Allow specifying the exact calibration mode and calibration data as nvmem
cells, rather than specifying just a single calibration data blob.
Note, unlike the vendor kernel the calibration data uses hw_ids rather
than software sensor indices (to match actual tsens usage in
thermal zones).
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-3-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When adding support for msm8976 it was thought that msm8956 would reuse
the same compat. However checking the vendor kernel revealed that these
two platforms use different slope values for calculating the calibration
data.
Add new compatible for the tsens on msm8956 SoC.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the
Qualcomm PMIC Thermal Monitoring ADC. Based on downstream sources, the
new compatible for TM7 differs from older TM5 by allowing configuring
per sensor decimation, time measurement and number of sample averaging -
unlike one configuration per entire device. This was not reflected in
the bindings, therefore comment the new compatible as incomplete as it
might change and its ABI is no stable.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230113090107.18498-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Prior to adding dt-bindings for SoC-dependent controllers, rename the
thermal node and its parent node to the generic names in the example.
And drop a parent node of the thermal-sensor as it is not directly
necessary.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221213082449.2721-7-hayashi.kunihiko@socionext.com
Signed-off-by: Rob Herring <robh@kernel.org>
The Devicetree bindings document does not have to say in the title that
it is a "Devicetree binding" or a "schema", but instead just describe
the hardware.
Manual updates to various binding titles, including capitalizing them.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # opp
Link: https://lore.kernel.org/r/20221216163815.522628-10-krzysztof.kozlowski@linaro.org
[robh: add trivial-devices.yaml and net/can/microchip,mcp251xfd.yaml]
Signed-off-by: Rob Herring <robh@kernel.org>
The Devicetree bindings document does not have to say in the title that
it is a "binding", but instead just describe the hardware.
Drop trailing "bindings" in various forms (also with trailing full
stop):
find Documentation/devicetree/bindings/ -type f -name '*.yaml' \
-not -name 'trivial-devices.yaml' \
-exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \;
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media
Acked-by: Sebastian Reichel <sre@kernel.org> # power
Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq
Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring <robh@kernel.org>
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada).
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong).
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi).
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson).
- Convert generic-adc-thermal to DT schema (Rob Herring).
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy).
- Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel).
- Add support for IPQ8074 in the tsens thermal driver along with the DT
bindings (Robert Marko).
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi).
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut).
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle).
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold).
- Add HWMon support for the imx8mm board (Alexander Stein).
- Remove pointless include from the power allocator governor (Christophe
JAILLET).
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski).
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss).
- Demote error log of thermal zone register to debug in the tsens QCom
driver (Manivannan Sadhasivam).
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof).
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar).
- Fix the irq handler return value in the LMh driver (Bjorn Andersson).
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König).
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Merge tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are updates of assorted thermal drivers, mostly for ARM
platforms, generally isolated and fairly straightforward, and the
recent Intel HFI driver fix for systems without HFI support.
Specifics:
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada)
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido
Schimmel)
- Add support for IPQ8074 in the tsens thermal driver along with the
DT bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add HWMon support for the imx8mm board (Alexander Stein)
- Remove pointless include from the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug in the tsens
QCom driver (Manivannan Sadhasivam)
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof)
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn
Andersson)
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König)"
* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
thermal/drivers/imx_sc_thermal: Drop empty platform remove function
thermal/drivers/qcom/lmh: Fix irq handler return value
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
dt-bindings: thermal: k3-j72xx: elaborate on binding description
thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
thermal/drivers/qcom: Demote error log of thermal zone register to debug
thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
thermal/core/power allocator: Remove a useless include
thermal/drivers/imx8mm: Add hwmon support
thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
thermal/drivers/imx: Add support for loading calibration data from OCOTP
...
The Qualcomm SM8550 platform has three instances of the tsens block,
add a compatible for these instances.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221114-narmstrong-sm8550-upstream-tsens-v1-0-0e169822830f@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The TSU block on the RZ/Five SoC is identical to one found on the RZ/G2UL
SoC. "renesas,r9a07g043-tsu" compatible string will be used on the
RZ/Five SoC so to make this clear, update the comment to include RZ/Five
SoC.
No driver changes are required as generic compatible string
"renesas,rzg2l-tsu" will be used as a fallback on RZ/Five SoC.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20221115121629.1181667-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Only some of TI's J721E SoCs will need a eFuse register range mapped to
determine if they're affected by TI's i2128 erratum. All other SoC will
not need this eFuse range to function properly
Update the bindings for the k3_j72xx_bandgap thermal driver so other
devices will only need two register ranges
Signed-off-by: Bryan Brattlof <bb@ti.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-7-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Elaborate on the function of this device node as well as some of the
properties this node uses.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-6-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Narrow number of interrupts per variants: SC8280XP, SM6350 and SM8450.
The compatibles are already used and described. They only missed the
constraints of number of interrupts.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221116113140.69587-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Document compatible string 'mediatek,mt7986-thermal' for V3 thermal
unit found in MT7986 SoCs.
'mediatek,mt7981-thermal' is also added as it is identical with the
thermal unit of MT7986.
Signed-off-by: Daniel Golle <daniel@makrotopia.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with
calibration values from OCOTP. Document optional phandle to OCOTP nvmem
provider.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Marek Vasut <marex@denx.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it
only uses one IRQ, so tsens v2 compatible cannot be used as the fallback.
We also have to make sure that correct interrupts are set according to
compatibles, so populate interrupt information per compatibles.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-1-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert the 'generic-adc-thermal' binding to DT schema format.
The binding said '#thermal-sensor-cells' should be 1, but all in tree
users are 0 and 1 doesn't make sense for a single channel.
Drop the example's related providers and consumers of the
'generic-adc-thermal' node as the convention is to not have those in
the examples.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221011175235.3191509-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
DT Bindings:
- Various LED binding conversions and clean-ups. Convert the ir-spi-led,
pwm-ir-tx, and gpio-ir-tx LED bindings to schemas. Consistently
reference LED common.yaml or multi-led schemas and disallow undefined
properties.
- Convert IDT 89HPESx, pwm-clock, st,stmipid02, Xilinx PCIe hosts,
and fsl,imx-fb bindings to schema
- Add ata-generic, Broadcom u-boot environment, and dynamic MTD
sub-partitions bindings.
- Make all SPI based displays reference spi-peripheral-props.yaml
- Fix some schema property regex's which should be fixed strings or were
missing start/end anchors
- Remove 'status' in examples, again...
DT Core:
- Fix a possible NULL dereference in overlay functions
- Fix kexec reading 32-bit "linux,initrd-{start,end}" values (which
never worked)
- Add of_address_count() helper to count number of 'reg' entries
- Support .dtso extension for DT overlay source files. Rename staging
and unittest overlay files.
- Update dtc to upstream v1.6.1-63-g55778a03df61
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Merge tag 'devicetree-for-6.2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT Bindings:
- Various LED binding conversions and clean-ups. Convert the
ir-spi-led, pwm-ir-tx, and gpio-ir-tx LED bindings to schemas.
Consistently reference LED common.yaml or multi-led schemas and
disallow undefined properties.
- Convert IDT 89HPESx, pwm-clock, st,stmipid02, Xilinx PCIe hosts,
and fsl,imx-fb bindings to schema
- Add ata-generic, Broadcom u-boot environment, and dynamic MTD
sub-partitions bindings.
- Make all SPI based displays reference spi-peripheral-props.yaml
- Fix some schema property regex's which should be fixed strings or
were missing start/end anchors
- Remove 'status' in examples, again...
DT Core:
- Fix a possible NULL dereference in overlay functions
- Fix kexec reading 32-bit "linux,initrd-{start,end}" values (which
never worked)
- Add of_address_count() helper to count number of 'reg' entries
- Support .dtso extension for DT overlay source files. Rename staging
and unittest overlay files.
- Update dtc to upstream v1.6.1-63-g55778a03df61"
* tag 'devicetree-for-6.2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (42 commits)
dt-bindings: leds: Add missing references to common LED schema
dt-bindings: leds: intel,lgm: Add missing 'led-gpios' property
of: overlay: fix null pointer dereferencing in find_dup_cset_node_entry() and find_dup_cset_prop()
dt-bindings: lcdif: Fix constraints for imx8mp
media: dt-bindings: atmel,isc: Drop unneeded unevaluatedProperties
dt-bindings: Drop Jee Heng Sia
dt-bindings: thermal: cooling-devices: Add missing cache related properties
dt-bindings: leds: irled: ir-spi-led: convert to DT schema
dt-bindings: leds: irled: pwm-ir-tx: convert to DT schema
dt-bindings: leds: irled: gpio-ir-tx: convert to DT schema
dt-bindings: leds: mt6360: rework to match multi-led
dt-bindings: leds: lp55xx: rework to match multi-led
dt-bindings: leds: lp55xx: switch to preferred 'gpios' suffix
dt-bindings: leds: lp55xx: allow label
dt-bindings: leds: use unevaluatedProperties for common.yaml
dt-bindings: thermal: tsens: Add SM6115 compatible
of/kexec: Fix reading 32-bit "linux,initrd-{start,end}" values
dt-bindings: display: Convert fsl,imx-fb.txt to dt-schema
dt-bindings: Add missing start and/or end of line regex anchors
dt-bindings: qcom,pdc: Add missing compatibles
...
The examples' cache nodes are incomplete as 'cache-unified' and
'cache-level' are required cache properties.
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221104162450.1982114-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Document compatible for tsens on Qualcomm SM6115 platform
according to downstream dts it ship v2.4 of IP
Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221130200950.144618-3-a39.skl@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
'cpus' is a common property, and it is now defined in dtschema schemas,
so drop the type references in the tree.
Acked-by: Suzuki K Poulose <suzuki.poulse@arm.com>
Acked-by: Bjorn Andersson <andersson@kernel.org>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20221111212857.4104308-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
The reference by path (&{/cpus/cpu@101/thermal-idle}) in the example causes
an error with new version of dtc:
FATAL ERROR: Can't generate fixup for reference to path &{/cpus/cpu@100/thermal-idle}
This is because the examples are built as an overlay and absolute paths
are not valid as references must be by label. The path was also not
resolvable because, by default, examples are placed under 'example-N'
nodes.
As the example contains top-level nodes, the root node must be explicit for
the example to be extracted as-is. This changes the indentation for the
whole example, but the existing indentation is a mess of of random amounts.
Clean this up to be 4 spaces everywhere.
Link: https://lore.kernel.org/r/20221111162729.3381835-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
As per the new ADC7 architecture used by the Qualcomm PMICs, each PMIC
has the static Slave ID (SID) assigned by default. The primary PMIC
PMK8350 is responsible for collecting the temperature/voltage data from
the slave PMICs and exposing them via it's registers.
For getting the measurements from the slave PMICs, PMK8350 uses the
channel ID encoded with the SID of the relevant PMIC. So far, the
dt-binding for the slave PMIC PM8350 assumed that there will be only
one PM8350 in a system. So it harcoded SID 1 with channel IDs.
But this got changed in platforms such as Lenovo X13s where there are a
couple of PM8350 PMICs available. So to address multiple PM8350s, change
the binding to accept the SID specified by the user and use it for
encoding the channel ID.
It should be noted that, even though the SID is static it is not
globally unique. Only the primary PMIC has the unique SID id 0.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20221103095810.64606-2-manivannan.sadhasivam@linaro.org
DT core:
- Fix node refcounting in of_find_last_cache_level()
- Constify device_node in of_device_compatible_match()
- Fix 'dma-ranges' handling in bus controller nodes
- Fix handling of initrd start > end
- Improve error reporting in of_irq_init()
- Taint kernel on DT unittest running
- Use strscpy instead of strlcpy
- Add a build target, dt_compatible_check, to check for
compatible strings used in kernel sources against compatible strings
in DT schemas.
- Handle DT_SCHEMA_FILES changes when rebuilding
DT bindings:
- LED bindings for MT6370 PMIC
- Convert Mediatek mtk-gce mailbox, MIPS CPU interrupt controller,
mt7621 I2C, virtio,pci-iommu, nxp,tda998x, QCom fastrpc, qcom,pdc,
and arm,versatile-sysreg to DT schema format
- Add nvmem cells to u-boot,env schema
- Add more LED_COLOR_ID definitions
- Require 'opp-table' uses to be a node
- Various schema fixes to match QEMU 'virt' DT usage
- Tree wide dropping of redundant 'Device Tree Binding' in schema titles
- More (unevaluated|additional)Properties fixes in schema child nodes
- Drop various redundant minItems equal to maxItems
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Merge tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Fix node refcounting in of_find_last_cache_level()
- Constify device_node in of_device_compatible_match()
- Fix 'dma-ranges' handling in bus controller nodes
- Fix handling of initrd start > end
- Improve error reporting in of_irq_init()
- Taint kernel on DT unittest running
- Use strscpy instead of strlcpy
- Add a build target, dt_compatible_check, to check for compatible
strings used in kernel sources against compatible strings in DT
schemas.
- Handle DT_SCHEMA_FILES changes when rebuilding
DT bindings:
- LED bindings for MT6370 PMIC
- Convert Mediatek mtk-gce mailbox, MIPS CPU interrupt controller,
mt7621 I2C, virtio,pci-iommu, nxp,tda998x, QCom fastrpc, qcom,pdc,
and arm,versatile-sysreg to DT schema format
- Add nvmem cells to u-boot,env schema
- Add more LED_COLOR_ID definitions
- Require 'opp-table' uses to be a node
- Various schema fixes to match QEMU 'virt' DT usage
- Tree wide dropping of redundant 'Device Tree Binding' in schema
titles
- More (unevaluated|additional)Properties fixes in schema child nodes
- Drop various redundant minItems equal to maxItems"
* tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (62 commits)
of: base: Shift refcount decrement in of_find_last_cache_level()
dt-bindings: leds: Add MediaTek MT6370 flashlight
dt-bindings: leds: mt6370: Add MediaTek MT6370 current sink type LED indicator
dt-bindings: mailbox: Convert mtk-gce to DT schema
of: base: make of_device_compatible_match() accept const device node
of: Fix "dma-ranges" handling for bus controllers
of: fdt: Remove unused struct fdt_scan_status
dt-bindings: display: st,stm32-dsi: Handle data-lanes in DSI port node
dt-bindings: timer: Add power-domains for TI timer-dm on K3
dt: Add a check for undocumented compatible strings in kernel
kbuild: take into account DT_SCHEMA_FILES changes while checking dtbs
dt-bindings: interrupt-controller: migrate MIPS CPU interrupt controller text bindings to YAML
dt-bindings: i2c: migrate mt7621 text bindings to YAML
dt-bindings: power: gpcv2: correct patternProperties
dt-bindings: virtio: Convert virtio,pci-iommu to DT schema
dt-bindings: timer: arm,arch_timer: Allow dual compatible string
dt-bindings: arm: cpus: Add kryo240 compatible
dt-bindings: display: bridge: nxp,tda998x: Convert to json-schema
dt-bindings: nvmem: u-boot,env: add basic NVMEM cells
dt-bindings: remoteproc: qcom,adsp: enforce smd-edge schema
...
When the thermal zone description was converted to yaml schema, the
required 'trips' property was forgotten.
The initial text bindings was describing:
"
[ ... ]
* Thermal zone nodes
The thermal zone node is the node containing all the required info
for describing a thermal zone, including its cooling device bindings. The
thermal zone node must contain, apart from its own properties, one sub-node
containing trip nodes and one sub-node containing all the zone cooling maps.
Required properties:
- polling-delay: The maximum number of milliseconds to wait between polls
Type: unsigned when checking this thermal zone.
Size: one cell
- polling-delay-passive: The maximum number of milliseconds to wait
Type: unsigned between polls when performing passive cooling.
Size: one cell
- thermal-sensors: A list of thermal sensor phandles and sensor specifier
Type: list of used while monitoring the thermal zone.
phandles + sensor
specifier
- trips: A sub-node which is a container of only trip point nodes
Type: sub-node required to describe the thermal zone.
Optional property:
- cooling-maps: A sub-node which is a container of only cooling device
Type: sub-node map nodes, used to describe the relation between trips
and cooling devices.
[ ... ]
"
Now the schema describes:
"
[ ... ]
required:
- polling-delay
- polling-delay-passive
- thermal-sensors
[ ... ]
"
Add the missing 'trips' property in the required properties.
Fixed: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220809085629.509116-3-daniel.lezcano@linaro.org
Bindings:
- Add spi-peripheral-props.yaml references to various SPI device
bindings
- Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm CCN
PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and arm-firmware-suite
bindings to DT schema format
- New bindings for Arm virtual platforms display, Qualcomm IMEM memory
region, Samsung S5PV210 ChipID, EM Microelectronic EM3027 RTC, and
arm,cortex-a78ae
- Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
quanta, and densitron
- Add missing MSI and IOMMU properties to host-generic-pci
- Remove bindings for removed EFM32 platform
- Remove old chosen.txt binding (replaced by schema)
- Treewide add missing type information for properties
- Treewide fixing of typos and its vs. it's in bindings. Its all good
now.
- Drop unnecessary quoting in power related schemas
- Several LED binding updates which didn't get picked up
- Move various bindings to proper directories
DT core code:
- Convert unittest GPIO related tests to use fwnode
- Check ima-kexec-buffer against memory bounds
- Print reserved-memory allocation/reservation failures as errors
- Cleanup early_init_dt_reserve_memory_arch()
- Simplify of_overlay_fdt_apply() tail
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Merge tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- Add spi-peripheral-props.yaml references to various SPI device
bindings
- Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm
CCN PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and
arm-firmware-suite bindings to DT schema format
- New bindings for Arm virtual platforms display, Qualcomm IMEM
memory region, Samsung S5PV210 ChipID, EM Microelectronic EM3027
RTC, and arm,cortex-a78ae
- Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
quanta, and densitron
- Add missing MSI and IOMMU properties to host-generic-pci
- Remove bindings for removed EFM32 platform
- Remove old chosen.txt binding (replaced by schema)
- Treewide add missing type information for properties
- Treewide fixing of typos and its vs. it's in bindings. Its all good
now.
- Drop unnecessary quoting in power related schemas
- Several LED binding updates which didn't get picked up
- Move various bindings to proper directories
DT core code:
- Convert unittest GPIO related tests to use fwnode
- Check ima-kexec-buffer against memory bounds
- Print reserved-memory allocation/reservation failures as errors
- Cleanup early_init_dt_reserve_memory_arch()
- Simplify of_overlay_fdt_apply() tail"
* tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (65 commits)
dt-bindings: mtd: microchip,mchp48l640: use spi-peripheral-props.yaml
dt-bindings: power: supply: drop quotes when not needed
dt-bindings: power: reset: drop quotes when not needed
dt-bindings: power: drop quotes when not needed
dt-bindings: PCI: host-generic-pci: Allow IOMMU and MSI properties
of/fdt: declared return type does not match actual return type
devicetree/bindings: correct possessive "its" typos
dt-bindings: net: convert emac_rockchip.txt to YAML
dt-bindings: eeprom: microchip,93lc46b: move to eeprom directory
dt-bindings: eeprom: at25: use spi-peripheral-props.yaml
dt-bindings: display: use spi-peripheral-props.yaml
dt-bindings: watchdog: qcom,pm8916-wdt: convert to dtschema
dt-bindings: power: reset: qcom,pon: use absolute path to other schema
dt-bindings: iio/dac: adi,ad5766: Add missing type to 'output-range-microvolts'
dt-bindings: power: supply: charger-manager: Add missing type for 'cm-battery-stat'
dt-bindings: panel: raydium,rm67191: Add missing type to 'video-mode'
of/fdt: Clean up early_init_dt_reserve_memory_arch()
dt-bindings: PCI: fsl,imx6q-pcie: Add missing type for 'reset-gpio-active-high'
dt-bindings: rtc: Add EM Microelectronic EM3027 bindings
dt-bindings: rtc: ds1307: Convert to json-schema
...
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to be
used by the different sensors when registering a thermal zone
(Daniel Lezcano).
- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba).
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
Sang).
- Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
Kozlowski).
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano).
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof).
- Fix array underflow in prep_lookup_table (Dan Carpenter).
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun).
- Fix typos in comments detected on sun8i by Coccinelle (Julia
Lawall).
- Fix typos in comments on rzg2l (Biju Das).
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li).
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov).
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer).
- Fix typo in the comments for the 'tmon' tool (Slark Xiao).
- Make the thermal core use ida_alloc()/free() directly instead of
ida_simple_get()/ida_simple_remove() that have been deprecated
(keliu).
- Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal control
driver (Rafael Wysocki).
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Merge tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These start a rework of the handling of trip points in the thermal
core, improve the cpufreq/devfreq cooling device handling, update some
thermal control drivers and the tmon utility and clean up code.
Specifics:
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to
be used by the different sensors when registering a thermal zone
(Daniel Lezcano).
- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba).
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3
(Wolfram Sang).
- Convert the QCom tsens DT binding to the dtsformat format
(Krzysztof Kozlowski).
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano).
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof).
- Fix array underflow in prep_lookup_table (Dan Carpenter).
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun).
- Fix typos in comments detected on sun8i by Coccinelle (Julia
Lawall).
- Fix typos in comments on rzg2l (Biju Das).
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li).
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov).
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer).
- Fix typo in the comments for the 'tmon' tool (Slark Xiao).
- Make the thermal core use ida_alloc()/free() directly instead of
ida_simple_get()/ida_simple_remove() that have been deprecated
(keliu).
- Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal
control driver (Rafael Wysocki)"
* tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits)
thermal/of: Initialize trip points separately
thermal/of: Use thermal trips stored in the thermal zone
thermal/core: Add thermal_trip in thermal_zone
thermal/core: Rename 'trips' to 'num_trips'
thermal/core: Move thermal_set_delay_jiffies to static
thermal/core: Remove unneeded EXPORT_SYMBOLS
thermal/of: Move thermal_trip structure to thermal.h
thermal/of: Remove the device node pointer for thermal_trip
thermal/of: Replace device node match with device node search
thermal/core: Remove duplicate information when an error occurs
thermal/core: Avoid calling ->get_trip_temp() unnecessarily
thermal/tools/tmon: Fix typo 'the the' in comment
thermal/tools/tmon: Include pthread and time headers in tmon.h
thermal/ti-soc-thermal: Fix comment typo
thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
thermal/drivers/u8500: Remove unnecessary print function dev_err()
thermal/drivers/rzg2l: Fix comments
thermal/drivers/sun8i: Fix typo in comment
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
...
global variable, fix comments and rework the trace information
(Lukasz Luba)
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn)
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
Sang)
- Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
Kozlowski)
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano)
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof)
- Fix array underflow in prep_lookup_table (Dan Carpenter)
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun)
- Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall)
- Fix typos in comments on rzg2l (Biju Das)
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li)
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov)
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer)
- Fix typo in the comments for the 'tmon' tool (Slark Xiao)
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to be
used by the different sensors when registering a thermal zone
(Daniel Lezcano)
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Merge tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal control changes for 5.20-rc1 from Daniel Lezcano:
"- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba)
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn)
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
Sang)
- Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
Kozlowski)
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano)
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof)
- Fix array underflow in prep_lookup_table (Dan Carpenter)
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun)
- Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall)
- Fix typos in comments on rzg2l (Biju Das)
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li)
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov)
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer)
- Fix typo in the comments for the 'tmon' tool (Slark Xiao)
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to be
used by the different sensors when registering a thermal zone
(Daniel Lezcano)"
* tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (36 commits)
thermal/of: Initialize trip points separately
thermal/of: Use thermal trips stored in the thermal zone
thermal/core: Add thermal_trip in thermal_zone
thermal/core: Rename 'trips' to 'num_trips'
thermal/core: Move thermal_set_delay_jiffies to static
thermal/core: Remove unneeded EXPORT_SYMBOLS
thermal/of: Move thermal_trip structure to thermal.h
thermal/of: Remove the device node pointer for thermal_trip
thermal/of: Replace device node match with device node search
thermal/core: Remove duplicate information when an error occurs
thermal/core: Avoid calling ->get_trip_temp() unnecessarily
thermal/tools/tmon: Fix typo 'the the' in comment
thermal/tools/tmon: Include pthread and time headers in tmon.h
thermal/ti-soc-thermal: Fix comment typo
thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
thermal/drivers/u8500: Remove unnecessary print function dev_err()
thermal/drivers/rzg2l: Fix comments
thermal/drivers/sun8i: Fix typo in comment
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
...
Add support for R-Car S4. The S4 IP differs a bit from its siblings in
such way that it has 3 out of 4 TSC nodes for Linux and the interrupts
are not routed to the INTC-AP but to the ECM.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220610201701.7946-2-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When handling the V3U/r8a779a0 exception, avoid using 'not:' because
then its subschemas are far away in the 'else:' branch. Keep them
together using positive logic.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220610201701.7946-1-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert the Qualcomm QPNP PMIC Temperature Alarm to DT Schema.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220608112702.80873-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
In order to replace the fsl,scu txt file from bindings/arm/freescale,
we need to split it between the right subsystems. This patch documents
separately the 'thermal' child node of the SCU main node.
Signed-off-by: Abel Vesa <abel.vesa@nxp.com>
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Bindings:
- Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm, qcom,i2c-qup,
qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new props), qcom,smp2p, TI
timer, Mediatek gnss, Mediatek topckgen, Mediatek apmixedsys, Mediatek
infracfg, fsl,ls-extirq, fsl,layerscape-dcfg, QCom PMIC SPMI,
rda,8810pl-timer, Xilinx zynqmp_ipi, uniphier-pcie, and Ilitek
touchscreen controllers
- Convert various Arm Ltd peripheral IP bindings to schemas
- New bindings for Menlo board CPLD, DH electronics board CPLD,
Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751
GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and Microchip/SMSC
LAN95xx USB Ethernet controllers
- Add vendor prefix for Enclustra
- Add various compatible string additions
- Various example fixes and cleanups
- Remove unused hisilicon,hi6220-reset binding
- Treewide fix properties missing type definition
- Drop some empty and unreferenced .txt bindings
- Documentation improvements for writing schemas
DT driver core:
- Drop static IRQ resources for DT platform devices as IRQ setup is
dynamic and drivers have all been converted to use platform_get_irq()
and friends
- Rework memory allocations and frees for overlays
- Continue overlay notifier callbacks on successful calls and add
unittests
- Handle 'interrupts-extended' in early DT IRQ setup
- Fix of_property_read_string() errors to match documentation
- Ignore disabled nodes in FDT API calls
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Merge tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm,
qcom,i2c-qup, qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new
props), qcom,smp2p, TI timer, Mediatek gnss, Mediatek topckgen,
Mediatek apmixedsys, Mediatek infracfg, fsl,ls-extirq,
fsl,layerscape-dcfg, QCom PMIC SPMI, rda,8810pl-timer, Xilinx
zynqmp_ipi, uniphier-pcie, and Ilitek touchscreen controllers
- Convert various Arm Ltd peripheral IP bindings to schemas
- New bindings for Menlo board CPLD, DH electronics board CPLD,
Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751
GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and
Microchip/SMSC LAN95xx USB Ethernet controllers
- Add vendor prefix for Enclustra
- Add various compatible string additions
- Various example fixes and cleanups
- Remove unused hisilicon,hi6220-reset binding
- Treewide fix properties missing type definition
- Drop some empty and unreferenced .txt bindings
- Documentation improvements for writing schemas
DT driver core:
- Drop static IRQ resources for DT platform devices as IRQ setup is
dynamic and drivers have all been converted to use
platform_get_irq() and friends
- Rework memory allocations and frees for overlays
- Continue overlay notifier callbacks on successful calls and add
unittests
- Handle 'interrupts-extended' in early DT IRQ setup
- Fix of_property_read_string() errors to match documentation
- Ignore disabled nodes in FDT API calls"
* tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (86 commits)
of/irq: fix typo in comment
dt-bindings: Fix properties without any type
Revert "dt-bindings: mailbox: qcom-ipcc: add missing properties into example"
dt-bindings: input: touchscreen: ilitek_ts_i2c: Absorb ili2xxx bindings
dt-bindings: timer: samsung,exynos4210-mct: define strict clock order
dt-bindings: timer: samsung,exynos4210-mct: drop unneeded minItems
dt-bindings: timer: cdns,ttc: drop unneeded minItems
dt-bindings: mailbox: zynqmp_ipi: convert to yaml
dt-bindings: usb: ci-hdrc-usb2: fix node node for ethernet controller
dt-bindings: net: add schema for Microchip/SMSC LAN95xx USB Ethernet controllers
dt-bindings: net: add schema for ASIX USB Ethernet controllers
of/fdt: Ignore disabled memory nodes
dt-bindings: arm: fix typos in compatible
dt-bindings: mfd: Add bindings child nodes for the Mediatek MT6360
dt-bindings: display: convert Arm Komeda to DT schema
dt-bindings: display: convert Arm Mali-DP to DT schema
dt-bindings: display: convert Arm HDLCD to DT schema
dt-bindings: display: convert PL110/PL111 to DT schema
dt-bindings: arm: convert vexpress-config to DT schema
dt-bindings: arm: convert vexpress-sysregs to DT schema
...
Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 J72XX supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220517172920.10857-2-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The Qualcomm SC8280XP platform has three instances of the tsens block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220503153436.960184-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add compatible for the LMh blocks found in the Qualcomm sc8180x
platform.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220502164504.3972938-2-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Document RZ/G2UL TSU bindings. The TSU block on RZ/G2UL is identical to one
found on RZ/G2L SoC. No driver changes are required as generic compatible
string "renesas,rzg2l-tsu" will be used as a fallback.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220501081930.23743-1-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add compatibility string for the thermal sensors on MSM8960/APQ8064
platforms.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220406002648.393486-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add documentation for PMIC5 Gen2 ADC_TM peripheral.
It is used for monitoring ADC channel thresholds for PMIC7-type
PMICs. It is present on PMK8350, like PMIC7 ADC and can be used
to monitor up to 8 ADC channels, from any of the PMIC7 PMICs
on a target, through PBS(Programmable Boot Sequence).
Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1648991869-20899-2-git-send-email-quic_jprakash@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Document RZ/V2L TSU bindings. The TSU block on RZ/V2L is identical to one
found on RZ/G2L SoC. No driver changes are required as generic compatible
string "renesas,rzg2l-tsu" will be used as a fallback.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220308212315.4551-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
- Drop unused 'max-link-speed' in Apple PCIe
- More redundant 'maxItems/minItems' schema fixes
- Support values for pinctrl 'drive-push-pull' and 'drive-open-drain'
- Fix redundant 'unevaluatedProperties' in MT6360 LEDs binding
- Add missing 'power-domains' property to Cadence UFSHC
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Merge tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree fixes from Rob Herring:
- Drop unused 'max-link-speed' in Apple PCIe
- More redundant 'maxItems/minItems' schema fixes
- Support values for pinctrl 'drive-push-pull' and 'drive-open-drain'
- Fix redundant 'unevaluatedProperties' in MT6360 LEDs binding
- Add missing 'power-domains' property to Cadence UFSHC
* tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux:
dt-bindings: pci: apple,pcie: Drop max-link-speed from example
dt-bindings: Drop redundant 'maxItems/minItems' in if/then schemas
dt-bindings: pinctrl: Allow values for drive-push-pull and drive-open-drain
dt-bindings: leds-mt6360: Drop redundant 'unevaluatedProperties'
dt-bindings: ufs: cdns,ufshc: Add power-domains
Another round of removing redundant minItems/maxItems when 'items' list is
specified. This time it is in if/then schemas as the meta-schema was
failing to check this case.
If a property has an 'items' list, then a 'minItems' or 'maxItems' with the
same size as the list is redundant and can be dropped. Note that is DT
schema specific behavior and not standard json-schema behavior. The tooling
will fixup the final schema adding any unspecified minItems/maxItems.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # For MMC
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for IIO
Link: https://lore.kernel.org/r/20220503162738.3827041-1-robh@kernel.org
Krzysztof Kozlowski's @canonical.com email stopped working, so switch to
generic @kernel.org account for all Devicetree bindings.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Link: https://lore.kernel.org/r/20220330074016.12896-2-krzysztof.kozlowski@linaro.org
- Add Krzysztof Kozlowski as co-maintainer for DT bindings providing
much needed help.
- DT schema validation now takes DTB files as input rather than
intermediate YAML files. This decouples the validation from the source
level syntax information. There's a bunch of schema fixes as a result
of switching to DTB based validation which exposed some errors
and incomplete schemas and examples.
- Kbuild improvements to explicitly warn users running 'make
dt_binding_check' on missing yamllint
- Expand DT_SCHEMA_FILES kbuild variable to take just a partial filename
or path instead of the full path to 1 file.
- Convert various bindings to schema format: mscc,vsc7514-switch,
multiple GNSS bindings, ahci-platform, i2c-at91, multiple UFS
bindings, cortina,gemini-sata-bridge, cortina,gemini-ethernet, Atmel
SHA, Atmel TDES, Atmel AES, armv7m-systick, Samsung Exynos display
subsystem, nuvoton,npcm7xx-timer, samsung,s3c2410-i2c, zynqmp_dma,
msm/mdp4, rda,8810pl-uart
- New schemas for u-boot environment variable partition, TI clksel
- New compatible strings for Renesas RZ/V2L SoC
- Vendor prefixes for Xen, HPE, deprecated Synopsys, deprecated HiSilicon
- Add/fix schemas for QEMU Arm 'virt' machine
- Drop unused of_alias_get_alias_list() function
- Add a script to check DT unittest EXPECT message output. Pass messages
also now print by default at PR_INFO level to help test automation.
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Merge tag 'devicetree-for-5.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
- Add Krzysztof Kozlowski as co-maintainer for DT bindings providing
much needed help.
- DT schema validation now takes DTB files as input rather than
intermediate YAML files. This decouples the validation from the
source level syntax information. There's a bunch of schema fixes as a
result of switching to DTB based validation which exposed some errors
and incomplete schemas and examples.
- Kbuild improvements to explicitly warn users running 'make
dt_binding_check' on missing yamllint
- Expand DT_SCHEMA_FILES kbuild variable to take just a partial
filename or path instead of the full path to 1 file.
- Convert various bindings to schema format: mscc,vsc7514-switch,
multiple GNSS bindings, ahci-platform, i2c-at91, multiple UFS
bindings, cortina,gemini-sata-bridge, cortina,gemini-ethernet, Atmel
SHA, Atmel TDES, Atmel AES, armv7m-systick, Samsung Exynos display
subsystem, nuvoton,npcm7xx-timer, samsung,s3c2410-i2c, zynqmp_dma,
msm/mdp4, rda,8810pl-uart
- New schemas for u-boot environment variable partition, TI clksel
- New compatible strings for Renesas RZ/V2L SoC
- Vendor prefixes for Xen, HPE, deprecated Synopsys, deprecated
HiSilicon
- Add/fix schemas for QEMU Arm 'virt' machine
- Drop unused of_alias_get_alias_list() function
- Add a script to check DT unittest EXPECT message output. Pass
messages also now print by default at PR_INFO level to help test
automation.
* tag 'devicetree-for-5.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (96 commits)
dt-bindings: kbuild: Make DT_SCHEMA_LINT a recursive variable
dt-bindings: nvmem: add U-Boot environment variables binding
dt-bindings: ufs: qcom: Add SM6350 compatible string
dt-bindings: dmaengine: sifive,fu540-c000: include generic schema
dt-bindings: gpio: pca95xx: drop useless consumer example
Revert "of: base: Introduce of_alias_get_alias_list() to check alias IDs"
dt-bindings: virtio,mmio: Allow setting devices 'dma-coherent'
dt-bindings: gnss: Add two more chips
dt-bindings: gnss: Rewrite sirfstar binding in YAML
dt-bindings: gnss: Modify u-blox to use common bindings
dt-bindings: gnss: Rewrite common bindings in YAML
dt-bindings: ata: ahci-platform: Add rk3568-dwc-ahci compatible
dt-bindings: ata: ahci-platform: Add power-domains property
dt-bindings: ata: ahci-platform: Convert DT bindings to yaml
dt-bindings: kbuild: Use DTB files for validation
dt-bindings: kbuild: Pass DT_SCHEMA_FILES to dt-validate
dt-bindings: Add QEMU virt machine compatible
dt-bindings: arm: Convert QEMU fw-cfg to DT schema
dt-bindings: i2c: at91: Add SAMA7G5 compatible strings list
dt-bindings: i2c: convert i2c-at91 to json-schema
...
Document the compatible string for tsens found in msm8953.
Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220220201909.445468-3-luca@z3ntu.xyz
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert the Samsung Exynos SoC Thermal Management Unit bindings to DT
schema format.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220122132554.65192-2-krzysztof.kozlowski@canonical.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The 'phandle-array' type is a bit ambiguous. It can be either just an
array of phandles or an array of phandles plus args. Many schemas for
phandle-array properties aren't clear in the schema which case applies
though the description usually describes it.
The array of phandles case boils down to needing:
items:
maxItems: 1
The phandle plus args cases should typically take this form:
items:
- items:
- description: A phandle
- description: 1st arg cell
- description: 2nd arg cell
With this change, some examples need updating so that the bracketing of
property values matches the schema.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Acked-by: Vinod Koul <vkoul@kernel.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org>
Acked-by: Georgi Djakov <djakov@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Acked-by: Stephen Boyd <sboyd@kernel.org>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Link: https://lore.kernel.org/r/20220119015038.2433585-1-robh@kernel.org
Bindings:
- DT schema conversions for Samsung clocks, RNG bindings, Qcom Command
DB and rmtfs, gpio-restart, i2c-mux-gpio, i2c-mux-pinctl, Tegra I2C
and BPMP, pwm-vibrator, Arm DSU, and Cadence macb
- DT schema conversions for Broadcom platforms: interrupt controllers,
STB GPIO, STB waketimer, STB reset, iProc MDIO mux, iProc PCIe,
Cygnus PCIe PHY, PWM, USB BDC, BCM6328 LEDs, TMON, SYSTEMPORT, AMAC,
Northstar 2 PCIe PHY, GENET, moca PHY, GISB arbiter, and SATA
- Add binding schemas for Tegra210 EMC table, TI DC-DC converters,
- Clean-ups of MDIO bus schemas to fix 'unevaluatedProperties' issues
- More fixes due to 'unevaluatedProperties' enabling
- Data type fixes and clean-ups of binding examples found in preparation
to move to validating DTB files directly (instead of intermediate YAML
representation.
- Vendor prefixes for T-Head Semiconductor, OnePlus, and Sunplus
- Add various new compatible strings
DT core:
- Silence a warning for overlapping reserved memory regions
- Reimplement unittest overlay tracking
- Fix stack frame size warning in unittest
- Clean-ups of early FDT scanning functions
- Fix handling of "linux,usable-memory-range" on EFI booted systems
- Add support for 'fail' status on CPU nodes
- Improve error message in of_phandle_iterator_next()
- kbuild: Disable duplicate unit-address warnings for disabled nodes
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Merge tag 'devicetree-for-5.17' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- DT schema conversions for Samsung clocks, RNG bindings, Qcom
Command DB and rmtfs, gpio-restart, i2c-mux-gpio, i2c-mux-pinctl,
Tegra I2C and BPMP, pwm-vibrator, Arm DSU, and Cadence macb
- DT schema conversions for Broadcom platforms: interrupt
controllers, STB GPIO, STB waketimer, STB reset, iProc MDIO mux,
iProc PCIe, Cygnus PCIe PHY, PWM, USB BDC, BCM6328 LEDs, TMON,
SYSTEMPORT, AMAC, Northstar 2 PCIe PHY, GENET, moca PHY, GISB
arbiter, and SATA
- Add binding schemas for Tegra210 EMC table, TI DC-DC converters,
- Clean-ups of MDIO bus schemas to fix 'unevaluatedProperties' issues
- More fixes due to 'unevaluatedProperties' enabling
- Data type fixes and clean-ups of binding examples found in
preparation to move to validating DTB files directly (instead of
intermediate YAML representation.
- Vendor prefixes for T-Head Semiconductor, OnePlus, and Sunplus
- Add various new compatible strings
DT core:
- Silence a warning for overlapping reserved memory regions
- Reimplement unittest overlay tracking
- Fix stack frame size warning in unittest
- Clean-ups of early FDT scanning functions
- Fix handling of "linux,usable-memory-range" on EFI booted systems
- Add support for 'fail' status on CPU nodes
- Improve error message in of_phandle_iterator_next()
- kbuild: Disable duplicate unit-address warnings for disabled nodes"
* tag 'devicetree-for-5.17' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (114 commits)
dt-bindings: net: mdio: Drop resets/reset-names child properties
dt-bindings: clock: samsung: convert S5Pv210 to dtschema
dt-bindings: clock: samsung: convert Exynos5410 to dtschema
dt-bindings: clock: samsung: convert Exynos5260 to dtschema
dt-bindings: clock: samsung: extend Exynos7 bindings with UFS
dt-bindings: clock: samsung: convert Exynos7 to dtschema
dt-bindings: clock: samsung: convert Exynos5433 to dtschema
dt-bindings: i2c: maxim,max96712: Add bindings for Maxim Integrated MAX96712
dt-bindings: iio: adi,ltc2983: Fix 64-bit property sizes
dt-bindings: power: maxim,max17040: Fix incorrect type for 'maxim,rcomp'
dt-bindings: interrupt-controller: arm,gic-v3: Fix 'interrupts' cell size in example
dt-bindings: iio/magnetometer: yamaha,yas530: Fix invalid 'interrupts' in example
dt-bindings: clock: imx5: Drop clock consumer node from example
dt-bindings: Drop required 'interrupt-parent'
dt-bindings: net: ti,dp83869: Drop value on boolean 'ti,max-output-impedance'
dt-bindings: net: wireless: mt76: Fix 8-bit property sizes
dt-bindings: PCI: snps,dw-pcie-ep: Drop conflicting 'max-functions' schema
dt-bindings: i2c: st,stm32-i2c: Make each example a separate entry
dt-bindings: net: stm32-dwmac: Make each example a separate entry
dt-bindings: net: Cleanup MDIO node schemas
...
- Add new TSU driver and DT bindings for the Renesas RZ/G2L platform
(Biju Das).
- Fix missing check when calling reset_control_deassert() in the
rz2gl thermal driver (Biju Das).
- In preparation for FORTIFY_SOURCE performing compile-time and
run-time field bounds checking for memcpy(), avoid intentionally
writing across neighboring fields in the int340x thermal control
driver (Kees Cook).
- Fix RFIM mailbox write commands handling in the int340x thermal
control driver (Sumeet Pawnikar).
- Fix PM issue occurring in the iMX thermal control driver during
suspend/resume by implementing PM runtime support in it (Oleksij
Rempel).
- Add 'const' annotation to thermal_cooling_ops in the Intel
powerclamp driver (Rikard Falkeborn).
- Fix missing ADC bit set in the iMX8MP thermal driver to enable the
sensor (Paul Gerber).
- Drop unused local variable definition from tmon (ran jianping).
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Merge tag 'thermal-5.17-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These add a new driver for Renesas RZ/G2L TSU, update a few existing
thermal control drivers and clean up the tmon utility.
Specifics:
- Add new TSU driver and DT bindings for the Renesas RZ/G2L platform
(Biju Das).
- Fix missing check when calling reset_control_deassert() in the
rz2gl thermal driver (Biju Das).
- In preparation for FORTIFY_SOURCE performing compile-time and
run-time field bounds checking for memcpy(), avoid intentionally
writing across neighboring fields in the int340x thermal control
driver (Kees Cook).
- Fix RFIM mailbox write commands handling in the int340x thermal
control driver (Sumeet Pawnikar).
- Fix PM issue occurring in the iMX thermal control driver during
suspend/resume by implementing PM runtime support in it (Oleksij
Rempel).
- Add 'const' annotation to thermal_cooling_ops in the Intel
powerclamp driver (Rikard Falkeborn).
- Fix missing ADC bit set in the iMX8MP thermal driver to enable the
sensor (Paul Gerber).
- Drop unused local variable definition from tmon (ran jianping)"
* tag 'thermal-5.17-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/int340x: Fix RFIM mailbox write commands
thermal/drivers/rz2gl: Add error check for reset_control_deassert()
thermal/drivers/imx8mm: Enable ADC when enabling monitor
thermal/drivers: Add TSU driver for RZ/G2L
dt-bindings: thermal: Document Renesas RZ/G2L TSU
thermal/drivers/intel_powerclamp: Constify static thermal_cooling_device_ops
thermal/drivers/imx: Implement runtime PM support
thermal: tools: tmon: remove unneeded local variable
thermal: int340x: Use struct_group() for memcpy() region
Convert the Tegra186 (and later) BPMP thermal device tree bindings from
the free-form text format to json-schema.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Document the Thermal Sensor Unit(TSU) in the RZ/G2L SoC.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211130155757.17837-2-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When converting the thermal-zones bindings to yaml the definition of the
contribution property changed. The intention is the same, an integer
value expressing a ratio of a sum on how much cooling is provided by the
device to the zone. But after the conversion the integer value is
limited to the range 0 to 100 and expressed as a percentage.
This is problematic for two reasons.
- This do not match how the binding is used. Out of the 18 files that
make use of the property only two (ste-dbx5x0.dtsi and
ste-hrefv60plus.dtsi) sets it at a value that satisfy the binding,
100. The remaining 16 files set the value higher and fail to validate.
- Expressing the value as a percentage instead of a ratio of the sum is
confusing as there is nothing to enforce the sum in the zone is not
greater then 100.
This patch restore the pre yaml conversion description and removes the
value limitation allowing the usage of the bindings to validate.
Fixes: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Reported-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20211109103045.1403686-1-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Rob Herring <robh@kernel.org>
Not all @st.com email address are concerned, only people who have
a specific @foss.st.com email will see their entry updated.
For some people, who left the company, remove their email.
Cc: Alexandre Torgue <alexandre.torgue@foss.st.com>
Cc: Arnaud Pouliquen <arnaud.pouliquen@foss.st.com>
Cc: Fabien Dessenne <fabien.dessenne@foss.st.com>
Cc: Christophe Roullier <christophe.roullier@foss.st.com>
Cc: Gabriel Fernandez <gabriel.fernandez@foss.st.com>
Cc: Lionel Debieve <lionel.debieve@foss.st.com>
Cc: Amelie Delaunay <amelie.delaunay@foss.st.com>
Cc: Pierre-Yves MORDRET <pierre-yves.mordret@foss.st.com>
Cc: Ludovic Barre <ludovic.barre@foss.st.com>
Cc: Christophe Kerello <christophe.kerello@foss.st.com>
Cc: pascal Paillet <p.paillet@foss.st.com>
Cc: Erwan Le Ray <erwan.leray@foss.st.com>
Cc: Philippe CORNU <philippe.cornu@foss.st.com>
Cc: Yannick Fertre <yannick.fertre@foss.st.com>
Cc: Fabrice Gasnier <fabrice.gasnier@foss.st.com>
Cc: Olivier Moysan <olivier.moysan@foss.st.com>
Cc: Hugues Fruchet <hugues.fruchet@foss.st.com>
Signed-off-by: Patrice Chotard <patrice.chotard@foss.st.com>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/r/20211110150144.18272-6-patrice.chotard@foss.st.com
Signed-off-by: Rob Herring <robh@kernel.org>
Remove redundent comments from rockchip-thermal.yaml
Sort compatibles in alphabetical order.
Signed-off-by: Johan Jonker <jbx6244@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930110517.14323-2-jbx6244@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The tsadc node in rk356x.dtsi has more resets defined then currently
allowed by rockchip-thermal.yaml, so fix that in the documentation.
The driver now uses the devm_reset_control_array_get() function,
so reset-names is no longer required, but keep it for legacy reasons.
Signed-off-by: Johan Jonker <jbx6244@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930110517.14323-1-jbx6244@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The HC generation of the ADC Thermal Monitor is quite similar to the 5th
generation, but differs in valid values for a few properties. Create a
new binding for the HC version of the hardware, rather than sprinkle
conditionals throughout the existing binding.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211005032531.2251928-2-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
tegra by adding a dependency on ARCH_TEGRA along with COMPILE_TEST
(Dmitry Osipenko)
- Fix the error code for the exynos when devm_get_clk() fails (Dan
Carpenter)
- Add the TCC cooling support for AlderLake platform (Sumeet Pawnikar)
- Add support for hardware trip points for the rcar gen3 thermal
driver and store TSC id as unsigned int (Niklas Söderlund)
- Replace the deprecated CPU-hotplug functions get_online_cpus() and
put_online_cpus (Sebastian Andrzej Siewior)
- Add the thermal tools directory in the MAINTAINERS file (Daniel
Lezcano)
- Fix the Makefile and the cross compilation flags for the userspace
'tmon' tool (Rolf Eike Beer)
- Allow to use the IMOK independently from the GDDV on Int340x (Sumeet
Pawnikar)
- Fix the stub thermal_cooling_device_register() function prototype
which does not match the real function (Arnd Bergmann)
- Make the thermal trip point optional in the DT bindings (Maxime
Ripard)
- Fix a typo in a comment in the core code (Geert Uytterhoeven)
- Reduce the verbosity of the trace in the SoC thermal tegra driver
(Dmitry Osipenko)
- Add the support for the LMh (Limit Management hardware) driver on
the QCom platforms (Thara Gopinath)
- Allow processing of HWP interrupt by adding a weak function in the
Intel driver (Srinivas Pandruvada)
- Prevent an abort of the sensor probe is a channel is not used
(Matthias Kaehlcke)
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Merge tag 'thermal-v5.15-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add the tegra3 thermal sensor and fix the compilation testing on
tegra by adding a dependency on ARCH_TEGRA along with COMPILE_TEST
(Dmitry Osipenko)
- Fix the error code for the exynos when devm_get_clk() fails (Dan
Carpenter)
- Add the TCC cooling support for AlderLake platform (Sumeet Pawnikar)
- Add support for hardware trip points for the rcar gen3 thermal driver
and store TSC id as unsigned int (Niklas Söderlund)
- Replace the deprecated CPU-hotplug functions get_online_cpus() and
put_online_cpus (Sebastian Andrzej Siewior)
- Add the thermal tools directory in the MAINTAINERS file (Daniel
Lezcano)
- Fix the Makefile and the cross compilation flags for the userspace
'tmon' tool (Rolf Eike Beer)
- Allow to use the IMOK independently from the GDDV on Int340x (Sumeet
Pawnikar)
- Fix the stub thermal_cooling_device_register() function prototype
which does not match the real function (Arnd Bergmann)
- Make the thermal trip point optional in the DT bindings (Maxime
Ripard)
- Fix a typo in a comment in the core code (Geert Uytterhoeven)
- Reduce the verbosity of the trace in the SoC thermal tegra driver
(Dmitry Osipenko)
- Add the support for the LMh (Limit Management hardware) driver on the
QCom platforms (Thara Gopinath)
- Allow processing of HWP interrupt by adding a weak function in the
Intel driver (Srinivas Pandruvada)
- Prevent an abort of the sensor probe is a channel is not used
(Matthias Kaehlcke)
* tag 'thermal-v5.15-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/drivers/qcom/spmi-adc-tm5: Don't abort probing if a sensor is not used
thermal/drivers/intel: Allow processing of HWP interrupt
dt-bindings: thermal: Add dt binding for QCOM LMh
thermal/drivers/qcom: Add support for LMh driver
firmware: qcom_scm: Introduce SCM calls to access LMh
thermal/drivers/tegra-soctherm: Silence message about clamped temperature
thermal: Spelling s/scallbacks/callbacks/
dt-bindings: thermal: Make trips node optional
thermal/core: Fix thermal_cooling_device_register() prototype
thermal/drivers/int340x: Use IMOK independently
tools/thermal/tmon: Add cross compiling support
thermal/tools/tmon: Improve the Makefile
MAINTAINERS: Add missing userspace thermal tools to the thermal section
thermal/drivers/intel_powerclamp: Replace deprecated CPU-hotplug functions.
thermal/drivers/rcar_gen3_thermal: Store TSC id as unsigned int
thermal/drivers/rcar_gen3_thermal: Add support for hardware trip points
drivers/thermal/intel: Add TCC cooling support for AlderLake platform
thermal/drivers/exynos: Fix an error code in exynos_tmu_probe()
thermal/drivers/tegra: Correct compile-testing of drivers
thermal/drivers/tegra: Add driver for Tegra30 thermal sensor
Even though the previous binding made it a required child node, the
implementation in Linux never made it mandatory and just ignored thermal
zones without trip points.
This was even effectively encouraged, since the thermal core wouldn't
allow a thermal sensor to probe without a thermal zone.
In the case where you had a thermal device that had multiple sensors but
with enough knowledge to provide trip points for only a few of them,
this meant that the only way to make that driver probe was to provide a
thermal zone without the trips node required by the binding.
This obviously led to a fair number of device trees doing exactly that,
making the initial binding requirement ineffective.
Let's make it clear by dropping that requirement.
Cc: Amit Kucheria <amitk@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Maxime Ripard <maxime@cerno.tech>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210721140424.725744-34-maxime@cerno.tech
This will enable temperature reporting for various SoC
components.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@somainline.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Link: https://lore.kernel.org/r/20210728222542.54269-15-konrad.dybcio@somainline.org
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
- Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan
Zhang)
- Export additionnal attributes for the int340x thermal processor
(Srinivas Pandruvada)
- Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra
Kamble)
- Fix kernel documentation for thermal_zone_device_unregister() and
use devm_platform_get_and_ioremap_resource() (Yang Yingliang)
- Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas
Söderlund)
- Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven)
- Add missing of_node_put() for the iMX and Spreadtrum sensors
(Krzysztof Kozlowski)
- Add tegra3 thermal sensor DT bindings (Dmitry Osipenko)
- Stop the thermal zone monitoring when unregistering it to prevent a
temperature update without the 'get_temp' callback (Dmitry Osipenko)
- Add rk3568 DT bindings, convert bindings to yaml schemas and add the
corresponding compatible in the Rockchip sensor (Ezequiel Garcia)
- Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson)
- Use the find_first_zero_bit() function instead of custom code (Andy
Shevchenko)
- Fix the kernel doc for the device cooling device (Yang Li)
- Reorg the processor thermal int340x to set the scene for the PCI
mmio driver (Srinivas Pandruvada)
- Add PCI MMIO driver for the int340x processor thermal driver
(Srinivas Pandruvada)
- Add hwmon sensors for the mediatek sensor (Frank Wunderlich)
- Fix warning for return value reported by Smatch for the int340x
thermal processor (Srinivas Pandruvada)
- Fix wrong register access and decoding for the int340x thermal
processor (Srinivas Pandruvada)
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Merge tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add rk3568 sensor support (Finley Xiao)
- Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan
Zhang)
- Export additionnal attributes for the int340x thermal processor
(Srinivas Pandruvada)
- Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra
Kamble)
- Fix kernel documentation for thermal_zone_device_unregister() and use
devm_platform_get_and_ioremap_resource() (Yang Yingliang)
- Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas
Söderlund)
- Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven)
- Add missing of_node_put() for the iMX and Spreadtrum sensors
(Krzysztof Kozlowski)
- Add tegra3 thermal sensor DT bindings (Dmitry Osipenko)
- Stop the thermal zone monitoring when unregistering it to prevent a
temperature update without the 'get_temp' callback (Dmitry Osipenko)
- Add rk3568 DT bindings, convert bindings to yaml schemas and add the
corresponding compatible in the Rockchip sensor (Ezequiel Garcia)
- Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson)
- Use the find_first_zero_bit() function instead of custom code (Andy
Shevchenko)
- Fix the kernel doc for the device cooling device (Yang Li)
- Reorg the processor thermal int340x to set the scene for the PCI mmio
driver (Srinivas Pandruvada)
- Add PCI MMIO driver for the int340x processor thermal driver
(Srinivas Pandruvada)
- Add hwmon sensors for the mediatek sensor (Frank Wunderlich)
- Fix warning for return value reported by Smatch for the int340x
thermal processor (Srinivas Pandruvada)
- Fix wrong register access and decoding for the int340x thermal
processor (Srinivas Pandruvada)
* tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (23 commits)
thermal/drivers/int340x/processor_thermal: Fix tcc setting
thermal/drivers/int340x/processor_thermal: Fix warning for return value
thermal/drivers/mediatek: Add sensors-support
thermal/drivers/int340x/processor_thermal: Add PCI MMIO based thermal driver
thermal/drivers/int340x/processor_thermal: Split enumeration and processing part
thermal: devfreq_cooling: Fix kernel-doc
thermal/drivers/intel/intel_soc_dts_iosf: Switch to use find_first_zero_bit()
dt-bindings: thermal: tsens: Add sc8180x compatible
dt-bindings: rockchip-thermal: Support the RK3568 SoC compatible
dt-bindings: thermal: convert rockchip-thermal to json-schema
thermal/core/thermal_of: Stop zone device before unregistering it
dt-bindings: thermal: Add binding for Tegra30 thermal sensor
thermal/drivers/sprd: Add missing of_node_put for loop iteration
thermal/drivers/imx_sc: Add missing of_node_put for loop iteration
thermal/drivers/rcar_gen3_thermal: Do not shadow rcar_gen3_ths_tj_1
thermal/drivers/rcar_gen3_thermal: Fix coefficient calculations
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
thermal/core: Correct function name thermal_zone_device_unregister()
dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
thermal/drivers/int340x: processor_thermal: Export additional attributes
...
Add a new compatible for the thermal sensor device on RK3568 SoCs.
Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210506175514.168365-4-ezequiel@collabora.com
All NVIDIA Tegra30 SoCs have on-chip sensors which monitor temperature
and voltage of the SoC. Sensors also controls CPU x2 freq throttle and
emits emergency shutdown signal. TSENSOR has has two separate channels
for each sensor placed in a different parts of the SoC. Add binding for
the sensor hardware.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Dmitry Osipenko <digetx@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210616190417.32214-2-digetx@gmail.com
If a property has an 'items' list, then a 'minItems' or 'maxItems' with the
same size as the list is redundant and can be dropped. Note that is DT
schema specific behavior and not standard json-schema behavior. The tooling
will fixup the final schema adding any unspecified minItems/maxItems.
This condition is partially checked with the meta-schema already, but
only if both 'minItems' and 'maxItems' are equal to the 'items' length.
An improved meta-schema is pending.
Cc: Jens Axboe <axboe@kernel.dk>
Cc: Stephen Boyd <sboyd@kernel.org>
Cc: Herbert Xu <herbert@gondor.apana.org.au>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: David Airlie <airlied@linux.ie>
Cc: Daniel Vetter <daniel@ffwll.ch>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Kamal Dasu <kdasu.kdev@gmail.com>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: Marc Zyngier <maz@kernel.org>
Cc: Joerg Roedel <joro@8bytes.org>
Cc: Mauro Carvalho Chehab <mchehab@kernel.org>
Cc: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Cc: Jakub Kicinski <kuba@kernel.org>
Cc: Wolfgang Grandegger <wg@grandegger.com>
Cc: Andrew Lunn <andrew@lunn.ch>
Cc: Vivien Didelot <vivien.didelot@gmail.com>
Cc: Vladimir Oltean <olteanv@gmail.com>
Cc: Bjorn Helgaas <bhelgaas@google.com>
Cc: Kishon Vijay Abraham I <kishon@ti.com>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: "Uwe Kleine-König" <u.kleine-koenig@pengutronix.de>
Cc: Lee Jones <lee.jones@linaro.org>
Cc: Ohad Ben-Cohen <ohad@wizery.com>
Cc: Mathieu Poirier <mathieu.poirier@linaro.org>
Cc: Paul Walmsley <paul.walmsley@sifive.com>
Cc: Palmer Dabbelt <palmer@dabbelt.com>
Cc: Albert Ou <aou@eecs.berkeley.edu>
Cc: Alessandro Zummo <a.zummo@towertech.it>
Cc: Alexandre Belloni <alexandre.belloni@bootlin.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Wim Van Sebroeck <wim@linux-watchdog.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # for MMC
Acked-by: Jassi Brar <jassisinghbrar@gmail.com>
Acked-By: Vinod Koul <vkoul@kernel.org>
Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Reviewed-by: Arnaud Pouliquen <arnaud.pouliquen@st.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Wolfram Sang <wsa@kernel.org> # for I2C
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Link: https://lore.kernel.org/r/20210615191543.1043414-1-robh@kernel.org
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas
Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of
a couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał
Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well
as the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of
cleanups and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
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Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Remove duplicate error message for the amlogic driver (Tang Bin)
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of a
couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well as
the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of cleanups
and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
* tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Lock the thermal zone while looping over instances
thermal/core/power_allocator: Update once cooling devices when temp is low
thermal/core/power_allocator: Maintain the device statistics from going stale
thermal/core: Create a helper __thermal_cdev_update() without a lock
dt-bindings: thermal: tsens: Document ipq8064 bindings
thermal/drivers/tsens: Add support for ipq8064-tsens
thermal/drivers/tsens: Drop unused define for msm8960
thermal/drivers/tsens: Replace custom 8960 apis with generic apis
thermal/drivers/tsens: Fix bug in sensor enable for msm8960
thermal/drivers/tsens: Use init_common for msm8960
thermal/drivers/tsens: Add VER_0 tsens version
thermal/drivers/tsens: Convert msm8960 to reg_field
thermal/drivers/tsens: Don't hardcode sensor slope
Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
thermal/core: Remove thermal_notify_framework
iwlwifi: mvm: tt: Replace thermal_notify_framework
dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
...
Document the use of bindings used for msm8960 tsens based devices.
msm8960 use the same gcc regs and is set as a child of the qcom gcc.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-10-ansuelsmth@gmail.com
This property is required for every thermal sensor as it's used when
using phandles.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210415112121.4999-1-zajec5@gmail.com
Users of common properties shouldn't have a type definition as the
common schemas already have one. Drop all the unnecessary type
references in the tree.
A meta-schema update to catch these is pending.
Cc: Maxime Ripard <mripard@kernel.org>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Krzysztof Kozlowski <krzk@kernel.org>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: Jakub Kicinski <kuba@kernel.org>
Cc: Ohad Ben-Cohen <ohad@wizery.com>
Cc: Cheng-Yi Chiang <cychiang@chromium.org>
Cc: Benson Leung <bleung@chromium.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Stefan Wahren <wahrenst@gmx.net>
Cc: Masahiro Yamada <yamada.masahiro@socionext.com>
Cc: Odelu Kukatla <okukatla@codeaurora.org>
Cc: linux-gpio@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-can@vger.kernel.org
Cc: netdev@vger.kernel.org
Cc: linux-remoteproc@vger.kernel.org
Cc: alsa-devel@alsa-project.org
Cc: linux-usb@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Dmity Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Suman Anna <s-anna@ti.com>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Reviewed-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org>
Acked-by: Maxime Ripard <maxime@cerno.tech>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Link: https://lore.kernel.org/r/20210316194858.3527845-1-robh@kernel.org
Properties with standard unit suffixes already have a type and don't need
type references. Fix a few more cases which have gotten added.
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: Kevin Tsai <ktsai@capellamicro.com>
Cc: linux-iio@vger.kernel.org
Cc: linux-input@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Dmity Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: Luca Ceresoli <luca@lucaceresoli.net>
Acked-by: Sebastian Reichel <sre@kernel.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Link: https://lore.kernel.org/r/20210316194824.3526913-1-robh@kernel.org
When adding support for V3U (r8a779a0) it was incorrectly recorded it
supports four nodes, while in fact it supports five. The fifth node is
named TSC0 and breaks the existing naming schema starting at 1. Work
around this by separately defining the reg property for V3U and others.
Restore the maximum number of nodes to three for other compatibles as
it was before erroneously increasing it for V3U.
Fixes: d7fdfb6541 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a779a0 support")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210310110716.3297544-1-niklas.soderlund+renesas@ragnatech.se
- Sync dtc to upstream version v1.6.0-51-g183df9e9c2b9 and build
host fdtoverlay
- Add kbuild support to build DT overlays (%.dtbo)
- Drop NULLifying match table in of_match_device(). In preparation for
this, there are several driver cleanups to use
(of_)?device_get_match_data().
- Drop pointless wrappers from DT struct device API
- Convert USB binding schemas to use graph schema and remove old plain
text graph binding doc
- Convert spi-nor and v3d GPU bindings to DT schema
- Tree wide schema fixes for if/then schemas, array size constraints,
and undocumented compatible strings in examples
- Handle 'no-map' correctly for already reserved memblock regions
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Merge tag 'devicetree-for-5.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
- Sync dtc to upstream version v1.6.0-51-g183df9e9c2b9 and build host
fdtoverlay
- Add kbuild support to build DT overlays (%.dtbo)
- Drop NULLifying match table in of_match_device().
In preparation for this, there are several driver cleanups to use
(of_)?device_get_match_data().
- Drop pointless wrappers from DT struct device API
- Convert USB binding schemas to use graph schema and remove old plain
text graph binding doc
- Convert spi-nor and v3d GPU bindings to DT schema
- Tree wide schema fixes for if/then schemas, array size constraints,
and undocumented compatible strings in examples
- Handle 'no-map' correctly for already reserved memblock regions
* tag 'devicetree-for-5.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (35 commits)
driver core: platform: Drop of_device_node_put() wrapper
of: Remove of_dev_{get,put}()
dt-bindings: usb: Change descibe to describe in usbmisc-imx.txt
dt-bindings: can: rcar_canfd: Group tuples in pin control properties
dt-bindings: power: renesas,apmu: Group tuples in cpus properties
dt-bindings: mtd: spi-nor: Convert to DT schema format
dt-bindings: Use portable sort for version cmp
dt-bindings: ethernet-controller: fix fixed-link specification
dt-bindings: irqchip: Add node name to PRUSS INTC
dt-bindings: interconnect: Fix the expected number of cells
dt-bindings: Fix errors in 'if' schemas
dt-bindings: iommu: renesas,ipmmu-vmsa: Make 'power-domains' conditionally required
dt-bindings: Fix undocumented compatible strings in examples
kbuild: Add support to build overlays (%.dtbo)
scripts: dtc: Remove the unused fdtdump.c file
scripts: dtc: Build fdtoverlay tool
scripts/dtc: Update to upstream version v1.6.0-51-g183df9e9c2b9
scripts: dtc: Fetch fdtoverlay.c from external DTC project
dt-bindings: thermal: sun8i: Fix misplaced schema keyword in compatible strings
dt-bindings: iio: dac: Fix AD5686 references
...
Add bindings for thermal monitor, part of Qualcomm PMIC5 chips. It is a
close counterpart of VADC part of those PMICs.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210205000118.493610-2-dmitry.baryshkov@linaro.org
The zte zx platform is getting removed, so this driver is no
longer needed.
Cc: Jun Nie <jun.nie@linaro.org>
Cc: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org
The tango platform is getting removed, so the driver is no
longer needed.
Cc: Marc Gonzalez <marc.w.gonzalez@free.fr>
Cc: Mans Rullgard <mans@mansr.com>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mans Rullgard <mans@mansr.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org
Add support for R-Car V3U. The V3U IP differs a bit from its siblings in
such way that it have 4 TSC nodes and the interrupts are not routed to
the INTC-AP but to the ECM.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201126223028.3119044-2-niklas.soderlund+renesas@ragnatech.se
- Factor out common required properties,
- "interrupts", "clocks", and "power-domains" are required on R-Mobile
APE6, too,
- Invert logic to simplify descriptions.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund@ragnatech.se>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201028153541.1736279-1-geert+renesas@glider.be
Add binding documentation for the MediaTek MT8516 SoC.
The SoC thermal IP is similar to MT2701.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201021164231.3029956-2-fparent@baylibre.com
MT8516 Thermal IP does not support reset. Make the resets property
optional in order to be able to support MT8516 SoC.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201021164231.3029956-1-fparent@baylibre.com
- Use dev_error_probe() to simplify the error handling on imx and imx8
platforms (Anson Huang)
- Use dedicated kobj_to_dev() instead of container_of() in the sysfs
core code (Tian Tao)
- Fix coding style by adding braces to a one line conditional
statement on rcar (Geert Uytterhoeven)
- Add DT binding documentation for the r8a774e1 platform and update
the Kconfig description supporting RZ/G2 SoCs (Lad Prabhakar)
- Simplify the return expression of stm_thermal_prepare on the stm32
platform (Qinglang Miao)
- Fix the unit in the function documentation for the idle injection
cooling device (Zhuguang Qing)
- Remove an unecessary mutex_init() in the core code (Qinglang Miao)
- Add support for keep alive events in the core code and the specific
int340x (Srinivas Pandruvada)
- Remove unused thermal zone variable in devfreq and cpufreq cooling
devices (Zhuguang Qing)
- Add the A100's THS controller support (Yangtao Li)
- Add power management on the omap3's bandgap sensor (Adam Ford)
- Fix a missing nlmsg_free in the netlink core error path (Jing Xiangfeng)
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Merge tag 'thermal-v5.10-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Fix Kconfig typo "acces" -> "access" (Colin Ian King)
- Use dev_error_probe() to simplify the error handling on imx and imx8
platforms (Anson Huang)
- Use dedicated kobj_to_dev() instead of container_of() in the sysfs
core code (Tian Tao)
- Fix coding style by adding braces to a one line conditional statement
on rcar (Geert Uytterhoeven)
- Add DT binding documentation for the r8a774e1 platform and update the
Kconfig description supporting RZ/G2 SoCs (Lad Prabhakar)
- Simplify the return expression of stm_thermal_prepare on the stm32
platform (Qinglang Miao)
- Fix the unit in the function documentation for the idle injection
cooling device (Zhuguang Qing)
- Remove an unecessary mutex_init() in the core code (Qinglang Miao)
- Add support for keep alive events in the core code and the specific
int340x (Srinivas Pandruvada)
- Remove unused thermal zone variable in devfreq and cpufreq cooling
devices (Zhuguang Qing)
- Add the A100's THS controller support (Yangtao Li)
- Add power management on the omap3's bandgap sensor (Adam Ford)
- Fix a missing nlmsg_free in the netlink core error path (Jing
Xiangfeng)
* tag 'thermal-v5.10-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal: core: Adding missing nlmsg_free() in thermal_genl_sampling_temp()
thermal: ti-soc-thermal: Enable addition power management
thermal: sun8i: Add A100's THS controller support
thermal: sun8i: add TEMP_CALIB_MASK for calibration data in sun50i_h6_ths_calibrate
dt-bindings: thermal: sun8i: Add binding for A100's THS controller
thermal: cooling: Remove unused variable *tz
thermal: int340x: Add keep alive response method
thermal: core: Add new event for sending keep alive notifications
thermal: int340x: Provide notification for OEM variable change
thermal: core: remove unnecessary mutex_init()
thermal/idle_inject: Fix comment of idle_duration_us and name of latency_ns
thermal: Kconfig: Update description for RCAR_GEN3_THERMAL config
thermal: stm32: simplify the return expression of stm_thermal_prepare()
dt-bindings: thermal: rcar-gen3-thermal: Add r8a774e1 support
thermal: rcar_thermal: Add missing braces to conditional statement
thermal: Use kobj_to_dev() instead of container_of()
thermal: imx8mm: Use dev_err_probe() to simplify error handling
thermal: imx: Use dev_err_probe() to simplify error handling
drivers: thermal: Kconfig: fix spelling mistake "acces" -> "access"
In order to add meta-schema checks for additional/unevaluatedProperties
being present, all schema need to make this explicit. As common/shared
schema are included by other schemas, they should always allow for
additionalProperties.
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Sebastian Reichel <sre@kernel.org>
Acked-by: Chanwoo Choi <cw00.choi@samsung.com>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Srinivas Kandagatla <srinivas.kandagatla@linaro.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Link: https://lore.kernel.org/r/20201005183830.486085-5-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
DTSes with new i.MX 8M SoCs introduce their own compatibles so add them
to fix dtbs_check warnings like:
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible:0: 'fsl,imx8mn-tmu' is not one of ['fsl,imx8mm-tmu', 'fsl,imx8mp-tmu']
From schema: Documentation/devicetree/bindings/thermal/imx8mm-thermal.yaml
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible: ['fsl,imx8mn-tmu', 'fsl,imx8mm-tmu'] is too long
arch/arm64/boot/dts/freescale/imx8mn-evk.dt.yaml: tmu@30260000:
compatible: Additional items are not allowed ('fsl,imx8mm-tmu' was unexpected)
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
drivers cleanup (Andrzej Pietrasiewicz)
- Add generic netlink support for userspace notifications: events, temperature
and discovery commands (Daniel Lezcano)
- Fix redundant initialization for a ret variable (Colin Ian King)
- Remove the clock cooling code as it is used nowhere (Amit Kucheria)
- Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian Rotariu)
- Replace all references to thermal.txt in the documentation to the
corresponding yaml files (Amit Kucheria)
- Add maintainer entry for the IPA (Lukasz Luba)
- Add support for MSM8939 for the tsens (Shawn Guo)
- Update power allocator and devfreq cooling to SPDX licensing (Lukasz Luba)
- Add Cannon Lake Low Power PCH support (Sumeet Pawnikar)
- Add tsensor support for V2 mediatek thermal system (Henry Yen)
- Fix thermal zone lookup by ID for the core code (Thierry Reding)
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Merge tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add support to enable/disable the thermal zones resulting on core
code and drivers cleanup (Andrzej Pietrasiewicz)
- Add generic netlink support for userspace notifications: events,
temperature and discovery commands (Daniel Lezcano)
- Fix redundant initialization for a ret variable (Colin Ian King)
- Remove the clock cooling code as it is used nowhere (Amit Kucheria)
- Add the rcar_gen3_thermal's r8a774e1 support (Marian-Cristian
Rotariu)
- Replace all references to thermal.txt in the documentation to the
corresponding yaml files (Amit Kucheria)
- Add maintainer entry for the IPA (Lukasz Luba)
- Add support for MSM8939 for the tsens (Shawn Guo)
- Update power allocator and devfreq cooling to SPDX licensing (Lukasz
Luba)
- Add Cannon Lake Low Power PCH support (Sumeet Pawnikar)
- Add tsensor support for V2 mediatek thermal system (Henry Yen)
- Fix thermal zone lookup by ID for the core code (Thierry Reding)
* tag 'thermal-v5.9-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (40 commits)
thermal: intel: intel_pch_thermal: Add Cannon Lake Low Power PCH support
thermal: mediatek: Add tsensor support for V2 thermal system
thermal: mediatek: Prepare to add support for other platforms
thermal: Update power allocator and devfreq cooling to SPDX licensing
MAINTAINERS: update entry to thermal governors file name prefixing
thermal: core: Add thermal zone enable/disable notification
thermal: qcom: tsens-v0_1: Add support for MSM8939
dt-bindings: tsens: qcom: Document MSM8939 compatible
thermal: core: Fix thermal zone lookup by ID
thermal: int340x: processor_thermal: fix: update Jasper Lake PCI id
thermal: imx8mm: Support module autoloading
thermal: ti-soc-thermal: Fix reversed condition in ti_thermal_expose_sensor()
MAINTAINERS: Add maintenance information for IPA
thermal: rcar_gen3_thermal: Do not shadow thcode variable
dt-bindings: thermal: Get rid of thermal.txt and replace references
thermal: core: Move initialization after core initcall
thermal: netlink: Improve the initcall ordering
net: genetlink: Move initialization to core_initcall
thermal: rcar_gen3_thermal: Add r8a774e1 support
thermal/drivers/clock_cooling: Remove clock_cooling code
...
- Improve device links cycle detection and breaking. Add more
bindings for device link dependencies.
- Refactor parsing 'no-map' in __reserved_mem_alloc_size()
- Improve DT unittest 'ranges' and 'dma-ranges' test case to check
differing cell sizes
- Various http to https link conversions
- Add a schema check to prevent 'syscon' from being used by itself
without a more specific compatible
- A bunch more DT binding conversions to schema
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Merge tag 'devicetree-for-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull Devicetree updates from Rob Herring:
- Improve device links cycle detection and breaking. Add more bindings
for device link dependencies.
- Refactor parsing 'no-map' in __reserved_mem_alloc_size()
- Improve DT unittest 'ranges' and 'dma-ranges' test case to check
differing cell sizes
- Various http to https link conversions
- Add a schema check to prevent 'syscon' from being used by itself
without a more specific compatible
- A bunch more DT binding conversions to schema
* tag 'devicetree-for-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (55 commits)
of: reserved-memory: remove duplicated call to of_get_flat_dt_prop() for no-map node
of: unittest: Use bigger address cells to catch parser regressions
dt-bindings: memory-controllers: Convert mmdc to json-schema
dt-bindings: mtd: Convert imx nand to json-schema
dt-bindings: mtd: Convert gpmi nand to json-schema
dt-bindings: iio: io-channel-mux: Fix compatible string in example code
of: property: Add device link support for pinctrl-0 through pinctrl-8
of: property: Add device link support for multiple DT bindings
dt-bindings: phy: ti: phy-gmii-sel: convert bindings to json-schema
dt-bindings: mux: mux.h: drop a duplicated word
dt-bindings: misc: Convert olpc,xo1.75-ec to json-schema
dt-bindings: aspeed-lpc: Replace HTTP links with HTTPS ones
dt-bindings: drm/bridge: Replace HTTP links with HTTPS ones
drm/tilcdc: Replace HTTP links with HTTPS ones
dt-bindings: iommu: renesas,ipmmu-vmsa: Add r8a774e1 support
dt-bindings: fpga: Replace HTTP links with HTTPS ones
dt-bindings: virtio: Replace HTTP links with HTTPS ones
dt-bindings: media: imx274: Add optional input clock and supplies
dt-bindings: i2c-gpio: Use 'deprecated' keyword on deprecated properties
dt-bindings: interrupt-controller: Fix typos in loongson,liointc.yaml
...
As usual, there are many patches addressing minor issues in existing
DTS files, such as DTC warnings, or adding support for additional
peripherals.
There are three added SoCs in existing product families:
- Amazon:
Alpine v3 is a 16-core Cortex-A72 SoC from Amazon's Annapurna Labs,
otherwise known as AL73400 or first-generation Graviton, and following
the already supported Cortex-A1`5 and Cortex-A57 based Alpine chips.
This one is added together with the official Evaluation platform.
- Qualcomm:
The Snapdragon SDM630 platform is a family of mid-range mobile phone
chips from 2017 based on Cortex-A53 or Kryo 260 CPUs.
A total of five end-user products are added based on these, all
Android phones from Sony: Xperia 10, 10 Plus, XA2, XA2 Plus and
XA2 Ultra.
- Renesas:
RZ/G2H (r8a774e1) is currently the top model in the Renesas RZ/G
family, and apparently closely related to the RZ/G2N and RZ/G2M
models we already support but has a faster GPU and additional
on-chip peripherals.
It is added along with the HopeRun HiHope RZ/G2H development board
A small number of new boards for already supported SoCs also debut:
- Allwinner sunxi:
Only one new machine, revision v1.2 of the Pine64 PinePhone
(non-Android) smartphone, containing minor changes compared to
earlier versions.
- Amlogic Meson:
WeTek Core2 is an Amlogic S912 (GXM) based Set-top-box
- Aspeed:
EthanolX is AMD's EPYC data center rerence platform, using an
ASpeed AST2600 baseboard management controller.
- Mediatek:
Lenovo IdeaPad Duet 10.1" (kukui/krane) is a new Chromebook
based on the MT8183 (Helio P60t) SoC.
- Nvidia Tegra:
ASUS Google Nexus 7 and Acer Iconia Tab A500 are two Android
tablets from around 2012 using Tegra 3 and Tegra 2, respectively.
Thanks to PostmarketOS, these can now run mainline kernels
and become useful again.
The Jetson Xavier NX Developer Kit uses a SoM and carrier board
for the Tegra194, their latest 64-bit chip based on Carmel CPU
cores and Volta graphics.
- NXP i.MX:
Five new boards based on the 32-bit i.MX6 series are added:
The MYiR MYS-6ULX single-board computer, and four different
models of industrial computers from Protonic.
- Qualcomm:
MikroTik RouterBoard 3011 is a rackmounted router based on the
32-bit IPQ8064 networking SoC
Three older phones get added, the Snapdragon 808 (msm8992) based
Xiaomi Libra (Mi 4C) and Microsoft Lumia 950, originally running
Windows Phone, and the Snapdragon 810 (msm8994) based Sony
Xperia Z5.
- Renesas:
In addition to the HiHope RZ/G2H board mentioned above, we gain
support for board versions 3.0 and 4.0 of the earlier RZ/G2M and
RZ/G2N reference boards.
Beacon EmbeddedWorks adds another SoM+Carrier development board
for RZ/G2M.
- Rockchips:
Radxa Rock Pi N8 development board and the VMARC RK3288 SoM it
is based on, using the high-end 32-bit rk3288 SoC.
Notable updates to existing platforms are usually for added on-chip
peripherals, including:
- ASpeed AST2xxx (various)
- Allwinner (cpufreq, thermal, Pinephone touchscreen)
- Amlogic Meson (audio, gpu dvdfs, board updates)
- Arm Versatile
- Broadcom (board updates for switch ports, Raspberry pi clock updates)
- Hisilicon (various)
- Intel/Altera SoCFPGA (various)
- Marvell Armada 7xxx/8xxx (smmu)
- Marvell MMP (GPU on mmp2/mmp3)
- Mediatek mt8183 (USB, pericfg)
- NXP Layerscape (VPU, thermal, DSPI)
- NXP i.MX (VPU, bindings, board updates)
- Nvidia Tegra194 (GPU)
- Qualcomm (GPU, Interconnect, ...)
- Renesas R-Car (SPI, IPMMU, board updates)
- STMicroelectronics STM32 (various)
- Samsung Exynos (various)
- Socionext Uniphier (updates to serial, and pcie)
- TI K3 (serdes, usb3, audio, sd, chipid)
- TI OMAP (IPU/DSP remoteproc changes, dropping platform data)
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
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Merge tag 'arm-dt-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull ARM SoC DT updates from Arnd Bergmann:
"As usual, there are many patches addressing minor issues in existing
DTS files, such as DTC warnings, or adding support for additional
peripherals.
There are three added SoCs in existing product families:
- Amazon:
Alpine v3 is a 16-core Cortex-A72 SoC from Amazon's Annapurna Labs,
otherwise known as AL73400 or first-generation Graviton, and
following the already supported Cortex-A1`5 and Cortex-A57 based
Alpine chips. This one is added together with the official
Evaluation platform.
- Qualcomm:
The Snapdragon SDM630 platform is a family of mid-range mobile
phone chips from 2017 based on Cortex-A53 or Kryo 260 CPUs. A total
of five end-user products are added based on these, all Android
phones from Sony: Xperia 10, 10 Plus, XA2, XA2 Plus and XA2 Ultra.
- Renesas:
RZ/G2H (r8a774e1) is currently the top model in the Renesas RZ/G
family, and apparently closely related to the RZ/G2N and RZ/G2M
models we already support but has a faster GPU and additional
on-chip peripherals. It is added along with the HopeRun HiHope
RZ/G2H development board
A small number of new boards for already supported SoCs also debut:
- Allwinner sunxi:
Only one new machine, revision v1.2 of the Pine64 PinePhone
(non-Android) smartphone, containing minor changes compared to
earlier versions.
- Amlogic Meson:
WeTek Core2 is an Amlogic S912 (GXM) based Set-top-box
- Aspeed:
EthanolX is AMD's EPYC data center rerence platform, using an
ASpeed AST2600 baseboard management controller.
- Mediatek:
Lenovo IdeaPad Duet 10.1" (kukui/krane) is a new Chromebook based
on the MT8183 (Helio P60t) SoC.
- Nvidia Tegra:
ASUS Google Nexus 7 and Acer Iconia Tab A500 are two Android
tablets from around 2012 using Tegra 3 and Tegra 2, respectively.
Thanks to PostmarketOS, these can now run mainline kernels and
become useful again.
The Jetson Xavier NX Developer Kit uses a SoM and carrier board for
the Tegra194, their latest 64-bit chip based on Carmel CPU cores
and Volta graphics.
- NXP i.MX:
Five new boards based on the 32-bit i.MX6 series are added: The
MYiR MYS-6ULX single-board computer, and four different models of
industrial computers from Protonic.
- Qualcomm:
MikroTik RouterBoard 3011 is a rackmounted router based on the
32-bit IPQ8064 networking SoC
Three older phones get added, the Snapdragon 808 (msm8992) based
Xiaomi Libra (Mi 4C) and Microsoft Lumia 950, originally running
Windows Phone, and the Snapdragon 810 (msm8994) based Sony Xperia
Z5.
- Renesas:
In addition to the HiHope RZ/G2H board mentioned above, we gain
support for board versions 3.0 and 4.0 of the earlier RZ/G2M and
RZ/G2N reference boards. Beacon EmbeddedWorks adds another
SoM+Carrier development board for RZ/G2M.
- Rockchips:
Radxa Rock Pi N8 development board and the VMARC RK3288 SoM it is
based on, using the high-end 32-bit rk3288 SoC.
Notable updates to existing platforms are usually for added on-chip
peripherals, including:
- ASpeed AST2xxx (various)
- Allwinner (cpufreq, thermal, Pinephone touchscreen)
- Amlogic Meson (audio, gpu dvdfs, board updates)
- Arm Versatile
- Broadcom (board updates for switch ports, Raspberry pi clock updates)
- Hisilicon (various)
- Intel/Altera SoCFPGA (various)
- Marvell Armada 7xxx/8xxx (smmu)
- Marvell MMP (GPU on mmp2/mmp3)
- Mediatek mt8183 (USB, pericfg)
- NXP Layerscape (VPU, thermal, DSPI)
- NXP i.MX (VPU, bindings, board updates)
- Nvidia Tegra194 (GPU)
- Qualcomm (GPU, Interconnect, ...)
- Renesas R-Car (SPI, IPMMU, board updates)
- STMicroelectronics STM32 (various)
- Samsung Exynos (various)
- Socionext Uniphier (updates to serial, and pcie)
- TI K3 (serdes, usb3, audio, sd, chipid)
- TI OMAP (IPU/DSP remoteproc changes, dropping platform data)"
* tag 'arm-dt-5.9' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (605 commits)
arm64: dts: meson: odroid-n2: add jack audio output support
arm64: dts: meson: odroid-n2: enable audio loopback
ARM: dts: berlin: Align L2 cache-controller nodename with dtschema
arm64: dts: qcom: Add Microsoft Lumia 950 (Talkman) device tree
arm64: dts: qcom: Add Xiaomi Libra (Mi 4C) device tree
arm64: dts: qcom: msm8992: Add RPMCC node
arm64: dts: qcom: msm8992: Add PSCI support.
arm64: dts: qcom: msm8992: Add PMU node
arm64: dts: qcom: msm8992: Add BLSP2_UART2 and I2C nodes
arm64: dts: qcom: msm8992: Add SPMI PMIC arbiter device
arm64: dts: qcom: msm8992: Add a SCM node
arm64: dts: qcom: msm8992: Add a proper CPU map
arm64: dts: qcom: bullhead: Move UART pinctrl to SoC
arm64: dts: qcom: bullhead: Add qcom,msm-id
arm64: dts: qcom: msm8992: Fix SDHCI1
arm64: dts: qcom: msm8992: Modernize the DTS style
arm64: dts: qcom: Add support for Sony Xperia Z5 (SoMC Sumire-RoW)
arm64: dts: qcom: Move msm8994-smd-rpm contents to lg-bullhead.
arm64: dts: qcom: msm8994: Add support for SMD RPM
arm64: dts: qcom: msm8992: Add a label to rpm-requests
...
It adds compatible for MSM8939 TSENS device.
Signed-off-by: Konrad Dybcio <konradybcio@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Tested-by: Konrad Dybcio <konradybcio@gmail.com> /* on Asus Z00T smartphone */
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629144926.665-2-shawn.guo@linaro.org
Now that we have yaml bindings for the thermal subsystem, get rid of the
old bindings (thermal.txt).
Replace all references to thermal.txt in the Documentation with a link
to the appropriate YAML bindings using the following search and replace
pattern:
- If the reference is specific to the thermal-sensor-cells property,
replace with a pointer to thermal-sensor.yaml
- If the reference is to the cooling-cells property, replace with a
pointer to thermal-cooling-devices.yaml
- If the reference is generic thermal bindings, replace with a
reference to thermal*.yaml.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/e9aacd33071a00568b67e110fa3bcc4d86d3e1e4.1595245166.git.amit.kucheria@linaro.org
- Sync dtc to upstream to pick up fixes for I2C bus checks and quiet
warnings
- Various fixes for DT binding check warnings
- A couple of build fixes/improvements for binding checks
- ReST formatting improvements for writing-schema.rst
- Document reference fixes
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Merge tag 'devicetree-fixes-for-5.8-2' into dt/next
Devicetree fixes for v5.8, take 2:
- Sync dtc to upstream to pick up fixes for I2C bus checks and quiet
warnings
- Various fixes for DT binding check warnings
- A couple of build fixes/improvements for binding checks
- ReST formatting improvements for writing-schema.rst
- Document reference fixes
Adjust the reg property to fix the following warning seen with
'make dt_binding_check':
Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml: example-0: thermal@42050000:reg:0: [0, 1107623936, 0, 604] is too long
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20200630122527.28640-1-festevam@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
Remove the soc unit address to fix the following warnings seen with
'make dt_binding_check':
Documentation/devicetree/bindings/thermal/thermal-sensor.example.dts:22.20-49.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property
Documentation/devicetree/bindings/thermal/thermal-zones.example.dts:23.20-50.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20200630121804.27887-1-festevam@gmail.com
[robh: also fix thermal-zones.yaml example]
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the qoriq thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Rob Herring <robh@kernel.org>
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device (Matthias
Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error handling
(Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC
thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the change
the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace module.h by
export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal driver
(Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the int340x
thermal driver - trivial conflicts fixed (Matthew Garrett)
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Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add the hwmon support on the i.MX SC (Anson Huang)
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device
(Matthias Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error
handling (Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the
TI SoC thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the
change the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit
Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace
module.h by export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal
driver (Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the
int340x thermal driver - trivial conflicts fixed (Matthew Garrett)
* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
thermal/int340x_thermal: Don't require IDSP to exist
thermal/int340x_thermal: Export OEM vendor variables
thermal/int340x_thermal: Export GDDV
thermal: qoriq: Update the settings for TMUv2
thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
thermal: qoriq: Add platform dependencies
drivers: thermal: tsens: Merge tsens-common.c into tsens.c
thermal/of: Rename of-thermal.c
thermal/governors: Prefix all source files with gov_
thermal/drivers/user_space: Sort headers alphabetically
thermal/drivers/of-thermal: Sort headers alphabetically
thermal/drivers/cpufreq_cooling: Replace module.h with export.h
thermal/drivers/cpufreq_cooling: Sort headers alphabetically
thermal/drivers/clock_cooling: Include export.h
thermal/drivers/clock_cooling: Sort headers alphabetically
thermal/drivers/thermal_hwmon: Include export.h
thermal/drivers/thermal_hwmon: Sort headers alphabetically
thermal/drivers/thermal_helpers: Include export.h
thermal/drivers/thermal_helpers: Sort headers alphabetically
thermal/core: Replace module.h with export.h
...
Another round of 'allOf' removals that came in this cycle.
json-schema versions draft7 and earlier have a weird behavior in that
any keywords combined with a '$ref' are ignored (silently). The correct
form was to put a '$ref' under an 'allOf'. This behavior is now changed
in the 2019-09 json-schema spec and '$ref' can be mixed with other
keywords. The json-schema library doesn't yet support this, but the
tooling now does a fixup for this and either way works.
This has been a constant source of review comments, so let's change this
treewide so everyone copies the simpler syntax.
Signed-off-by: Rob Herring <robh@kernel.org>
Add thermal sensor support for r8a7742 SoC. The Renesas RZ/G1H
(r8a7742) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Marian-Cristian Rotariu <marian-cristian.rotariu.rb@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the i.MX thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Rob Herring <robh@kernel.org>
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The thermal-zone binding is a software abstraction to capture the
properties of each zone - how often they should be checked, the
temperature thresholds (trips) at which mitigation actions need to be
taken and the level of mitigation needed at those thresholds.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/44e5c68bc654ccaf88945f70dc875fa186dd1480.1585748882.git.amit.kucheria@linaro.org
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The property #cooling-cells is required in each device that acts as a
cooling device - whether active or passive. So any device that can
throttle its performance to passively reduce heat dissipation (e.g.
CPUs, GPUs) and any device that can actively dissipate heat at different
levels (e.g. fans) will contain this property.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/7a9ead7fb67585fb70ab3ffd481e7d567e96970e.1585748882.git.amit.kucheria@linaro.org
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The property #thermal-sensor-cells is required in each device that acts
as a thermal sensor. It is used to uniquely identify the instance of the
thermal sensor inside the system.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/a91b5603caea5b8854cc9f5325448e4c7228c328.1585748882.git.amit.kucheria@linaro.org
Some devices are not able to cool down by reducing their voltage /
frequency because it could be not available or the system does not
allow voltage scaling. In this configuration, it is not possible to
use this strategy and the idle injection cooling device can be used
instead.
One idle cooling device is now present for the CPU as implemented by
the combination of the idle injection framework belonging to the power
capping framework and the thermal cooling device. The missing part is
the DT binding providing a way to describe how the cooling device will
work on the system.
A first iteration was done by making the cooling device to point to
the idle state. Unfortunately it does not make sense because it would
need to duplicate the idle state description for each CPU in order to
have a different phandle and make the thermal internal framework
happy.
It was proposed to add an cooling-cells to <3>, unfortunately the
thermal framework is expecting a value of <2> as stated by the
documentation and it is not possible from the cooling device generic
code to loop this third value to the back end cooling device.
Another proposal was to add a child 'thermal-idle' node as the SCMI
does. This approach allows to have a self-contained configuration for
the idle cooling device without colliding with the cpufreq cooling
device which is based on the CPU node. In addition, it allows to have
the cpufreq cooling device and the idle cooling device to co-exist
together as shown in the example.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200429103644.5492-2-daniel.lezcano@linaro.org
The examples template is a 'simple-bus' with a size of 1 cell for
had between 2 and 4 cells which really only errors on I2C or SPI type
devices with a single cell.
The easiest fix in most cases is to change the 'reg' property to for 1 cell
address and size. In some cases with child devices having 2 cells, that
doesn't make sense so a bus node is needed.
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the i.MX8MM thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Rob Herring <robh@kernel.org>
json-schema versions draft7 and earlier have a weird behavior in that
any keywords combined with a '$ref' are ignored (silently). The correct
form was to put a '$ref' under an 'allOf'. This behavior is now changed
in the 2019-09 json-schema spec and '$ref' can be mixed with other
keywords. The json-schema library doesn't yet support this, but the
tooling now does a fixup for this and either way works.
This has been a constant source of review comments, so let's change this
treewide so everyone copies the simpler syntax.
Scripted with ruamel.yaml with some manual fixups. Some minor whitespace
changes from the script.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Maxime Ripard <mripard@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Acked-by: Wolfram Sang <wsa@the-dreams.de> # for I2C
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio
Reviewed-by: Stephen Boyd <sboyd@kernel.org> # clock
Signed-off-by: Rob Herring <robh@kernel.org>
Fix various inconsistencies in schema indentation. Most of these are
list indentation which should be 2 spaces more than the start of the
enclosing keyword. This doesn't matter functionally, but affects running
scripts which do transforms on the schema files.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Maxime Ripard <mripard@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Signed-off-by: Rob Herring <robh@kernel.org>
Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 AM654 supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-2-j-keerthy@ti.com
- Add interrupt support on the rcar sensor (Niklas Söderlund)
- Add a new Spreadtrum thermal driver (Baolin Wang)
- Add thermal binding for the fsl scu board, a new API to retrieve the
sensor id bound to the thermal zone and i.MX system controller
sensor (Anson Huang))
- Remove warning log when a deferred probe is requested on Exynos
(Marek Szyprowski)
- Add the thermal monitoring unit support for imx8mm with its DT
bindings (Anson Huang)
- Rephrase the Kconfig text for clarity (Linus Walleij)
- Use the gpio descriptor for the ti-soc-thermal (Linus Walleij)
- Align msg structure to 4 bytes for i.MX SC, fix the Kconfig
dependency, add the __may_be unused annotation for PM functions and
the COMPILE_TEST option for imx8mm (Anson Huang)
- Fix a dependency on regmap in Kconfig for qoriq (Yuantian Tang)
- Add DT binding and support for the rcar gen3 r8a77961 and improve
the error path on the rcar init function (Niklas Söderlund)
- Cleanup and improvements for the tsens Qcom sensor (Amit Kucheria)
- Improve code by removing lock and caching values in the rcar thermal
sensor (Niklas Söderlund)
- Cleanup in the qoriq drivers and add a call to
imx_thermal_unregister_legacy_cooling in the removal function (Anson
Huang)
- Remove redundant 'maxItems' in tsens and sprd DT bindings (Rob Herring)
- Change the thermal DT bindings by making the cooling-maps optional
(Yuantian Tang)
- Add Tiger Lake support (Sumeet Pawnikar)
- Use scnprintf() for avoiding potential buffer overflow (Takashi Iwai)
- Make pkg_temp_lock a raw_spinlock_t(Clark Williams)
- Fix incorrect data types by changing them to signed on i.MX SC (Anson Huang)
- Replace zero-length array with flexible-array member (Gustavo A. R. Silva)
- Add support for i.MX8MP in the driver and in the DT bindings (Anson Huang)
- Fix return value of the cpufreq_set_cur_state() function (Willy Wolff)
- Remove abusing and scary WARN_ON in the cpufreq cooling device
(Daniel Lezcano)
- Fix build warning of incorrect argument type reported by sparse on
imx8mm (Anson Huang)
- Fix stub for the devfreq cooling device (Martin Blumenstingl)
- Fix cpu idle cooling documentation (Sergey Vidishev)
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Merge tag 'thermal-v5.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Convert tsens configuration DT binding to yaml (Rajeshwari)
- Add interrupt support on the rcar sensor (Niklas Söderlund)
- Add a new Spreadtrum thermal driver (Baolin Wang)
- Add thermal binding for the fsl scu board, a new API to retrieve the
sensor id bound to the thermal zone and i.MX system controller sensor
(Anson Huang))
- Remove warning log when a deferred probe is requested on Exynos
(Marek Szyprowski)
- Add the thermal monitoring unit support for imx8mm with its DT
bindings (Anson Huang)
- Rephrase the Kconfig text for clarity (Linus Walleij)
- Use the gpio descriptor for the ti-soc-thermal (Linus Walleij)
- Align msg structure to 4 bytes for i.MX SC, fix the Kconfig
dependency, add the __may_be unused annotation for PM functions and
the COMPILE_TEST option for imx8mm (Anson Huang)
- Fix a dependency on regmap in Kconfig for qoriq (Yuantian Tang)
- Add DT binding and support for the rcar gen3 r8a77961 and improve the
error path on the rcar init function (Niklas Söderlund)
- Cleanup and improvements for the tsens Qcom sensor (Amit Kucheria)
- Improve code by removing lock and caching values in the rcar thermal
sensor (Niklas Söderlund)
- Cleanup in the qoriq drivers and add a call to
imx_thermal_unregister_legacy_cooling in the removal function (Anson
Huang)
- Remove redundant 'maxItems' in tsens and sprd DT bindings (Rob
Herring)
- Change the thermal DT bindings by making the cooling-maps optional
(Yuantian Tang)
- Add Tiger Lake support (Sumeet Pawnikar)
- Use scnprintf() for avoiding potential buffer overflow (Takashi Iwai)
- Make pkg_temp_lock a raw_spinlock_t(Clark Williams)
- Fix incorrect data types by changing them to signed on i.MX SC (Anson
Huang)
- Replace zero-length array with flexible-array member (Gustavo A. R.
Silva)
- Add support for i.MX8MP in the driver and in the DT bindings (Anson
Huang)
- Fix return value of the cpufreq_set_cur_state() function (Willy
Wolff)
- Remove abusing and scary WARN_ON in the cpufreq cooling device
(Daniel Lezcano)
- Fix build warning of incorrect argument type reported by sparse on
imx8mm (Anson Huang)
- Fix stub for the devfreq cooling device (Martin Blumenstingl)
- Fix cpu idle cooling documentation (Sergey Vidishev)
* tag 'thermal-v5.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (52 commits)
Documentation: cpu-idle-cooling: Fix diagram for 33% duty cycle
thermal: devfreq_cooling: inline all stubs for CONFIG_DEVFREQ_THERMAL=n
thermal: imx8mm: Fix build warning of incorrect argument type
thermal/drivers/cpufreq_cooling: Remove abusing WARN_ON
thermal/drivers/cpufreq_cooling: Fix return of cpufreq_set_cur_state
thermal: imx8mm: Add i.MX8MP support
dt-bindings: thermal: imx8mm-thermal: Add support for i.MX8MP
thermal: qcom: tsens.h: Replace zero-length array with flexible-array member
thermal: imx_sc_thermal: Fix incorrect data type
thermal: int340x_thermal: Use scnprintf() for avoiding potential buffer overflow
thermal: int340x: processor_thermal: Add Tiger Lake support
thermal/x86_pkg_temp: Make pkg_temp_lock a raw_spinlock_t
dt-bindings: thermal: make cooling-maps property optional
dt-bindings: thermal: qcom-tsens: Remove redundant 'maxItems'
dt-bindings: thermal: sprd: Remove redundant 'maxItems'
thermal: imx: Calling imx_thermal_unregister_legacy_cooling() in .remove
thermal: qoriq: Sort includes alphabetically
thermal: qoriq: Use devm_add_action_or_reset() to handle all cleanups
thermal: rcar_thermal: Remove lock in rcar_thermal_get_current_temp()
thermal: rcar_thermal: Do not store ctemp in rcar_thermal_priv
...
Ensure the node only contains the properties listed in the schema by
setting 'additionalProperties: false'. Doing this requires reworking the
interrupt properties schemas so that they are defined in the main
'properties' section.
Fixes: a877e768f6 ("dt-bindings: thermal: tsens: Convert over to a yaml schema")
Cc: Andy Gross <agross@kernel.org>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Amit Kucheria <amit.kucheria@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
There's a typo 'nvmem-cells-names' in the schema which means the correct
'nvmem-cell-names' in the examples are not checked. The possible values
are wrong too both in that the 2nd entry is not specified correctly and the
values are just wrong based on the dts files in the kernel.
Fixes: a877e768f6 ("dt-bindings: thermal: tsens: Convert over to a yaml schema")
Cc: Andy Gross <agross@kernel.org>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Amit Kucheria <amit.kucheria@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Setting 'additionalProperties: false' is frequently omitted, but is
important in order to check that there aren't extra undocumented
properties in a binding.
Ideally, we'd just add this automatically and make this the default, but
there's some cases where it doesn't work. For example, if a common
schema is referenced, then properties in the common schema aren't part
of what's considered for 'additionalProperties'. Also, sometimes there
are bus specific properties such as 'spi-max-frequency' that go into
bus child nodes, but aren't defined in the child node's schema.
So let's stick with the json-schema defined default and add
'additionalProperties: false' where needed. This will be a continual
review comment and game of wack-a-mole.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Alexandru Ardelean <alexandru.ardelean@analog.com>
Reviewed-by: Benjamin Gaignard <benjamin.gaignard@st.com>
Acked-by: Stephen Boyd <sboyd@kernel.org> # clock
Acked-by: Lee Jones <lee.jones@linaro.org>
Numerous schemas are missing 'additionalProperties: false' statements which
ensures a binding doesn't have any extra undocumented properties or child
nodes. Fixing this reveals various missing properties, so let's fix all
those occurrences.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Acked-by: Alexandru Ardelean <alexandru.ardelean@analog.com>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio
Acked-by: Stephen Boyd <sboyd@kernel.org> # clock
Acked-by: Lee Jones <lee.jones@linaro.org>
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Cc: dri-devel@lists.freedesktop.org
Cc: netdev@vger.kernel.org
Cc: Guillaume La Roque <glaroque@baylibre.com>
Cc: linux-arm-kernel@lists.infradead.org
Cc: Mark Brown <broonie@kernel.org>
Cc: linux-iio@vger.kernel.org
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: linux-clk@vger.kernel.org
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: Kevin Hilman <khilman@baylibre.com>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: Hartmut Knaack <knaack.h@gmx.de>
Cc: Peter Meerwald-Stadler <pmeerw@pmeerw.net>
Cc: linux-amlogic@lists.infradead.org
Cc: linux-pm@vger.kernel.org
Cc: Masahiro Yamada <yamada.masahiro@socionext.com>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Liam Girdwood <lgirdwood@gmail.com>
Cc: Mauro Carvalho Chehab <mchehab@kernel.org>
Cc: linux-gpio@vger.kernel.org
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-media@vger.kernel.org
Cc: Lee Jones <lee.jones@linaro.org>
Cooling-maps doesn't have to be a required property because there may
be no cooling device on system, or there are no enough cooling devices for
each thermal zone in multiple thermal zone cases since cooling devices
can't be shared.
So make this property optional to remove such limitations.
For thermal zones with no cooling-maps, there could be critic trips
that can trigger CPU reset or shutdown. So they still can take actions.
Signed-off-by: Yuantian Tang <andy.tang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200309045411.21859-1-andy.tang@nxp.com
There's no need to specify 'maxItems' with the same value as the number
of entries in 'items'. A meta-schema update will catch future cases.
Cc: Andy Gross <agross@kernel.org>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Amit Kucheria <amit.kucheria@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200313214552.845-2-robh@kernel.org
There's no need to specify 'maxItems' with the same value as the number
of entries in 'items'. A meta-schema update will catch future cases.
Cc: Orson Zhai <orsonzhai@gmail.com>
Cc: Baolin Wang <baolin.wang7@gmail.com>
Cc: Chunyan Zhang <zhang.lyra@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amit.kucheria@verdurent.com>
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200313214552.845-1-robh@kernel.org
Several DT references got broken due to txt->yaml conversion.
Those are auto-fixed by running:
scripts/documentation-file-ref-check --fix
Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org>
Acked-by: Andrew Jeffery <andrew@aj.id.au>
Reviewed-by: Dan Murphy <dmurphy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Drop the reg property since this only necessary for the parent and
add the missing thermal-sensor-cells property description.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Fixes: 37e9cc08e9678 ("dt-bindings: Add Broadcom AVS RO thermal")
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1579200077-17496-1-git-send-email-stefan.wahren@i2se.com
BCM7216 is a 16nm process STB chip, which requires a different
compatible string to differentiate different temperature formulas.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-4-f.fainelli@gmail.com
Since the BCM2711 doesn't have a AVS TMON block, the thermal information
must be retrieved from the AVS ring oscillator block. This block is part
of the AVS monitor which contains a bunch of raw sensors.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-2-git-send-email-stefan.wahren@i2se.com
sun8i-thermal driver supports thermal sensor in wide range of Allwinner
SoCs. Add YAML schema for its bindings.
Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-3-anarsoul@gmail.com
Pull thermal management updates from Zhang Rui:
- Fix a deadlock regression in thermal core framework, which was
introduced in 5.3 (Wei Wang)
- Initialize thermal control framework earlier to enable thermal
mitigation during boot (Amit Kucheria)
- Convert the Intelligent Power Allocator (IPA) thermal governor to
follow the generic PM_EM instead of its own Energy Model (Quentin
Perret)
- Introduce a new Amlogic soc thermal driver (Guillaume La Roque)
- Add interrupt support for tsens thermal driver (Amit Kucheria)
- Add support for MSM8956/8976 in tsens thermal driver
(AngeloGioacchino Del Regno)
- Add support for r8a774b1 in rcar thermal driver (Biju Das)
- Add support for Thermal Monitor Unit v2 in qoriq thermal driver
(Yuantian Tang)
- Some other fixes/cleanups on thermal core framework and soc thermal
drivers (Colin Ian King, Daniel Lezcano, Hsin-Yi Wang, Tian Tao)
* 'thermal/next' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (32 commits)
thermal: Fix deadlock in thermal thermal_zone_device_check
thermal: cpu_cooling: Migrate to using the EM framework
thermal: cpu_cooling: Make the power-related code depend on IPA
PM / EM: Declare EM data types unconditionally
arm64: defconfig: Enable CONFIG_ENERGY_MODEL
drivers: thermal: tsens: fix potential integer overflow on multiply
thermal: cpu_cooling: Reorder the header file
thermal: cpu_cooling: Remove pointless dependency on CONFIG_OF
thermal: no need to set .owner when using module_platform_driver
thermal: qcom: tsens-v1: Fix kfree of a non-pointer value
cpufreq: qcom-hw: Move driver initialization earlier
clk: qcom: Initialize clock drivers earlier
cpufreq: Initialize cpufreq-dt driver earlier
cpufreq: Initialize the governors in core_initcall
thermal: Initialize thermal subsystem earlier
thermal: Remove netlink support
dt: thermal: tsens: Document compatible for MSM8976/56
thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976
MAINTAINERS: add entry for Amlogic Thermal driver
thermal: amlogic: Add thermal driver to support G12 SoCs
...
