensor()
MAINTAINERS: Add maintenance information for IPA
thermal: rcar_gen3_thermal: Do not shadow thcode variable
dt-bindings: thermal: Get rid of thermal.txt and replace references
thermal: core: Move initialization after core initcall
thermal: netlink: Improve the initcall ordering
net: genetlink: Move initialization to core_initcall
thermal: rcar_gen3_thermal: Add r8a774e1 support
thermal/drivers/clock_cooling: Remove clock_cooling code
...
- Improve device links cycle detection and breaking. Add more
bindings for device link dependencies.
- Refactor parsing 'no-map' in __reserved_mem_alloc_size()
- Improve DT unittest 'ranges' and 'dma-ranges' test case to check
differing cell sizes
- Various http to https link conversions
- Add a schema check to prevent 'syscon' from being used by itself
without a more specific compatible
- A bunch more DT binding conversions to schema
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Merge tag 'devicetree-for-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull Devicetree updates from Rob Herring:
- Improve device links cycle detection and breaking. Add more bindings
for device link dependencies.
- Refactor parsing 'no-map' in __reserved_mem_alloc_size()
- Improve DT unittest 'ranges' and 'dma-ranges' test case to check
differing cell sizes
- Various http to https link conversions
- Add a schema check to prevent 'syscon' from being used by itself
without a more specific compatible
- A bunch more DT binding conversions to schema
* tag 'devicetree-for-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (55 commits)
of: reserved-memory: remove duplicated call to of_get_flat_dt_prop() for no-map node
of: unittest: Use bigger address cells to catch parser regressions
dt-bindings: memory-controllers: Convert mmdc to json-schema
dt-bindings: mtd: Convert imx nand to json-schema
dt-bindings: mtd: Convert gpmi nand to json-schema
dt-bindings: iio: io-channel-mux: Fix compatible string in example code
of: property: Add device link support for pinctrl-0 through pinctrl-8
of: property: Add device link support for multiple DT bindings
dt-bindings: phy: ti: phy-gmii-sel: convert bindings to json-schema
dt-bindings: mux: mux.h: drop a duplicated word
dt-bindings: misc: Convert olpc,xo1.75-ec to json-schema
dt-bindings: aspeed-lpc: Replace HTTP links with HTTPS ones
dt-bindings: drm/bridge: Replace HTTP links with HTTPS ones
drm/tilcdc: Replace HTTP links with HTTPS ones
dt-bindings: iommu: renesas,ipmmu-vmsa: Add r8a774e1 support
dt-bindings: fpga: Replace HTTP links with HTTPS ones
dt-bindings: virtio: Replace HTTP links with HTTPS ones
dt-bindings: media: imx274: Add optional input clock and supplies
dt-bindings: i2c-gpio: Use 'deprecated' keyword on deprecated properties
dt-bindings: interrupt-controller: Fix typos in loongson,liointc.yaml
...
As usual, there are many patches addressing minor issues in existing
DTS files, such as DTC warnings, or adding support for additional
peripherals.
There are three added SoCs in existing product families:
- Amazon:
Alpine v3 is a 16-core Cortex-A72 SoC from Amazon's Annapurna Labs,
otherwise known as AL73400 or first-generation Graviton, and following
the already supported Cortex-A1`5 and Cortex-A57 based Alpine chips.
This one is added together with the official Evaluation platform.
- Qualcomm:
The Snapdragon SDM630 platform is a family of mid-range mobile phone
chips from 2017 based on Cortex-A53 or Kryo 260 CPUs.
A total of five end-user products are added based on these, all
Android phones from Sony: Xperia 10, 10 Plus, XA2, XA2 Plus and
XA2 Ultra.
- Renesas:
RZ/G2H (r8a774e1) is currently the top model in the Renesas RZ/G
family, and apparently closely related to the RZ/G2N and RZ/G2M
models we already support but has a faster GPU and additional
on-chip peripherals.
It is added along with the HopeRun HiHope RZ/G2H development board
A small number of new boards for already supported SoCs also debut:
- Allwinner sunxi:
Only one new machine, revision v1.2 of the Pine64 PinePhone
(non-Android) smartphone, containing minor changes compared to
earlier versions.
- Amlogic Meson:
WeTek Core2 is an Amlogic S912 (GXM) based Set-top-box
- Aspeed:
EthanolX is AMD's EPYC data center rerence platform, using an
ASpeed AST2600 baseboard management controller.
- Mediatek:
Lenovo IdeaPad Duet 10.1" (kukui/krane) is a new Chromebook
based on the MT8183 (Helio P60t) SoC.
- Nvidia Tegra:
ASUS Google Nexus 7 and Acer Iconia Tab A500 are two Android
tablets from around 2012 using Tegra 3 and Tegra 2, respectively.
Thanks to PostmarketOS, these can now run mainline kernels
and become useful again.
The Jetson Xavier NX Developer Kit uses a SoM and carrier board
for the Tegra194, their latest 64-bit chip based on Carmel CPU
cores and Volta graphics.
- NXP i.MX:
Five new boards based on the 32-bit i.MX6 series are added:
The MYiR MYS-6ULX single-board computer, and four different
models of industrial computers from Protonic.
- Qualcomm:
MikroTik RouterBoard 3011 is a rackmounted router based on the
32-bit IPQ8064 networking SoC
Three older phones get added, the Snapdragon 808 (msm8992) based
Xiaomi Libra (Mi 4C) and Microsoft Lumia 950, originally running
Windows Phone, and the Snapdragon 810 (msm8994) based Sony
Xperia Z5.
- Renesas:
In addition to the HiHope RZ/G2H board mentioned above, we gain
support for board versions 3.0 and 4.0 of the earlier RZ/G2M and
RZ/G2N reference boards.
Beacon EmbeddedWorks adds another SoM+Carrier development board
for RZ/G2M.
- Rockchips:
Radxa Rock Pi N8 development board and the VMARC RK3288 SoM it
is based on, using the high-end 32-bit rk3288 SoC.
Notable updates to existing platforms are usually for added on-chip
peripherals, including:
- ASpeed AST2xxx (various)
- Allwinner (cpufreq, thermal, Pinephone touchscreen)
- Amlogic Meson (audio, gpu dvdfs, board updates)
- Arm Versatile
- Broadcom (board updates for switch ports, Raspberry pi clock updates)
- Hisilicon (various)
- Intel/Altera SoCFPGA (various)
- Marvell Armada 7xxx/8xxx (smmu)
- Marvell MMP (GPU on mmp2/mmp3)
- Mediatek mt8183 (USB, pericfg)
- NXP Layerscape (VPU, thermal, DSPI)
- NXP i.MX (VPU, bindings, board updates)
- Nvidia Tegra194 (GPU)
- Qualcomm (GPU, Interconnect, ...)
- Renesas R-Car (SPI, IPMMU, board updates)
- STMicroelectronics STM32 (various)
- Samsung Exynos (various)
- Socionext Uniphier (updates to serial, and pcie)
- TI K3 (serdes, usb3, audio, sd, chipid)
- TI OMAP (IPU/DSP remoteproc changes, dropping platform data)
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
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Merge tag 'arm-dt-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull ARM SoC DT updates from Arnd Bergmann:
"As usual, there are many patches addressing minor issues in existing
DTS files, such as DTC warnings, or adding support for additional
peripherals.
There are three added SoCs in existing product families:
- Amazon:
Alpine v3 is a 16-core Cortex-A72 SoC from Amazon's Annapurna Labs,
otherwise known as AL73400 or first-generation Graviton, and
following the already supported Cortex-A1`5 and Cortex-A57 based
Alpine chips. This one is added together with the official
Evaluation platform.
- Qualcomm:
The Snapdragon SDM630 platform is a family of mid-range mobile
phone chips from 2017 based on Cortex-A53 or Kryo 260 CPUs. A total
of five end-user products are added based on these, all Android
phones from Sony: Xperia 10, 10 Plus, XA2, XA2 Plus and XA2 Ultra.
- Renesas:
RZ/G2H (r8a774e1) is currently the top model in the Renesas RZ/G
family, and apparently closely related to the RZ/G2N and RZ/G2M
models we already support but has a faster GPU and additional
on-chip peripherals. It is added along with the HopeRun HiHope
RZ/G2H development board
A small number of new boards for already supported SoCs also debut:
- Allwinner sunxi:
Only one new machine, revision v1.2 of the Pine64 PinePhone
(non-Android) smartphone, containing minor changes compared to
earlier versions.
- Amlogic Meson:
WeTek Core2 is an Amlogic S912 (GXM) based Set-top-box
- Aspeed:
EthanolX is AMD's EPYC data center rerence platform, using an
ASpeed AST2600 baseboard management controller.
- Mediatek:
Lenovo IdeaPad Duet 10.1" (kukui/krane) is a new Chromebook based
on the MT8183 (Helio P60t) SoC.
- Nvidia Tegra:
ASUS Google Nexus 7 and Acer Iconia Tab A500 are two Android
tablets from around 2012 using Tegra 3 and Tegra 2, respectively.
Thanks to PostmarketOS, these can now run mainline kernels and
become useful again.
The Jetson Xavier NX Developer Kit uses a SoM and carrier board for
the Tegra194, their latest 64-bit chip based on Carmel CPU cores
and Volta graphics.
- NXP i.MX:
Five new boards based on the 32-bit i.MX6 series are added: The
MYiR MYS-6ULX single-board computer, and four different models of
industrial computers from Protonic.
- Qualcomm:
MikroTik RouterBoard 3011 is a rackmounted router based on the
32-bit IPQ8064 networking SoC
Three older phones get added, the Snapdragon 808 (msm8992) based
Xiaomi Libra (Mi 4C) and Microsoft Lumia 950, originally running
Windows Phone, and the Snapdragon 810 (msm8994) based Sony Xperia
Z5.
- Renesas:
In addition to the HiHope RZ/G2H board mentioned above, we gain
support for board versions 3.0 and 4.0 of the earlier RZ/G2M and
RZ/G2N reference boards. Beacon EmbeddedWorks adds another
SoM+Carrier development board for RZ/G2M.
- Rockchips:
Radxa Rock Pi N8 development board and the VMARC RK3288 SoM it is
based on, using the high-end 32-bit rk3288 SoC.
Notable updates to existing platforms are usually for added on-chip
peripherals, including:
- ASpeed AST2xxx (various)
- Allwinner (cpufreq, thermal, Pinephone touchscreen)
- Amlogic Meson (audio, gpu dvdfs, board updates)
- Arm Versatile
- Broadcom (board updates for switch ports, Raspberry pi clock updates)
- Hisilicon (various)
- Intel/Altera SoCFPGA (various)
- Marvell Armada 7xxx/8xxx (smmu)
- Marvell MMP (GPU on mmp2/mmp3)
- Mediatek mt8183 (USB, pericfg)
- NXP Layerscape (VPU, thermal, DSPI)
- NXP i.MX (VPU, bindings, board updates)
- Nvidia Tegra194 (GPU)
- Qualcomm (GPU, Interconnect, ...)
- Renesas R-Car (SPI, IPMMU, board updates)
- STMicroelectronics STM32 (various)
- Samsung Exynos (various)
- Socionext Uniphier (updates to serial, and pcie)
- TI K3 (serdes, usb3, audio, sd, chipid)
- TI OMAP (IPU/DSP remoteproc changes, dropping platform data)"
* tag 'arm-dt-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (605 commits)
arm64: dts: meson: odroid-n2: add jack audio output support
arm64: dts: meson: odroid-n2: enable audio loopback
ARM: dts: berlin: Align L2 cache-controller nodename with dtschema
arm64: dts: qcom: Add Microsoft Lumia 950 (Talkman) device tree
arm64: dts: qcom: Add Xiaomi Libra (Mi 4C) device tree
arm64: dts: qcom: msm8992: Add RPMCC node
arm64: dts: qcom: msm8992: Add PSCI support.
arm64: dts: qcom: msm8992: Add PMU node
arm64: dts: qcom: msm8992: Add BLSP2_UART2 and I2C nodes
arm64: dts: qcom: msm8992: Add SPMI PMIC arbiter device
arm64: dts: qcom: msm8992: Add a SCM node
arm64: dts: qcom: msm8992: Add a proper CPU map
arm64: dts: qcom: bullhead: Move UART pinctrl to SoC
arm64: dts: qcom: bullhead: Add qcom,msm-id
arm64: dts: qcom: msm8992: Fix SDHCI1
arm64: dts: qcom: msm8992: Modernize the DTS style
arm64: dts: qcom: Add support for Sony Xperia Z5 (SoMC Sumire-RoW)
arm64: dts: qcom: Move msm8994-smd-rpm contents to lg-bullhead.
arm64: dts: qcom: msm8994: Add support for SMD RPM
arm64: dts: qcom: msm8992: Add a label to rpm-requests
...
It adds compatible for MSM8939 TSENS device.
Signed-off-by: Konrad Dybcio <konradybcio@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Tested-by: Konrad Dybcio <konradybcio@gmail.com> /* on Asus Z00T smartphone */
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629144926.665-2-shawn.guo@linaro.org
Now that we have yaml bindings for the thermal subsystem, get rid of the
old bindings (thermal.txt).
Replace all references to thermal.txt in the Documentation with a link
to the appropriate YAML bindings using the following search and replace
pattern:
- If the reference is specific to the thermal-sensor-cells property,
replace with a pointer to thermal-sensor.yaml
- If the reference is to the cooling-cells property, replace with a
pointer to thermal-cooling-devices.yaml
- If the reference is generic thermal bindings, replace with a
reference to thermal*.yaml.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/e9aacd33071a00568b67e110fa3bcc4d86d3e1e4.1595245166.git.amit.kucheria@linaro.org
- Sync dtc to upstream to pick up fixes for I2C bus checks and quiet
warnings
- Various fixes for DT binding check warnings
- A couple of build fixes/improvements for binding checks
- ReST formatting improvements for writing-schema.rst
- Document reference fixes
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Merge tag 'devicetree-fixes-for-5.8-2' into dt/next
Devicetree fixes for v5.8, take 2:
- Sync dtc to upstream to pick up fixes for I2C bus checks and quiet
warnings
- Various fixes for DT binding check warnings
- A couple of build fixes/improvements for binding checks
- ReST formatting improvements for writing-schema.rst
- Document reference fixes
Adjust the reg property to fix the following warning seen with
'make dt_binding_check':
Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml: example-0: thermal@42050000:reg:0: [0, 1107623936, 0, 604] is too long
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20200630122527.28640-1-festevam@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
Remove the soc unit address to fix the following warnings seen with
'make dt_binding_check':
Documentation/devicetree/bindings/thermal/thermal-sensor.example.dts:22.20-49.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property
Documentation/devicetree/bindings/thermal/thermal-zones.example.dts:23.20-50.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20200630121804.27887-1-festevam@gmail.com
[robh: also fix thermal-zones.yaml example]
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the qoriq thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Rob Herring <robh@kernel.org>
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device (Matthias
Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error handling
(Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC
thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the change
the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace module.h by
export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal driver
(Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the int340x
thermal driver - trivial conflicts fixed (Matthew Garrett)
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Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add the hwmon support on the i.MX SC (Anson Huang)
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device
(Matthias Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error
handling (Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the
TI SoC thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the
change the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit
Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace
module.h by export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal
driver (Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the
int340x thermal driver - trivial conflicts fixed (Matthew Garrett)
* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
thermal/int340x_thermal: Don't require IDSP to exist
thermal/int340x_thermal: Export OEM vendor variables
thermal/int340x_thermal: Export GDDV
thermal: qoriq: Update the settings for TMUv2
thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
thermal: qoriq: Add platform dependencies
drivers: thermal: tsens: Merge tsens-common.c into tsens.c
thermal/of: Rename of-thermal.c
thermal/governors: Prefix all source files with gov_
thermal/drivers/user_space: Sort headers alphabetically
thermal/drivers/of-thermal: Sort headers alphabetically
thermal/drivers/cpufreq_cooling: Replace module.h with export.h
thermal/drivers/cpufreq_cooling: Sort headers alphabetically
thermal/drivers/clock_cooling: Include export.h
thermal/drivers/clock_cooling: Sort headers alphabetically
thermal/drivers/thermal_hwmon: Include export.h
thermal/drivers/thermal_hwmon: Sort headers alphabetically
thermal/drivers/thermal_helpers: Include export.h
thermal/drivers/thermal_helpers: Sort headers alphabetically
thermal/core: Replace module.h with export.h
...
Another round of 'allOf' removals that came in this cycle.
json-schema versions draft7 and earlier have a weird behavior in that
any keywords combined with a '$ref' are ignored (silently). The correct
form was to put a '$ref' under an 'allOf'. This behavior is now changed
in the 2019-09 json-schema spec and '$ref' can be mixed with other
keywords. The json-schema library doesn't yet support this, but the
tooling now does a fixup for this and either way works.
This has been a constant source of review comments, so let's change this
treewide so everyone copies the simpler syntax.
Signed-off-by: Rob Herring <robh@kernel.org>
Add thermal sensor support for r8a7742 SoC. The Renesas RZ/G1H
(r8a7742) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Marian-Cristian Rotariu <marian-cristian.rotariu.rb@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the i.MX thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Rob Herring <robh@kernel.org>
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The thermal-zone binding is a software abstraction to capture the
properties of each zone - how often they should be checked, the
temperature thresholds (trips) at which mitigation actions need to be
taken and the level of mitigation needed at those thresholds.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/44e5c68bc654ccaf88945f70dc875fa186dd1480.1585748882.git.amit.kucheria@linaro.org
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The property #cooling-cells is required in each device that acts as a
cooling device - whether active or passive. So any device that can
throttle its performance to passively reduce heat dissipation (e.g.
CPUs, GPUs) and any device that can actively dissipate heat at different
levels (e.g. fans) will contain this property.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/7a9ead7fb67585fb70ab3ffd481e7d567e96970e.1585748882.git.amit.kucheria@linaro.org
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The property #thermal-sensor-cells is required in each device that acts
as a thermal sensor. It is used to uniquely identify the instance of the
thermal sensor inside the system.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/a91b5603caea5b8854cc9f5325448e4c7228c328.1585748882.git.amit.kucheria@linaro.org
Some devices are not able to cool down by reducing their voltage /
frequency because it could be not available or the system does not
allow voltage scaling. In this configuration, it is not possible to
use this strategy and the idle injection cooling device can be used
instead.
One idle cooling device is now present for the CPU as implemented by
the combination of the idle injection framework belonging to the power
capping framework and the thermal cooling device. The missing part is
the DT binding providing a way to describe how the cooling device will
work on the system.
A first iteration was done by making the cooling device to point to
the idle state. Unfortunately it does not make sense because it would
need to duplicate the idle state description for each CPU in order to
have a different phandle and make the thermal internal framework
happy.
It was proposed to add an cooling-cells to <3>, unfortunately the
thermal framework is expecting a value of <2> as stated by the
documentation and it is not possible from the cooling device generic
code to loop this third value to the back end cooling device.
Another proposal was to add a child 'thermal-idle' node as the SCMI
does. This approach allows to have a self-contained configuration for
the idle cooling device without colliding with the cpufreq cooling
device which is based on the CPU node. In addition, it allows to have
the cpufreq cooling device and the idle cooling device to co-exist
together as shown in the example.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200429103644.5492-2-daniel.lezcano@linaro.org
The examples template is a 'simple-bus' with a size of 1 cell for
had between 2 and 4 cells which really only errors on I2C or SPI type
devices with a single cell.
The easiest fix in most cases is to change the 'reg' property to for 1 cell
address and size. In some cases with child devices having 2 cells, that
doesn't make sense so a bus node is needed.
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the i.MX8MM thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Rob Herring <robh@kernel.org>
json-schema versions draft7 and earlier have a weird behavior in that
any keywords combined with a '$ref' are ignored (silently). The correct
form was to put a '$ref' under an 'allOf'. This behavior is now changed
in the 2019-09 json-schema spec and '$ref' can be mixed with other
keywords. The json-schema library doesn't yet support this, but the
tooling now does a fixup for this and either way works.
This has been a constant source of review comments, so let's change this
treewide so everyone copies the simpler syntax.
Scripted with ruamel.yaml with some manual fixups. Some minor whitespace
changes from the script.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Maxime Ripard <mripard@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Acked-by: Wolfram Sang <wsa@the-dreams.de> # for I2C
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio
Reviewed-by: Stephen Boyd <sboyd@kernel.org> # clock
Signed-off-by: Rob Herring <robh@kernel.org>
Fix various inconsistencies in schema indentation. Most of these are
list indentation which should be 2 spaces more than the start of the
enclosing keyword. This doesn't matter functionally, but affects running
scripts which do transforms on the schema files.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Maxime Ripard <mripard@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Signed-off-by: Rob Herring <robh@kernel.org>
Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 AM654 supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-2-j-keerthy@ti.com
- Add interrupt support on the rcar sensor (Niklas Söderlund)
- Add a new Spreadtrum thermal driver (Baolin Wang)
- Add thermal binding for the fsl scu board, a new API to retrieve the
sensor id bound to the thermal zone and i.MX system controller
sensor (Anson Huang))
- Remove warning log when a deferred probe is requested on Exynos
(Marek Szyprowski)
- Add the thermal monitoring unit support for imx8mm with its DT
bindings (Anson Huang)
- Rephrase the Kconfig text for clarity (Linus Walleij)
- Use the gpio descriptor for the ti-soc-thermal (Linus Walleij)
- Align msg structure to 4 bytes for i.MX SC, fix the Kconfig
dependency, add the __may_be unused annotation for PM functions and
the COMPILE_TEST option for imx8mm (Anson Huang)
- Fix a dependency on regmap in Kconfig for qoriq (Yuantian Tang)
- Add DT binding and support for the rcar gen3 r8a77961 and improve
the error path on the rcar init function (Niklas Söderlund)
- Cleanup and improvements for the tsens Qcom sensor (Amit Kucheria)
- Improve code by removing lock and caching values in the rcar thermal
sensor (Niklas Söderlund)
- Cleanup in the qoriq drivers and add a call to
imx_thermal_unregister_legacy_cooling in the removal function (Anson
Huang)
- Remove redundant 'maxItems' in tsens and sprd DT bindings (Rob Herring)
- Change the thermal DT bindings by making the cooling-maps optional
(Yuantian Tang)
- Add Tiger Lake support (Sumeet Pawnikar)
- Use scnprintf() for avoiding potential buffer overflow (Takashi Iwai)
- Make pkg_temp_lock a raw_spinlock_t(Clark Williams)
- Fix incorrect data types by changing them to signed on i.MX SC (Anson Huang)
- Replace zero-length array with flexible-array member (Gustavo A. R. Silva)
- Add support for i.MX8MP in the driver and in the DT bindings (Anson Huang)
- Fix return value of the cpufreq_set_cur_state() function (Willy Wolff)
- Remove abusing and scary WARN_ON in the cpufreq cooling device
(Daniel Lezcano)
- Fix build warning of incorrect argument type reported by sparse on
imx8mm (Anson Huang)
- Fix stub for the devfreq cooling device (Martin Blumenstingl)
- Fix cpu idle cooling documentation (Sergey Vidishev)
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Merge tag 'thermal-v5.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Convert tsens configuration DT binding to yaml (Rajeshwari)
- Add interrupt support on the rcar sensor (Niklas Söderlund)
- Add a new Spreadtrum thermal driver (Baolin Wang)
- Add thermal binding for the fsl scu board, a new API to retrieve the
sensor id bound to the thermal zone and i.MX system controller sensor
(Anson Huang))
- Remove warning log when a deferred probe is requested on Exynos
(Marek Szyprowski)
- Add the thermal monitoring unit support for imx8mm with its DT
bindings (Anson Huang)
- Rephrase the Kconfig text for clarity (Linus Walleij)
- Use the gpio descriptor for the ti-soc-thermal (Linus Walleij)
- Align msg structure to 4 bytes for i.MX SC, fix the Kconfig
dependency, add the __may_be unused annotation for PM functions and
the COMPILE_TEST option for imx8mm (Anson Huang)
- Fix a dependency on regmap in Kconfig for qoriq (Yuantian Tang)
- Add DT binding and support for the rcar gen3 r8a77961 and improve the
error path on the rcar init function (Niklas Söderlund)
- Cleanup and improvements for the tsens Qcom sensor (Amit Kucheria)
- Improve code by removing lock and caching values in the rcar thermal
sensor (Niklas Söderlund)
- Cleanup in the qoriq drivers and add a call to
imx_thermal_unregister_legacy_cooling in the removal function (Anson
Huang)
- Remove redundant 'maxItems' in tsens and sprd DT bindings (Rob
Herring)
- Change the thermal DT bindings by making the cooling-maps optional
(Yuantian Tang)
- Add Tiger Lake support (Sumeet Pawnikar)
- Use scnprintf() for avoiding potential buffer overflow (Takashi Iwai)
- Make pkg_temp_lock a raw_spinlock_t(Clark Williams)
- Fix incorrect data types by changing them to signed on i.MX SC (Anson
Huang)
- Replace zero-length array with flexible-array member (Gustavo A. R.
Silva)
- Add support for i.MX8MP in the driver and in the DT bindings (Anson
Huang)
- Fix return value of the cpufreq_set_cur_state() function (Willy
Wolff)
- Remove abusing and scary WARN_ON in the cpufreq cooling device
(Daniel Lezcano)
- Fix build warning of incorrect argument type reported by sparse on
imx8mm (Anson Huang)
- Fix stub for the devfreq cooling device (Martin Blumenstingl)
- Fix cpu idle cooling documentation (Sergey Vidishev)
* tag 'thermal-v5.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (52 commits)
Documentation: cpu-idle-cooling: Fix diagram for 33% duty cycle
thermal: devfreq_cooling: inline all stubs for CONFIG_DEVFREQ_THERMAL=n
thermal: imx8mm: Fix build warning of incorrect argument type
thermal/drivers/cpufreq_cooling: Remove abusing WARN_ON
thermal/drivers/cpufreq_cooling: Fix return of cpufreq_set_cur_state
thermal: imx8mm: Add i.MX8MP support
dt-bindings: thermal: imx8mm-thermal: Add support for i.MX8MP
thermal: qcom: tsens.h: Replace zero-length array with flexible-array member
thermal: imx_sc_thermal: Fix incorrect data type
thermal: int340x_thermal: Use scnprintf() for avoiding potential buffer overflow
thermal: int340x: processor_thermal: Add Tiger Lake support
thermal/x86_pkg_temp: Make pkg_temp_lock a raw_spinlock_t
dt-bindings: thermal: make cooling-maps property optional
dt-bindings: thermal: qcom-tsens: Remove redundant 'maxItems'
dt-bindings: thermal: sprd: Remove redundant 'maxItems'
thermal: imx: Calling imx_thermal_unregister_legacy_cooling() in .remove
thermal: qoriq: Sort includes alphabetically
thermal: qoriq: Use devm_add_action_or_reset() to handle all cleanups
thermal: rcar_thermal: Remove lock in rcar_thermal_get_current_temp()
thermal: rcar_thermal: Do not store ctemp in rcar_thermal_priv
...
Ensure the node only contains the properties listed in the schema by
setting 'additionalProperties: false'. Doing this requires reworking the
interrupt properties schemas so that they are defined in the main
'properties' section.
Fixes: a877e768f6 ("dt-bindings: thermal: tsens: Convert over to a yaml schema")
Cc: Andy Gross <agross@kernel.org>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Amit Kucheria <amit.kucheria@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
There's a typo 'nvmem-cells-names' in the schema which means the correct
'nvmem-cell-names' in the examples are not checked. The possible values
are wrong too both in that the 2nd entry is not specified correctly and the
values are just wrong based on the dts files in the kernel.
Fixes: a877e768f6 ("dt-bindings: thermal: tsens: Convert over to a yaml schema")
Cc: Andy Gross <agross@kernel.org>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Amit Kucheria <amit.kucheria@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Setting 'additionalProperties: false' is frequently omitted, but is
important in order to check that there aren't extra undocumented
properties in a binding.
Ideally, we'd just add this automatically and make this the default, but
there's some cases where it doesn't work. For example, if a common
schema is referenced, then properties in the common schema aren't part
of what's considered for 'additionalProperties'. Also, sometimes there
are bus specific properties such as 'spi-max-frequency' that go into
bus child nodes, but aren't defined in the child node's schema.
So let's stick with the json-schema defined default and add
'additionalProperties: false' where needed. This will be a continual
review comment and game of wack-a-mole.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Alexandru Ardelean <alexandru.ardelean@analog.com>
Reviewed-by: Benjamin Gaignard <benjamin.gaignard@st.com>
Acked-by: Stephen Boyd <sboyd@kernel.org> # clock
Acked-by: Lee Jones <lee.jones@linaro.org>
Numerous schemas are missing 'additionalProperties: false' statements which
ensures a binding doesn't have any extra undocumented properties or child
nodes. Fixing this reveals various missing properties, so let's fix all
those occurrences.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Acked-by: Alexandru Ardelean <alexandru.ardelean@analog.com>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio
Acked-by: Stephen Boyd <sboyd@kernel.org> # clock
Acked-by: Lee Jones <lee.jones@linaro.org>
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Cc: dri-devel@lists.freedesktop.org
Cc: netdev@vger.kernel.org
Cc: Guillaume La Roque <glaroque@baylibre.com>
Cc: linux-arm-kernel@lists.infradead.org
Cc: Mark Brown <broonie@kernel.org>
Cc: linux-iio@vger.kernel.org
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: linux-clk@vger.kernel.org
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: Kevin Hilman <khilman@baylibre.com>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: Hartmut Knaack <knaack.h@gmx.de>
Cc: Peter Meerwald-Stadler <pmeerw@pmeerw.net>
Cc: linux-amlogic@lists.infradead.org
Cc: linux-pm@vger.kernel.org
Cc: Masahiro Yamada <yamada.masahiro@socionext.com>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Liam Girdwood <lgirdwood@gmail.com>
Cc: Mauro Carvalho Chehab <mchehab@kernel.org>
Cc: linux-gpio@vger.kernel.org
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-media@vger.kernel.org
Cc: Lee Jones <lee.jones@linaro.org>
Cooling-maps doesn't have to be a required property because there may
be no cooling device on system, or there are no enough cooling devices for
each thermal zone in multiple thermal zone cases since cooling devices
can't be shared.
So make this property optional to remove such limitations.
For thermal zones with no cooling-maps, there could be critic trips
that can trigger CPU reset or shutdown. So they still can take actions.
Signed-off-by: Yuantian Tang <andy.tang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200309045411.21859-1-andy.tang@nxp.com
There's no need to specify 'maxItems' with the same value as the number
of entries in 'items'. A meta-schema update will catch future cases.
Cc: Andy Gross <agross@kernel.org>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Amit Kucheria <amit.kucheria@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200313214552.845-2-robh@kernel.org
There's no need to specify 'maxItems' with the same value as the number
of entries in 'items'. A meta-schema update will catch future cases.
Cc: Orson Zhai <orsonzhai@gmail.com>
Cc: Baolin Wang <baolin.wang7@gmail.com>
Cc: Chunyan Zhang <zhang.lyra@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amit.kucheria@verdurent.com>
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200313214552.845-1-robh@kernel.org
Several DT references got broken due to txt->yaml conversion.
Those are auto-fixed by running:
scripts/documentation-file-ref-check --fix
Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org>
Acked-by: Andrew Jeffery <andrew@aj.id.au>
Reviewed-by: Dan Murphy <dmurphy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Drop the reg property since this only necessary for the parent and
add the missing thermal-sensor-cells property description.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Fixes: 37e9cc08e9678 ("dt-bindings: Add Broadcom AVS RO thermal")
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1579200077-17496-1-git-send-email-stefan.wahren@i2se.com
BCM7216 is a 16nm process STB chip, which requires a different
compatible string to differentiate different temperature formulas.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-4-f.fainelli@gmail.com
Since the BCM2711 doesn't have a AVS TMON block, the thermal information
must be retrieved from the AVS ring oscillator block. This block is part
of the AVS monitor which contains a bunch of raw sensors.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-2-git-send-email-stefan.wahren@i2se.com
sun8i-thermal driver supports thermal sensor in wide range of Allwinner
SoCs. Add YAML schema for its bindings.
Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-3-anarsoul@gmail.com
Pull thermal management updates from Zhang Rui:
- Fix a deadlock regression in thermal core framework, which was
introduced in 5.3 (Wei Wang)
- Initialize thermal control framework earlier to enable thermal
mitigation during boot (Amit Kucheria)
- Convert the Intelligent Power Allocator (IPA) thermal governor to
follow the generic PM_EM instead of its own Energy Model (Quentin
Perret)
- Introduce a new Amlogic soc thermal driver (Guillaume La Roque)
- Add interrupt support for tsens thermal driver (Amit Kucheria)
- Add support for MSM8956/8976 in tsens thermal driver
(AngeloGioacchino Del Regno)
- Add support for r8a774b1 in rcar thermal driver (Biju Das)
- Add support for Thermal Monitor Unit v2 in qoriq thermal driver
(Yuantian Tang)
- Some other fixes/cleanups on thermal core framework and soc thermal
drivers (Colin Ian King, Daniel Lezcano, Hsin-Yi Wang, Tian Tao)
* 'thermal/next' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (32 commits)
thermal: Fix deadlock in thermal thermal_zone_device_check
thermal: cpu_cooling: Migrate to using the EM framework
thermal: cpu_cooling: Make the power-related code depend on IPA
PM / EM: Declare EM data types unconditionally
arm64: defconfig: Enable CONFIG_ENERGY_MODEL
drivers: thermal: tsens: fix potential integer overflow on multiply
thermal: cpu_cooling: Reorder the header file
thermal: cpu_cooling: Remove pointless dependency on CONFIG_OF
thermal: no need to set .owner when using module_platform_driver
thermal: qcom: tsens-v1: Fix kfree of a non-pointer value
cpufreq: qcom-hw: Move driver initialization earlier
clk: qcom: Initialize clock drivers earlier
cpufreq: Initialize cpufreq-dt driver earlier
cpufreq: Initialize the governors in core_initcall
thermal: Initialize thermal subsystem earlier
thermal: Remove netlink support
dt: thermal: tsens: Document compatible for MSM8976/56
thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976
MAINTAINERS: add entry for Amlogic Thermal driver
thermal: amlogic: Add thermal driver to support G12 SoCs
...
Support for MSM8976 and MSM8956 (having tsens ip version 1) has
been added to the qcom tsens driver: document the addition here.
Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191005104133.30297-3-kholk11@gmail.com
Adding the devicetree binding documentation for the Amlogic temperature
sensor found in the Amlogic Meson G12A and G12B SoCs.
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-2-glaroque@baylibre.com
Older IP only supports the 'uplow' interrupt, but newer IP supports
'uplow' and 'critical' interrupts. Document interrupt support in the
tsens driver by converting over to a YAML schema.
Suggested-by: Stephen Boyd <swboyd@chromium.org>
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/d519be4c7198f47c3661f7326d1a724b97dc4973.1572526427.git.amit.kucheria@linaro.org
Convert the STM32 thermal binding to DT schema format using json-schema
Signed-off-by: Benjamin Gaignard <benjamin.gaignard@st.com>
Signed-off-by: Rob Herring <robh@kernel.org>
Some platforms like i.MX8M series SoCs have clock control for TMU,
add optional clocks property to the binding doc.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add a new compatible for thermal founding on PX30 SoCs.
Signed-off-by: Elaine Zhang <zhangqing@rock-chips.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
qcs404 uses v1 of the TSENS IP block. Create a fallback DT property
"qcom,tsens-v1" to gather common code
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add OC HW throttle configuration for soctherm in DT.
It is used to describe the OCx throttle events.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add optional property "nvidia,thermtrips".
If present, these trips will be used as HW shutdown trips,
and critical trips will be used as SW shutdown trips.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch adds binding document for mt8183 thermal controller.
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal controller implementation on Tegra194 is very similar to the
implementation on Tegra186. Add a compatible string for the new
generation.
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
RZ/G2M also has 3 interrupts routed to the TSC, but the list was not
updated to reflect this.
Just drop the list, as this is the case for this TSC variant in all
R-Car Gen3 and RZ/G2 SoCs.
Fixes: be6af481f3 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a774a1 support")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Pull thermal SoC updates from Eduardo Valentin:
"Several new things coming up. Specifics:
- Rework of tsens and hisi thermal drivers
- OF-thermal now allows sharing multiple cooling devices on maps
- Added support for r8a7744 and R8A77970 on rcar thermal driver
- Added support for r8a774a1 on rcar_gen3 thermal driver
- New thermal driver stm32
- Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada,
qcom-spmi, rcar, da9062/61"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits)
thermal: da9062/61: Prevent hardware access during system suspend
thermal: rcar_thermal: Prevent doing work after unbind
thermal: rcar_thermal: Prevent hardware access during system suspend
thermal: rcar_gen3_thermal: add R8A77980 support
dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings
thermal: add stm32 thermal driver
dt-bindings: stm32-thermal: add binding documentation
thermal: rcar_thermal: add R8A77970 support
dt-bindings: thermal: rcar-thermal: document R8A77970 bindings
thermal: rcar_thermal: fix duplicate IRQ request
dt-bindings: thermal: rcar: Add device tree support for r8a7744
thermal/drivers/hisi: Add the dual clusters sensors for hi3660
thermal/drivers/hisi: Add more sensors channel
thermal/drivers/hisi: Remove pointless irq field
thermal/drivers/hisi: Use platform_get_irq_byname
thermal/drivers/hisi: Replace macro name with relevant sensor location
thermal/drivers/hisi: Add multiple sensors support
thermal/drivers/hisi: Prepare to support multiple sensors
thermal/drivers/hisi: Factor out the probe functions
thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer
...
Document the R-Car V3M (R8A77970) SoC in the Renesas R-Car gen2 thermal
bindings. The hardware is the same as in the R-Car D3 (R8A77995) plus an
extra status register.
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add thermal sensor support for r8a7744 SoC. The Renesas RZ/G1N
(r8a7744) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The current example for a thermal zone isn't very useful as reference
since it would result in a hardware shutdown at 145°C, instead of
allowing the system to try to shutdown gracefully. Without an ADC
channel a maximum of two trip points is useful in practice for this
sensor, with temperatures corresponding to the stage 1 and stage 2
'hardware trip points'. A critical trip point at stage 2 may allow the
system to shutdown before a hardware shutdown at stage 3 kicks in. It
should be noted though that by default the chip performs a 'partial
shutdown' when the temperature reaches stage 2, which may prevent an
orderly shutdown. The 'partial shutdown' can be disabled by software.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The documentation claims that the 'reg' property consists of two values,
the SPMI address and the length of the controller's registers. However
the SPMI bus to which it is added specifies "#size-cells = <0>;". Remove
the controller register length from the documentation of the field and the
example.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Pull thermal management updates from Zhang Rui:
- Add Daniel Lezcano as the reviewer of thermal framework and SoC
driver changes (Daniel Lezcano).
- Fix a bug in intel_dts_soc_thermal driver, which does not translate
IO-APIC GSI (Global System Interrupt) into Linux irq number (Hans de
Goede).
- For device tree bindings, allow cooling devices sharing same trip
point with same contribution value to share cooling map (Viresh
Kumar).
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
dt-bindings: thermal: Allow multiple devices to share cooling map
MAINTAINERS: Add Daniel Lezcano as designated reviewer for thermal
Thermal: Intel SoC DTS: Translate IO-APIC GSI number to linux irq number
Pull thermal management updates from Eduardo Valentin:
- rework tsens driver to add support for tsens-v2 (Amit Kucheria)
- rework armada thermal driver to use syscon and multichannel support
(Miquel Raynal)
- fixes to TI SoC, IMX, Exynos, RCar, and hwmon drivers
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (34 commits)
thermal: armada: fix copy-paste error in armada_thermal_probe()
thermal: rcar_thermal: avoid NULL dereference in absence of IRQ resources
thermal: samsung: Remove Exynos5440 clock handling left-overs
thermal: tsens: Fix negative temperature reporting
thermal: tsens: switch from of_iomap() to devm_ioremap_resource()
thermal: tsens: Rename variable
thermal: tsens: Add generic support for TSENS v2 IP
thermal: tsens: Rename tsens-8996 to tsens-v2 for reuse
thermal: tsens: Add support to split up register address space into two
dt: thermal: tsens: Document the fallback DT property for v2 of TSENS IP
thermal: tsens: Get rid of unused fields in structure
thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info
thermal_hwmon: Sanitize attribute name passed to hwmon
dt-bindings: thermal: armada: add reference to new bindings
dt-bindings: cp110: add the thermal node in the syscon file
dt-bindings: cp110: update documentation since DT de-duplication
dt-bindings: ap806: add the thermal node in the syscon file
dt-bindings: cp110: prepare the syscon file to list other syscons nodes
dt-bindings: ap806: prepare the syscon file to list other syscons nodes
dt-bindings: cp110: rename cp110 syscon file
...
Allow cooling devices sharing same trip point with same contribution
value to share the cooling map as well. Otherwise the same information
will be duplicated for each device sharing the trip point.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
We want to create common code for v2 of the TSENS IP block that is used in
a large number of Qualcomm SoCs. "qcom,tsens-v2" should be able to handle
most of the common functionality start with a common get_temp() function.
It is also necessary to split out the memory regions for the TM and SROT
register banks because their offsets are not constant across SoC families.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Tested-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
New bindings (using a syscon) are available for AP806 and CP110
compatibles. Add a reference to these files from the original
documentation.
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
'interrupt-parent' is often documented as part of define bindings, but
it is really outside the scope of a device binding. It's never required
in a given node as it is often inherited from a parent node. Or it can
be implicit if a parent node is an 'interrupt-controller' node. So
remove it from all the binding files.
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Pull thermal SoC updates from Zhang Rui:
"Thermal SoC management updates:
- imx thermal driver now supports i.MX7 thermal sensor (Anson Huang)
- exynos thermal driver dropped support for exynos 5440 (Krzysztof
Kozlowski)
- rcar_thermal now supports r8a77995 (Yoshihiro Kaneko)
- rcar_gen3_thermal now supports r8a77965 (Niklas Söderlund)
- qcom-spmi-temp-alarm now supports GEN2 PMIC peripherals (David
Collins)
- uniphier thermal now supports UniPhier PXs3 (Kunihiko Hayashi)
- mediatek thermal now supports MT7622 SoC (Sean Wang)
- considerable refactoring of exynos driver (Bartlomiej
Zolnierkiewicz)
- small fixes all over the place on different drivers"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (50 commits)
thermal: qcom: tsens: Allow number of sensors to come from DT
thermal: tegra: soctherm: add const to struct thermal_cooling_device_ops
thermal: exynos: Reduce severity of too early temperature read
thermal: imx: Switch to SPDX identifier
thermal: qcom-spmi-temp-alarm: add support for GEN2 PMIC peripherals
thermal: ti-soc-thermal: fix incorrect entry in omap5430_adc_to_temp[]
thermal: rcar_thermal: add r8a77995 support
dt-bindings: thermal: rcar-thermal: add R8A77995 support
thermal: mediatek: use of_device_get_match_data()
thermal: exynos: remove trip reporting to user-space
thermal: exynos: remove unused defines for Exynos5433
thermal: exynos: cleanup code for enabling threshold interrupts
thermal: exynos: check return values of ->get_trip_[temp, hyst] methods
thermal: exynos: move trips setting to exynos_tmu_initialize()
thermal: exynos: set trips in ascending order in exynos7_tmu_initialize()
thermal: exynos: do not use trips structure directly in ->tmu_initialize
thermal: exynos: add exynos*_tmu_set_[trip,hyst]() helpers
thermal: exynos: move IRQs clearing to exynos_tmu_initialize()
thermal: exynos: clear IRQs later in exynos4412_tmu_initialize()
thermal: exynos: make ->tmu_initialize method void
...
- Sync dtc with upstream version v1.4.6-21-g84e414b0b5bc. This adds new
warnings which are either fixed or disabled by default (enabled with
W=1).
- Validate an untrusted offset in DT overlay function
update_usages_of_a_phandle_reference
- Fix a use after free error of_platform_device_destroy
- Fix an off by 1 string errors in unittest
- Avoid creating a struct device for OPP nodes
- Update DT specific submitting-patches.txt with patch content and
subject requirements.
- Move some bindings to their proper subsystem locations
- Add vendor prefixes for Kaohsiung, SiFive, Avnet, Wi2Wi, Logic PD, and
ArcherMind
- Add documentation for "no-gpio-delays" property in FSI bus GPIO master
- Add compatible for r8a77990 SoC ravb ethernet block
- More wack-a-mole removal of 'status' property in examples
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Merge tag 'devicetree-for-4.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull DeviceTree updates from Rob Herring:
- Sync dtc with upstream version v1.4.6-21-g84e414b0b5bc. This adds new
warnings which are either fixed or disabled by default (enabled with
W=1).
- Validate an untrusted offset in DT overlay function
update_usages_of_a_phandle_reference
- Fix a use after free error of_platform_device_destroy
- Fix an off by 1 string errors in unittest
- Avoid creating a struct device for OPP nodes
- Update DT specific submitting-patches.txt with patch content and
subject requirements.
- Move some bindings to their proper subsystem locations
- Add vendor prefixes for Kaohsiung, SiFive, Avnet, Wi2Wi, Logic PD,
and ArcherMind
- Add documentation for "no-gpio-delays" property in FSI bus GPIO
master
- Add compatible for r8a77990 SoC ravb ethernet block
- More wack-a-mole removal of 'status' property in examples
* tag 'devicetree-for-4.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (25 commits)
dt-bindings: submitting-patches: add guidance on patch content and subject
of: platform: stop accessing invalid dev in of_platform_device_destroy
dt-bindings: net: ravb: Add support for r8a77990 SoC
dt-bindings: Add vendor prefix for ArcherMind
dt-bindings: fsi-master-gpio: Document "no-gpio-delays" property
dt-bindings: Add vendor prefix for Logic PD
of: overlay: validate offset from property fixups
of: unittest: for strings, account for trailing \0 in property length field
drm: rcar-du: disable dtc graph-endpoint warnings on DT overlays
kbuild: disable new dtc graph and unit-address warnings
scripts/dtc: Update to upstream version v1.4.6-21-g84e414b0b5bc
MAINTAINERS: add keyword for devicetree overlay notifiers
dt-bindings: define vendor prefix for Wi2Wi, Inc.
dt-bindings: Add vendor prefix for Avnet, Inc.
dt-bindings: Relocate Tegra20 memory controller bindings
dt-bindings: Add "sifive" vendor prefix
dt-bindings: exynos: move ADC binding to iio/adc/ directory
dt-bindings: powerpc/4xx: move 4xx NDFC and EMAC bindings to subsystem directories
dt-bindings: move various RNG bindings to rng/ directory
dt-bindings: move various timer bindings to timer/ directory
...
For platforms that has multiple copies of the TSENS hardware block it's
necessary to be able to specify the number of sensors per block in DeviceTree.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The Exynos5440 is not actively developed, there are no development
boards available and probably there are no real products with it.
Remove wide-tree support for Exynos5440.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
[b.zolnierkie: ported over driver changes]
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Based on previous work by Ryo Kataoka <ryo.kataoka.wt@renesas.com>.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch adds i.MX7 thermal sensor support, most
of the i.MX7 thermal sensor functions are same with
i.MX6 except the registers offset/layout, so we move
those registers offset/layout definitions to soc data
structure.
i.MX7 uses single calibration data @25C, the calibration
data is located at OCOTP offset 0x4F0, bit[17:9], the
formula is as below:
Tmeas = (Nmeas - n1) + 25; n1 is the fuse value for 25C.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Bai Ping <ping.bai@nxp.com>
Acked-by: Dong Aisheng <aisheng.dong@nxp.com>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add devicetree bindings for MediaTek MT7622 thermal controller
Changes v1 -> v2: add tag from Rob
Signed-off-by: Sean Wang <sean.wang@mediatek.com>
Signed-off-by: Shunli Wang <shunli.wang@mediatek.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The datasheet has been expanded with more registers and the DT files
have been updated with the new size. This change updates the example so
writing new DT files can use the enhanced driver which uses the new
registers.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
[robh: s/have/has/, s/enchanted/enhanced/]
Signed-off-by: Rob Herring <robh@kernel.org>
The "cooling-min-level" and "cooling-max-level" properties are not
parsed by any part of kernel currently and the max cooling state of a
CPU cooling device is found by referring to the cpufreq table instead.
Remove the unused bindings.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Due to the old method has already been marked as deprecated in binding
doc, so obviously it's better to update the example to new bindings
as well.
Cc: Shawn Guo <shawn.guo@linaro.org>
Cc: Leonard Crestez <leonard.crestez@nxp.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Dong Aisheng <aisheng.dong@nxp.com>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Pull thermal management updates from Zhang Rui:
- fix a race condition issue in power allocator governor (Yi Zeng).
- add support for AP806 and CP110 in armada thermal driver, together
with several improvements (Baruch Siach, Miquel Raynal)
- add support for r8z7743 in rcar thermal driver (Biju Das)
- convert thermal core to use new hwmon API to avoid warning (Fabio
Estevam)
- small fixes and cleanups in thermal core and x86_pkg_thermal,
int3400_thermal, hisi_thermal, mtk_thermal and imx_thermal drivers
(Pravin Shedge, Geert Uytterhoeven, Alexey Khoroshilov, Brian Bian,
Matthias Brugger, Nicolin Chen, Uwe Kleine-König)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
thermal: thermal_hwmon: Convert to hwmon_device_register_with_info()
thermal/x86 pkg temp: Remove debugfs_create_u32() casts
thermal: int3400_thermal: fix error handling in int3400_thermal_probe()
thermal/drivers/hisi: Remove bogus const from function return type
thermal: armada: Give meaningful names to the thermal zones
thermal: armada: Wait sensors validity before exiting the init callback
thermal: armada: Change sensors trim default value
thermal: armada: Update Kconfig and module description
thermal: armada: Add support for Armada CP110
thermal: armada: Add support for Armada AP806
thermal: armada: Use real status register name
thermal: armada: Clarify control registers accesses
thermal: armada: Simplify the check of the validity bit
thermal: armada: Use msleep for long delays
dt-bindings: thermal: Describe Armada AP806 and CP110
dt-bindings: thermal: rcar: Add device tree support for r8a7743
thermal: mtk: Cleanup unused defines
thermal: imx: update to new formula according to NXP AN5215
thermal: imx: use consistent style to write temperatures
thermal: imx: improve comments describing algorithm for temp calculation
...
Add compatible strings for AP806 and CP110 that are part of the Armada
8k/7k line of SoCs.
Add a note on the differences in the size of the control area in
different bindings. This is an existing difference between the Armada
375 binding and the other boards already supported. The new AP806 and
CP110 bindings are similar to the existing Armada 375 in this regard.
Signed-off-by: Baruch Siach <baruch@tkos.co.il>
[<miquel.raynal@free-electrons.com>: reword, additional details]
Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add thermal sensor support for r8a7743 SoC. The Renesas RZ/G1M
(r8a7743) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Simon Horman <simon.horman@netronome.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
DT unit addresses should be lower case hex. Fix all the
binding examples.
Converted with the following command from Krzysztof Kozlowski:
sed -e 's/@\([a-fA-F0-9_-]*\) {/@\L\1 {/' -i $(find Documentation/devicetree/bindings -name '*.txt')
Signed-off-by: Rob Herring <robh@kernel.org>
Improve the binding example by removing all the leading 0x to fix the
following dtc warnings:
Warning (unit_address_format): Node /XXX unit name should not have leading "0x"
Converted using the following command:
find Documentation/devicetree/bindings -name "*.txt" -exec sed -i -e 's/([^ ])\@0x([0-9a-f])/$1\@$2/g' {} +
This is a follow up to commit 48c926cd34
Signed-off-by: Mathieu Malaterre <malat@debian.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Pull thermal management updates from Zhang Rui:
- introduce brcmstb AVS TMON thermal driver (Brian Norris)
- add Rockchip RV1108 support in rockchip thermal driver (Rocky Hao)
- major rework on HISI driver plus additional support of hisi3660
(Daniel Lezcano)
- add nvmem-cells binding on imx6sx (Leonard Crestez)
- fix a NULL pointer dereference on ti thermal driver unloading (Tony
Lindgren)
- improve tmon tool to make it easier to cross-compile tmon (Markus
Mayer)
- add Coffee Lake and Cannon Lake support for intel processor and pch
thermal drivers (Srinivas Pandruvada)
- other small fixes and cleanups (Arvind Yadav, Colin Ian King, Allen
Wild, Nicolin Chen, Baruch SiachNiklas Söderlund, Arnd Bergmann)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (44 commits)
thermal: pch: Add Cannon Lake support
thermal: int340x: processor_thermal: Add Coffee Lake support
thermal: int340x: processor_thermal: Add Cannon Lake support
thermal: bxt: remove redundant variable trip
thermal: cpu_cooling: pr_err() strings should end with newlines
thermal: add brcmstb AVS TMON driver
Documentation: devicetree: add binding for Broadcom STB AVS TMON
thermal/drivers/hisi: Add support for hi3660 SoC
thermal/drivers/hisi: Prepare to add support for other hisi platforms
thermal/drivers/hisi: Add platform prefix to function name
thermal/drivers/hisi: Put platform code together
thermal/drivers/qcom-spmi: Use devm_iio_channel_get
thermal/drivers/generic-iio-adc: Switch tz request to devm version
thermal/drivers/step_wise: Fix temperature regulation misbehavior
thermal/drivers/hisi: Use round up step value
thermal/drivers/hisi: Move the clk setup in the corresponding functions
thermal/drivers/hisi: Remove mutex_lock in the code
thermal/drivers/hisi: Remove thermal data back pointer
thermal/drivers/hisi: Convert long to int
thermal/drivers/hisi: Rename and remove unused field
...
Add a new compatible for thermal founding on RV1108 SoCs.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This contains the addition of a clock alias which will be used to fix
the implementation of the SOR1 clock.
Also included are the bindings for the Tegra186 BPMP thermal driver, a
prerequisite for both the driver and device tree changes.
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Merge tag 'tegra-for-4.15-dt-bindings' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux into next/dt
Pull "dt-bindings: Updates for v4.15-rc1" from Thierry Reding:
This contains the addition of a clock alias which will be used to fix
the implementation of the SOR1 clock.
Also included are the bindings for the Tegra186 BPMP thermal driver, a
prerequisite for both the driver and device tree changes.
* tag 'tegra-for-4.15-dt-bindings' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux:
dt-bindings: Add bindings for nvidia,tegra186-bpmp-thermal
dt-bindings: clock: tegra: Add sor1_out clock
In Tegra186, the BPMP (Boot and Power Management Processor) implements
an interface that is used to read system temperatures, including CPU
cluster and GPU temperatures. This binding describes the thermal sensor
that is exposed by BPMP.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.
Signed-off-by: Kevin Wangtao <kevin.wangtao@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
On newer imx SOCs accessing OCOTP directly is wrong because the ocotp
clock needs to be enabled first. Add a binding for accessing the same
values through the imx-ocotp nvmem driver using nvmem-cells. This is
similar to other thermal drivers.
The old binding is preserved for compatibility and because it still
works fine on imx6qdl series chips.
In theory this problem could be solved by adding a reference to the
OCOTP clock instead but it is better to hide such details in a specific
nvmem driver.
Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal updates from Zhang Rui:
- fix resources release in error paths when registering thermal zone.
(Christophe Jaillet)
- introduce a new thermal driver for on-chip PVT (Process, Voltage and
Temperature) monitoring unit implemented on UniPhier SoCs. This
driver supports temperature monitoring and alert function. (Kunihiko
Hayashi)
- Add support for mt2712 chip in the mtk_thermal driver. (Louis Yu)
- Add support for RK3328 SOC in rockchip_thermal driver. (Rocky Hao)
- cleanup a couple of platform thermal drivers to constify
thermal_zone_of_device_ops structures. (Julia Lawall)
- a couple of fixes in int340x and intel_pch_thermal thermal driver.
(Arvind Yadav, Sumeet Pawnikar, Brian Bian, Ed Swierk, Zhang Rui)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (27 commits)
Thermal: int3406_thermal: fix thermal sysfs I/F
thermal: mediatek: minor mtk_thermal.c cleanups
thermal: mediatek: extend calibration data for mt2712 chip
thermal: mediatek: add Mediatek thermal driver for mt2712
dt-bindings: thermal: Add binding document for Mediatek thermal controller
thermal: intel_pch_thermal: Fix enable check on Broadwell-DE
thermal: rockchip: Support the RK3328 SOC in thermal driver
dt-bindings: rockchip-thermal: Support the RK3328 SoC compatible
thermal: bcm2835: constify thermal_zone_of_device_ops structures
thermal: exynos: constify thermal_zone_of_device_ops structures
thermal: zx2967: constify thermal_zone_of_device_ops structures
thermal: rcar_gen3_thermal: constify thermal_zone_of_device_ops structures
thermal: qoriq: constify thermal_zone_of_device_ops structures
thermal: hisilicon: constify thermal_zone_of_device_ops structures
thermal: core: Fix resources release in error paths in thermal_zone_device_register()
thermal: core: Use the new 'thermal_zone_destroy_device_groups()' helper function
thermal: core: Add some new helper functions to free resources
thermal: int3400_thermal: process "thermal table changed" event
thermal: uniphier: add UniPhier thermal driver
dt-bindings: thermal: add binding documentation for UniPhier thermal monitor
...
Pretty much any node can have a status property, so it doesn't need to
be in examples.
Converted with the following command and removed examples with SoC and
board specific splits:
git grep -l -E 'status.*=.*' Documentation/devicetree/ | xargs sed -i -E '/\sstatus.*=.*"(disabled|ok|okay)/d'
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Rob Herring <robh@kernel.org>
This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2712.
Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
attempt to new compatible for thermal founding on RK3328 SoC.
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add the missing .txt extension to the Broadcom Northstar binding document.
Signed-off-by: Markus Mayer <mmayer@broadcom.com>
Signed-off-by: Rob Herring <robh@kernel.org>
Device tree binding information for DA9062 and DA9061 thermal junction
temperature monitor.
Binding descriptions for the DA9061 and DA9062 thermal TJUNC supervisor
device driver, using a single THERMAL_TRIP_HOT trip-wire and allowing for
a configurable polling period for over-temperature polling.
This patch also adds two examples, one for DA9062 and one for DA9061. The
DA9061 example uses a fall-back compatible string for the DA9062.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This commit documents binding for thermal used in Northstar family SoCs.
There isn't any known Northstar device with active cooling system so DT
example has empty cooling-maps node. There is also no support for CPU
frequency throttling so I put only a critical trip in the example.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a thermal zone in order to make the example complete.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
For different types of SoC the sensor id and endianness may vary.
"#thermal-sensor-cells" is used to provide sensor id information.
"little-endian" property is to tell the endianness of TMU.
Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Scott Wood <scottwood@freescale.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Lots of changes as usual, so I'm trying to be brief here. Most of the
new hardware support has the respective driver changes merged through
other trees or has had it available for a while, so this is where things
come together.
We get a DT descriptions for a couple of new SoCs, all of them variants
of other chips we already support, and usually coming with a new
evaluation board:
- Oxford semiconductor (now Broadcom) OX820 SoC for NAS devices
- Qualcomm MDM9615 LTE baseband
- NXP imx6ull, the latest and smallest i.MX6 application processor variant
- Renesas RZ/G (r8a7743 and r8a7745) application processors
- Rockchip PX3, a variant of the rk3188 chip used in Android tablets
- Rockchip rk1108 single-core application processor
- ST stm32f746 Cortex-M7 based microcontroller
- TI DRA71x automotive processors
These are commercially available consumer platforms we now support:
- Motorola Droid 4 (xt894) mobile phone
- Rikomagic MK808 Android TV stick based on Rockchips rx3066
- Cloud Engines PogoPlug v3 based on OX820
- Various Broadcom based wireless devices:
- Netgear R8500 router
- Tenda AC9 router
- TP-LINK Archer C9 V1
- Luxul XAP-1510 Access point
- Turris Omnia open hardware router based on Armada 385
And a couple of new boards targeted at developers, makers
or industrial integration:
- Macnica Sodia development platform for Altera socfpga (Cyclone V)
- MicroZed board based on Xilinx Zynq FPGA platforms
- TOPEET itop/elite based on exynos4412
- WP8548 MangOH Open Hardware platform for IOT, based on
Qualcomm MDM9615
- NextThing CHIP Pro gadget
- NanoPi M1 development board
- AM571x-IDK industrial board based on TI AM5718
- i.MX6SX UDOO Neo
- Boundary Devices Nitrogen6_SOM2 (i.MX6)
- Engicam i.CoreM6
- Grinn i.MX6UL liteSOM/liteBoard
- Toradex Colibri iMX6 module
Other changes:
- added peripherals on renesas, davinci, stm32f429, uniphier, sti,
mediatek, integrator, at91, imx, vybrid, ls1021a, omap, qualcomm,
mvebu, allwinner, broadcom, exynos, zynq
- Continued fixes for W=1 dtc warnings
- The old STiH415/416 SoC support gets removed, these never made it into
products and have served their purpose in the kernel as a template
for teh newer chips from ST
- The exynos4415 dtsi file is removed as nothing uses it.
- Intel PXA25x can now be booted using devicetree
Conflicts:
arch/arm/boot/dts/r8a*.dtsi: a node was added
the clk tree, keep both sides and watch out for git
dropping the required '};' at the end of each side.
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Merge tag 'armsoc-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc
Pull ARM DT updates from Arnd Bergmann:
"Lots of changes as usual, so I'm trying to be brief here. Most of the
new hardware support has the respective driver changes merged through
other trees or has had it available for a while, so this is where
things come together.
We get a DT descriptions for a couple of new SoCs, all of them
variants of other chips we already support, and usually coming with a
new evaluation board:
- Oxford semiconductor (now Broadcom) OX820 SoC for NAS devices
- Qualcomm MDM9615 LTE baseband
- NXP imx6ull, the latest and smallest i.MX6 application processor variant
- Renesas RZ/G (r8a7743 and r8a7745) application processors
- Rockchip PX3, a variant of the rk3188 chip used in Android tablets
- Rockchip rk1108 single-core application processor
- ST stm32f746 Cortex-M7 based microcontroller
- TI DRA71x automotive processors
These are commercially available consumer platforms we now support:
- Motorola Droid 4 (xt894) mobile phone
- Rikomagic MK808 Android TV stick based on Rockchips rx3066
- Cloud Engines PogoPlug v3 based on OX820
- Various Broadcom based wireless devices:
- Netgear R8500 router
- Tenda AC9 router
- TP-LINK Archer C9 V1
- Luxul XAP-1510 Access point
- Turris Omnia open hardware router based on Armada 385
And a couple of new boards targeted at developers, makers or
industrial integration:
- Macnica Sodia development platform for Altera socfpga (Cyclone V)
- MicroZed board based on Xilinx Zynq FPGA platforms
- TOPEET itop/elite based on exynos4412
- WP8548 MangOH Open Hardware platform for IOT, based on Qualcomm MDM9615
- NextThing CHIP Pro gadget
- NanoPi M1 development board
- AM571x-IDK industrial board based on TI AM5718
- i.MX6SX UDOO Neo
- Boundary Devices Nitrogen6_SOM2 (i.MX6)
- Engicam i.CoreM6
- Grinn i.MX6UL liteSOM/liteBoard
- Toradex Colibri iMX6 module
Other changes:
- added peripherals on renesas, davinci, stm32f429, uniphier, sti,
mediatek, integrator, at91, imx, vybrid, ls1021a, omap, qualcomm,
mvebu, allwinner, broadcom, exynos, zynq
- Continued fixes for W=1 dtc warnings
- The old STiH415/416 SoC support gets removed, these never made it
into products and have served their purpose in the kernel as a
template for teh newer chips from ST
- The exynos4415 dtsi file is removed as nothing uses it.
- Intel PXA25x can now be booted using devicetree"
* tag 'armsoc-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (422 commits)
arm: dts: zynq: Add MicroZed board support
ARM: dts: da850: enable high speed for mmc
ARM: dts: da850: Add node for pullup/pulldown pinconf
ARM: dts: da850: enable memctrl and mstpri nodes per board
ARM: dts: da850-lcdk: Add ethernet0 alias to DT
ARM: dts: artpec: add pcie support
ARM: dts: add support for Turris Omnia
devicetree: Add vendor prefix for CZ.NIC
ARM: dts: berlin2q-marvell-dmp: fix typo in chosen node
ARM: dts: berlin2q-marvell-dmp: fix regulators' name
ARM: dts: Add xo to sdhc clock node on qcom platforms
ARM: dts: r8a7794: Add device node for PRR
ARM: dts: r8a7793: Add device node for PRR
ARM: dts: r8a7792: Add device node for PRR
ARM: dts: r8a7791: Add device node for PRR
ARM: dts: r8a7790: Add device node for PRR
ARM: dts: r8a7779: Add device node for PRR
ARM: dts: r8a73a4: Add device node for PRR
ARM: dts: sk-rzg1e: add Ether support
ARM: dts: sk-rzg1e: initial device tree
...
please pull the following:
- Rafal adds support for the Netgear R8500 routers, adds basic support
for the Tenda AC9 router which uses the new BCM53573 SoC (single core Cortex
A7). He also enables the UART on the Netgear R8000 and restructures the
include files a bit for the BCM47094 SoC, finally he adds USB 3.0 PHY nodes
which enables USB 3.0 on BCM5301X devices that support it. Finally he adds
support for the TP-LINK Archer C9 V1 router.
- Kamal adds support for the QSPI controller on the Northstar Plus SoCs and updates
the bcm958625k reference board to have it enabled
- Dan adds support for the Luxul XAP-1510 (using a BCM4708) and XWR-3100 (using
a BCM47094)
- Scott fixes the pinctrl names in the Cygnus DTS files
- Jonathan enables the Broadcom iProc mailbox controller for Broadcom Cygnus/iProc
SoCs, he adds interrupt support for the GPIO CRMU hardware block and finally adds
the node for the OTP controller found on Cygnus SoCs
- Dhananjay enables the GPIO B controller on Norstarh Plus SoCs
- Eric defines standard pinctrl groups in the BCM2835 GPIO node
- Gerd adds definitions for the pinctrl groups and updates the PWM, I2C and SDHCI nodes
to use their appropriate pinctrl functions
- Linus adds names for the Raspberry Pi GPIO lines based on the datasheet
- Martin adds the DT binding and nodes for the Raspberry Pi firmware thermal block
- Stefan fixes a few typos with respect to the BCM2835 mailbox binding example and
Device Tree nodes he also fixes the Raspberry Pi GPIO lines names and finally
adds names for the Raspberry Zero GPIO lines
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Merge tag 'arm-soc/for-4.10/devicetree' of http://github.com/Broadcom/stblinux into next/dt
Pull "Broadcom devicetree changes for 4.10" from Florian Fainelli:
This pull request contains Broadcom ARM-based SoC Device Tree changes for 4.10,
please pull the following:
- Rafal adds support for the Netgear R8500 routers, adds basic support
for the Tenda AC9 router which uses the new BCM53573 SoC (single core Cortex
A7). He also enables the UART on the Netgear R8000 and restructures the
include files a bit for the BCM47094 SoC, finally he adds USB 3.0 PHY nodes
which enables USB 3.0 on BCM5301X devices that support it. Finally he adds
support for the TP-LINK Archer C9 V1 router.
- Kamal adds support for the QSPI controller on the Northstar Plus SoCs and updates
the bcm958625k reference board to have it enabled
- Dan adds support for the Luxul XAP-1510 (using a BCM4708) and XWR-3100 (using
a BCM47094)
- Scott fixes the pinctrl names in the Cygnus DTS files
- Jonathan enables the Broadcom iProc mailbox controller for Broadcom Cygnus/iProc
SoCs, he adds interrupt support for the GPIO CRMU hardware block and finally adds
the node for the OTP controller found on Cygnus SoCs
- Dhananjay enables the GPIO B controller on Norstarh Plus SoCs
- Eric defines standard pinctrl groups in the BCM2835 GPIO node
- Gerd adds definitions for the pinctrl groups and updates the PWM, I2C and SDHCI nodes
to use their appropriate pinctrl functions
- Linus adds names for the Raspberry Pi GPIO lines based on the datasheet
- Martin adds the DT binding and nodes for the Raspberry Pi firmware thermal block
- Stefan fixes a few typos with respect to the BCM2835 mailbox binding example and
Device Tree nodes he also fixes the Raspberry Pi GPIO lines names and finally
adds names for the Raspberry Zero GPIO lines
* tag 'arm-soc/for-4.10/devicetree' of http://github.com/Broadcom/stblinux: (29 commits)
ARM: bcm2835: Add names for the RPi Zero GPIO lines
ARM: bcm2835: Fix names for the Raspberry Pi GPIO lines
ARM: dts: enable GPIO-b for Broadcom NSP
ARM: BCM5301X: Add DT for TP-LINK Archer C9 V1
ARM: dts: Add node for Broadcom OTP controller driver
ARM: dts: Enable interrupt support for cygnus crmu gpio driver
ARM: dts: Enable Broadcom iProc mailbox controller
ARM: bcm2835: Add names for the Raspberry Pi GPIO lines
ARM: bcm2835: dts: add thermal node to device-tree of bcm283x
dt: bindings: add thermal device driver for bcm2835
ARM: dts: bcm283x: fix typo in mailbox address
DT: binding: bcm2835-mbox: fix address typo in example
ARM: dts: cygnus: fix naming of pinctrl node
ARM: BCM53573: Specify PMU and its ILP clock in the DT
ARM: BCM5301X: Add DT for Luxul XWR-3100
ARM: BCM5301X: Add DT for Luxul XAP-1510
ARM: BCM5301X: Specify USB 3.0 PHY in DT
ARM: BCM5301X: Enable UART on Netgear R8000
ARM: BCM5301X: Add separated DTS include file for BCM47094
ARM: dts: NSP: Add QSPI nodes to NSPI and bcm958625k DTSes
...
"rockchip,hw-tshut-temp", "rockchip,hw-tshut-mode" and
"rockchip,hw-tshut-polarity" are not a required properties
actually as the code could also work by loading the default
settings there. So it is apprently misleading, although we
prefer to get these from DT. And it seems we miss the 'rockchip,grf'
here which should also be an optional property.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Shawn Lin <shawn.lin@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
STiH415/6 SoC's are being removed from the kernel. This
patch removes the compatibles from the dt doc and also
updates the example to a supported platform.
Signed-off-by: Peter Griffin <peter.griffin@linaro.org>
Cc: <rui.zhang@intel.com>
Cc: <edubezval@gmail.com>
Cc: <robh+dt@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Add HW throttle configuration sub-node for soctherm, which
is used to describe the throttle event, and worked as a
cooling device. The "hot" type trip in thermal zone can
be bound to this cooling device, and trigger the throttle
function.
Signed-off-by: Wei Ni <wni@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2701.
Signed-off-by: Dawei Chien <dawei.chien@mediatek.com>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Maxim Semiconductor MAX77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add DT binding document to details out the DT property related
to MAX77620 thermal functionality.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.
Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.
Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
See the thermal code, the obvious typo from my editor.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
- Introduce generic ADC thermal driver, based on OF thermal (Laxman
Dewangan)
- Introduce new thermal driver for Tango chips (Marc Gonzalez)
- Rockchip driver support for RK3399, RK3366, and some fixes (Caesar
Wang, Elaine Zhang and Shawn Lin)
- Add CPU power cooling model to Mediatek thermal driver (Dawei Chien)
- Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin)
- TI thermal driver gained a new maintainer (Keerthy).
- Enabled powerclamp driver by checking CPU feature and package cstate
counter instead of CPU whitelist (Jacob Pan)
- Various fixes on thermal governor, OF thermal, Tegra, and RCAR
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits)
thermal: tango: initialize TEMPSI_CFG
thermal: rockchip: use the usleep_range instead of udelay
thermal: rockchip: add the notes for better reading
thermal: rockchip: Support RK3366 SoCs in the thermal driver
thermal: rockchip: handle the power sequence for tsadc controller
thermal: rockchip: update the tsadc table for rk3399
thermal: rockchip: fixes the code_to_temp for tsadc driver
thermal: rockchip: disable thermal->clk in err case
thermal: tegra: add Tegra132 specific SOC_THERM driver
thermal: fix ptr_ret.cocci warnings
thermal: mediatek: Add cpu dynamic power cooling model.
thermal: generic-adc: Add ADC based thermal sensor driver
thermal: generic-adc: Add DT binding for ADC based thermal sensor
thermal: tegra: fix static checker warning
thermal: tegra: mark PM functions __maybe_unused
thermal: add temperature sensor support for tango SoC
thermal: hisilicon: fix IRQ imbalance enabling
thermal: hisilicon: support to use any sensor
thermal: rcar: Remove binding docs for r8a7794
thermal: tegra: add PM support
...
Sometimes, thermal sensors like NCT thermistors are connected to
the ADC channel. The temperature is read by reading the voltage
across the sensor resistance via ADC and referring the lookup
table for ADC value to temperature.
Add DT binding doc for the ADC based thermal sensor driver to
detail the DT property and provide the example for how to use it.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Acked-by: Rob Herring <rob@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.
This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.
Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The latest information that I have is that there is no thermal IP
block present on the r8a7794 SoC so remove the corresponding binding.
Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The "critical" type trip in thermal zone can be
set to SOC_THERM hardware, it can trigger shut down
or reset event from hardware.
Signed-off-by: Wei Ni <wni@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Device tree binding for NVIDIA Tegra have traditionally carried the
"nvidia," vendor prefix in the filename. A couple of odd ones don't, so
fix them up for consistency.
Also rename existing bindings to reflect the first compatible value that
they document. This wasn't done consistently either.
Acked-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rob Herring <robh@kernel.org>
When Tegra124 support was first merged the unit-addresses of all devices
were listed with a "0," prefix to encode the reg property's second cell.
It turns out that this notation is not correct, and the "," separator is
only used to separate fields in the unit address (such as the device and
function number in PCI devices), not individual cells for addresses
with more than one cell.
Acked-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rob Herring <robh@kernel.org>
The Exynos Thermal Management Unit binding says that the vtmu-supply
is optional but is listed in the required properties section. Add an
optional properties section and move the regulator property there.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Andi Shyti <andi.shyti@samsung.com>
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Document the number of configurable temperature thresholds (for
trip-points in interrupt-driven mode).
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Commit 488c7455d7 ("thermal: exynos: Add the support for Exynos5433
TMU") added new compatible but forgot to update documentation.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT8173 and other SoCs.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Reviewed-by: Daniel Kurtz <djkurtz@chromium.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch enables to use thermal-zone on DT if it was calles as
"renesas,rcar-thermal-gen2".
Previous style (= non thermal-zone) is still supported by
"renesas,rcar-thermal" to keep compatibility for "git bisect".
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
