The ‘mediatek,mt7981-thermal’ and ‘mediatek,mt8516-thermal’ strings
aren't definied in the driver. Both should have fallback compatible
strings. This commit fixes this issue.
Fixes: 788494ba09 ("dt-bindings: thermal: convert Mediatek Thermal to the json-schema")
Signed-off-by: Aleksander Jan Bajkowski <olek2@wp.pl>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rafał Miłecki <rafal@milecki.pl>
Link: https://lore.kernel.org/r/20250712195904.6988-2-olek2@wp.pl
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Several Rockchip SoCs, such as the RK3576, can store calibration trim
data for thermal sensors in OTP cells. This capability should be
documented.
Such a rockchip thermal sensor may reference cell handles that store
both a chip-wide trim for all the sensors, as well as cell handles
for each individual sensor channel pointing to that specific sensor's
trim value.
Additionally, the thermal sensor may optionally reference cells which
store the base in terms of degrees celsius and decicelsius that the trim
is relative to.
Each SoC that implements this appears to have a slightly different
combination of chip-wide trim, base, base fractional part and
per-channel trim, so which ones do which is documented in the bindings.
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Nicolas Frattaroli <nicolas.frattaroli@collabora.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20250610-rk3576-tsadc-upstream-v6-4-b6e9efbf1015@collabora.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add a new compatible for the thermal sensor device on the RK3576 SoC.
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Nicolas Frattaroli <nicolas.frattaroli@collabora.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20250610-rk3576-tsadc-upstream-v6-2-b6e9efbf1015@collabora.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
IPQ5018 has tsens v1.0 block with 5 sensors of which 4 are in use
and 1 interrupt.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Sricharan Ramabadhran <quic_srichara@quicinc.com>
Signed-off-by: George Moussalem <george.moussalem@outlook.com>
Link: https://lore.kernel.org/r/DS7PR19MB88835BD1063C4D5451E14B0E9DCC2@DS7PR19MB8883.namprd19.prod.outlook.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add support for Airoha EN7581 thermal sensor and monitor. This is a
simple sensor for the CPU or SoC Package that provide thermal sensor and
trip point for hot low and critical condition to fire interrupt and
react on the abnormal state.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250511185003.3754495-1-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
- Use dev_err_probe() helpers to simplify the init code in the Qoriq
thermal driver (Frank Li).
- Power down the Qoriq's TMU at suspend time (Alice Guo).
- Add ipq5332, ipq5424 compatible to the QCom's tsens thermal driver
and TSENS enable / calibration support for V2 (Praveenkumar I).
- Add missing rk3328 mapping entry (Trevor Woerner).
- Remove duplicate struct declaration from the thermal core header
file (Xueqin Luo).
- Disable the monitoring mode during suspend in the LVTS Mediatek
driver to prevent temperature acquisition glitches (Nícolas F. R. A.
Prado).
- Disable Stage 3 thermal threshold in the LVTS Mediatek driver
because it disables the suspend ability and does not have an
interrupt handler (Nícolas F. R. A. Prado).
- Fix low temperature offset interrupt in the LVTS Mediatek driver
to prevent multiple interrupts from triggering when the system is at
its normal functionning temperature (Nícolas F. R. A. Prado).
- Enable interrupts in the LVTS Mediatek driver only on sensors that
are in use (Nícolas F. R. A. Prado).
- Add the BCM74110 compatible DT binding and the corresponding code
to support a chip based on a different process node than previous
chips (Florian Fainelli).
- Correct indentation and style in DTS example (Krzysztof Kozlowski).
- Unify hexadecimal annotatation in the rcar_gen3 driver (Niklas
Söderlund).
- Factor out the code logic to read fuses on Gen3 and Gen4 in the
rcar_gen3 thermal driver (Niklas Söderlund).
- Drop unused driver data from the QCom's spmi temperature alarm
driver (Johan Hovold).
-----BEGIN PGP SIGNATURE-----
iQFGBAABCAAwFiEEcM8Aw/RY0dgsiRUR7l+9nS/U47UFAmfq7sQSHHJqd0Byand5
c29ja2kubmV0AAoJEO5fvZ0v1OO15hAH/imWw7djjvVup1ZDxTHICUHbAjS+QwmT
EZr5zy6SSHlnQ/h5eWwCziXBEYY04Ra3qXn/H8cqVKcgeSVdYJQ49adKTK7V0/5O
eszOGQQDtog0xeIYavLDcXFmN3jVa7BF6Zq6XQrezw6HELyWH14EYVVZ4qvgqFvt
jXiMdMzkzfQ/TYkso69lMK+asX0M9V/aRtf4Fzw4WH5qTmkqNkoSLOY7yPidwrYy
t4zXhTWpDmzB0mRaljaZ+Z9rDbyTMe8cRL+K9+PLGLVhPhU2DpVTvAEGs5w4IaoB
Nja+QixI8lOi/m1ErqqeduMtT4Rk4FC6T4uC58tMzLYLYY96snEg/EY=
=5IMD
-----END PGP SIGNATURE-----
Merge tag 'thermal-6.15-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly assorted updates of thermal drivers used on ARM
platforms:
- Use dev_err_probe() helpers to simplify the init code in the Qoriq
thermal driver (Frank Li)
- Power down the Qoriq's TMU at suspend time (Alice Guo)
- Add ipq5332, ipq5424 compatible to the QCom's tsens thermal driver
and TSENS enable / calibration support for V2 (Praveenkumar I)
- Add missing rk3328 mapping entry (Trevor Woerner)
- Remove duplicate struct declaration from the thermal core header
file (Xueqin Luo)
- Disable the monitoring mode during suspend in the LVTS Mediatek
driver to prevent temperature acquisition glitches (Nícolas F. R.
A. Prado)
- Disable Stage 3 thermal threshold in the LVTS Mediatek driver
because it disables the suspend ability and does not have an
interrupt handler (Nícolas F. R. A. Prado)
- Fix low temperature offset interrupt in the LVTS Mediatek driver to
prevent multiple interrupts from triggering when the system is at
its normal functionning temperature (Nícolas F. R. A. Prado)
- Enable interrupts in the LVTS Mediatek driver only on sensors that
are in use (Nícolas F. R. A. Prado)
- Add the BCM74110 compatible DT binding and the corresponding code
to support a chip based on a different process node than previous
chips (Florian Fainelli)
- Correct indentation and style in DTS example (Krzysztof Kozlowski)
- Unify hexadecimal annotatation in the rcar_gen3 driver (Niklas
Söderlund)
- Factor out the code logic to read fuses on Gen3 and Gen4 in the
rcar_gen3 thermal driver (Niklas Söderlund)
- Drop unused driver data from the QCom's spmi temperature alarm
driver (Johan Hovold)"
* tag 'thermal-6.15-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/qcom-spmi-temp-alarm: Drop unused driver data
thermal: rcar_gen3: Reuse logic to read fuses on Gen3 and Gen4
thermal: rcar_gen3: Use lowercase hex constants
dt-bindings: thermal: Correct indentation and style in DTS example
thermal/drivers/brcmstb_thermal: Add support for BCM74110
dt-bindings: thermal: Update for BCM74110
thermal/drivers/mediatek/lvts: Only update IRQ enable for valid sensors
thermal/drivers/mediatek/lvts: Start sensor interrupts disabled
thermal/drivers/mediatek/lvts: Disable low offset IRQ for minimum threshold
thermal/drivers/mediatek/lvts: Disable Stage 3 thermal threshold
thermal/drivers/mediatek/lvts: Disable monitor mode during suspend
thermal: core: Remove duplicate struct declaration
thermal/drivers/rockchip: Add missing rk3328 mapping entry
thermal/drivers/tsens: Add TSENS enable and calibration support for V2
dt-bindings: thermal: tsens: Add ipq5332, ipq5424 compatible
thermal/drivers/qoriq: Power down TMU on system suspend
thermal/drivers/qoriq: Use dev_err_probe() simplify the code
DTS example in the bindings should be indented with 2- or 4-spaces and
aligned with opening '- |', so correct any differences like 3-spaces or
mixtures 2- and 4-spaces in one binding.
No functional changes here, but saves some comments during reviews of
new patches built on existing code.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Chen-Yu Tsai <wens@csie.org>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250107131027.246608-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Update the binding with the BCM74110 compatible string which denotes the
first device we need to support in a different process node requiring an
updated thermal equation.
Signed-off-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250116193842.758788-2-florian.fainelli@broadcom.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The IPQ5332 and IPQ5424 use TSENS v2.3.3 IP with combined interrupt.
RPM is not available in these SoCs, hence adding new compatible
to have the sensor enablement and calibration function. Also add
nvmem-cell-names.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Manikanta Mylavarapu <quic_mmanikan@quicinc.com>
Link: https://lore.kernel.org/r/20250210120436.821684-2-quic_mmanikan@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
An operating system may allow its user to configure the action to be
undertaken on critical overtemperature events.
However, the bindings currently mandate an absence of the critical-action
property to be equal to critical-action = "shutdown", which would mean any
differing user configuration would violate the bindings.
Resolve this by documenting the absence of the property to mean that the
OS gets to decide.
Link: https://lkml.kernel.org/r/20250217-hw_protection-reboot-v3-10-e1c09b090c0c@pengutronix.de
Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Cc: Benson Leung <bleung@chromium.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Fabio Estevam <festevam@denx.de>
Cc: Guenter Roeck <groeck@chromium.org>
Cc: Jonathan Corbet <corbet@lwn.net>
Cc: Liam Girdwood <lgirdwood@gmail.com>
Cc: Lukasz Luba <lukasz.luba@arm.com>
Cc: Mark Brown <broonie@kernel.org>
Cc: Matteo Croce <teknoraver@meta.com>
Cc: Matti Vaittinen <mazziesaccount@gmail.com>
Cc: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Rui Zhang <rui.zhang@intel.com>
Cc: Sascha Hauer <kernel@pengutronix.de>
Cc: "Serge E. Hallyn" <serge@hallyn.com>
Cc: Tzung-Bi Shih <tzungbi@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Document the ipq6018 temperature sensor, which is used in ipq6018.dtsi
and is compatible with the ipq8074 temperature sensor.
Signed-off-by: Rayyan Ansari <rayyan.ansari@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240716133803.82907-1-rayyan.ansari@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Document the compatible string for tsens v1.4 block found in MSM8937.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org>
Link: https://lore.kernel.org/r/20241113-msm8917-v6-4-c348fb599fef@mainlining.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
DT Bindings:
- Drop duplicate devices in trivial-devices.yaml
- Add a common serial peripheral device schema and reference it in
serial device schemas.
- Convert nxp,lpc1850-wdt, zii,rave-wdt, ti,davinci-wdt,
snps,archs-pct, fsl,bcsr, fsl,fpga-qixis-i2c, fsl,fpga-qixis,
fsl,cpm-enet, fsl,cpm-mdio, fsl,ucc-hdlc, maxim,ds26522,
aspeed,ast2400-cvic, aspeed,ast2400-vic, fsl,ftm-timer,
ti,davinci-timer, fsl,rcpm, and qcom,ebi2 to DT schema
- Add support for rockchip,rk3576-wdt, qcom,apss-wdt-sa8255p,
fsl,imx8qm-irqsteer, qcom,pm6150-vib, qcom,sa8255p-pdc, isil,isl69260,
ti,tps546d24, and lpc32xx DMA mux
- Drop duplicate nvidia,tegra186-ccplex-cluster.yaml and
mediatek,mt6795-sys-clock.yaml
- Add arm,gic ESPI and EPPI interrupt type specifiers
- Add another batch of legacy compatible strings which we have no
intention of documenting
- Add dmas/dma-names properties to FSL lcdif
- Fix wakeup-source reference to m8921-keypad.yaml
- Treewide fixes of typos in bindings
DT Core:
- Update dtc/libfdt to upstream version v1.7.0-95-gbcd02b523429
- More conversions to scoped iterators and __free() initializer
- Handle overflows in address resources on 32-bit systems
- Extend extracting compatible strings in sources from function
parameters
- Use of_property_present() in DT unittest
- Clean-up of_irq_to_resource() to use helpers
- Support #msi-cells=<0> in of_msi_get_domain()
- Improve the kerneldoc for of_property_match_string()
- kselftest: Ignore nodes that have ancestors disabled
-----BEGIN PGP SIGNATURE-----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=a3qP
-----END PGP SIGNATURE-----
Merge tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT Bindings:
- Drop duplicate devices in trivial-devices.yaml
- Add a common serial peripheral device schema and reference it in
serial device schemas.
- Convert nxp,lpc1850-wdt, zii,rave-wdt, ti,davinci-wdt,
snps,archs-pct, fsl,bcsr, fsl,fpga-qixis-i2c, fsl,fpga-qixis,
fsl,cpm-enet, fsl,cpm-mdio, fsl,ucc-hdlc, maxim,ds26522,
aspeed,ast2400-cvic, aspeed,ast2400-vic, fsl,ftm-timer,
ti,davinci-timer, fsl,rcpm, and qcom,ebi2 to DT schema
- Add support for rockchip,rk3576-wdt, qcom,apss-wdt-sa8255p,
fsl,imx8qm-irqsteer, qcom,pm6150-vib, qcom,sa8255p-pdc,
isil,isl69260, ti,tps546d24, and lpc32xx DMA mux
- Drop duplicate nvidia,tegra186-ccplex-cluster.yaml and
mediatek,mt6795-sys-clock.yaml
- Add arm,gic ESPI and EPPI interrupt type specifiers
- Add another batch of legacy compatible strings which we have no
intention of documenting
- Add dmas/dma-names properties to FSL lcdif
- Fix wakeup-source reference to m8921-keypad.yaml
- Treewide fixes of typos in bindings
DT Core:
- Update dtc/libfdt to upstream version v1.7.0-95-gbcd02b523429
- More conversions to scoped iterators and __free() initializer
- Handle overflows in address resources on 32-bit systems
- Extend extracting compatible strings in sources from function
parameters
- Use of_property_present() in DT unittest
- Clean-up of_irq_to_resource() to use helpers
- Support #msi-cells=<0> in of_msi_get_domain()
- Improve the kerneldoc for of_property_match_string()
- kselftest: Ignore nodes that have ancestors disabled"
* tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (59 commits)
dt-bindings: watchdog: Add rockchip,rk3576-wdt compatible
dt-bindings: cpu: Drop duplicate nvidia,tegra186-ccplex-cluster.yaml
dt-bindings: clock: mediatek: Drop duplicate mediatek,mt6795-sys-clock.yaml
of/irq: Use helper to define resources
of/irq: Make use of irq_get_trigger_type()
dt-bindings: clk: vc5: Make SD/OE pin configuration properties not required
drivers/of: Improve documentation for match_string
of: property: Do some clean up with use of __free()
dt-bindings: watchdog: qcom-wdt: document support on SA8255p
dt-bindings: interrupt-controller: fsl,irqsteer: Document fsl,imx8qm-irqsteer
dt-bindings: interrupt-controller: arm,gic: add ESPI and EPPI specifiers
dt-bindings: dma: Add lpc32xx DMA mux binding
dt-bindings: trivial-devices: Drop duplicate "maxim,max1237"
dt-bindings: trivial-devices: Drop duplicate LM75 compatible devices
dt-bindings: trivial-devices: Deprecate "ad,ad7414"
dt-bindings: trivial-devices: Drop incorrect and duplicate at24 compatibles
dt-bindings: wakeup-source: update reference to m8921-keypad.yaml
dt-bindings: interrupt-controller: qcom-pdc: document support for SA8255p
dt-bindings: Fix various typos
of: address: Unify resource bounds overflow checking
...
Corrected several typos in Documentation/devicetree/bindings files.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Kuan-Wei Chiu <visitorckw@gmail.com>
Reviewed-by: Matti Vaittinen <mazziesaccount@gmail.com>
Signed-off-by: Yu-Chun Lin <eleanor15x@gmail.com>
Link: https://lore.kernel.org/r/20240905151943.2792056-1-eleanor15x@gmail.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Add compatible for sensors representing support on SA8255p.
Signed-off-by: Nikunj Kela <quic_nkela@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240828203721.2751904-14-quic_nkela@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
On newer SoCs, the thermal hardware can require a power domain to
operate so add corresponding optional property.
Signed-off-by: George Stark <gnstark@salutedevices.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240710223214.2348418-3-gnstark@salutedevices.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
DT Bindings:
- Convert and add a bunch of IBM FSI related bindings
- Add a new schema listing legacy compatibles which will (probably)
never be documented. This will silence various checks warning about
them.
- Add bindings for Sierra Wireless mangOH Green SPI IoT interface, new
Arm 2024 Cortex and Neoverse CPUs, QCom sc8180x PDC, QCom SDX75 GPI
DMA, imx8mp/imx8qxp fsl,irqsteer, and Renesas RZ/G2UL CRU and CSI-2
blocks
- Convert Spreadtrum sprd-timer, FSL cpm_qe, FSL fsl,ls-scfg-msi, FSL
q(b)man-*, FSL qoriq-mc, and img,pdc-wdt bindings to DT schema
- Drop obsolete stericsson,abx500.txt
DT core:
- Update dtc to upstream version v1.7.0-93-g1df7b047fe43
- Add support to run DT validation on DTs with applied overlays
- Add helper for creating boolean properties in dynamic nodes and use
that for dynamic PCI nodes
- Clean-up early parsing of '#{address,size}-cells'
-----BEGIN PGP SIGNATURE-----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=tjMz
-----END PGP SIGNATURE-----
Merge tag 'devicetree-for-6.11' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT Bindings:
- Convert and add a bunch of IBM FSI related bindings
- Add a new schema listing legacy compatibles which will (probably)
never be documented. This will silence various checks warning about
them.
- Add bindings for Sierra Wireless mangOH Green SPI IoT interface,
new Arm 2024 Cortex and Neoverse CPUs, QCom sc8180x PDC, QCom SDX75
GPI DMA, imx8mp/imx8qxp fsl,irqsteer, and Renesas RZ/G2UL CRU and
CSI-2 blocks
- Convert Spreadtrum sprd-timer, FSL cpm_qe, FSL fsl,ls-scfg-msi, FSL
q(b)man-*, FSL qoriq-mc, and img,pdc-wdt bindings to DT schema
- Drop obsolete stericsson,abx500.txt
DT core:
- Update dtc to upstream version v1.7.0-93-g1df7b047fe43
- Add support to run DT validation on DTs with applied overlays
- Add helper for creating boolean properties in dynamic nodes and use
that for dynamic PCI nodes
- Clean-up early parsing of '#{address,size}-cells'"
* tag 'devicetree-for-6.11' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (39 commits)
dt-bindings: timer: sprd-timer: convert to YAML
dt-bindings: incomplete-devices: document devices without bindings
dt-bindings: trivial-devices: document the Sierra Wireless mangOH Green SPI IoT interface
scripts/dtc: Update to upstream version v1.7.0-93-g1df7b047fe43
dt-bindings: soc: fsl: Add fsl,ls1028a-reset for reset syscon node
dt-bindings: soc: fsl: cpm_qe: convert to yaml format
dt-bindings: i2c: i2c-fsi: Convert to json-schema
dt-bindings: fsi: Document the FSI Hub Controller
dt-bindings: fsi: Document the AST2700 FSI controller
dt-bindings: fsi: ast2600-fsi-master: Convert to json-schema
dt-bindings: fsi: ibm,i2cr-fsi-master: Reference common FSI controller
dt-bindings: fsi: Document the FSI controller common properties
dt-bindings: fsi: Document the IBM SBEFIFO engine
dt-bindings: fsi: p9-occ: Convert to json-schema
dt-bindings: fsi: Document the IBM SCOM engine
dt-bindings: fsi: fsi2spi: Document SPI controller child nodes
dt-bindings: interrupt-controller: convert fsl,ls-scfg-msi to yaml
dt-bindings: soc: fsl: Convert q(b)man-* to yaml format
dt-bindings: misc: fsl,qoriq-mc: convert to yaml format
dt-bindings: drop stale Anson Huang from maintainers
...
It is possible to have thermal zones which don't have any trip points.
These zones in effect simply represent a temperature sensor without any
action associated with it. While the schema has always required a
'trips' node, users have existed for a long time without it. Update the
schema to match reality.
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709150154.3272825-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-12-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Preferred indentation for DTS examples in the bindings is 4-space. It
is also preferred not to have redundant/unused labels. No functional
change
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-22-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Simplify few bindings which already reference thermal-sensor.yaml schema
by dropping unneeded requiring of '#thermal-sensor-cells' and dropping
assigned-clocks properties (core schema allows it if 'clocks' are
there).
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-21-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-20-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-19-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-18-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-17-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-16-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-15-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-14-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-13-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-11-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-10-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-9-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-8-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-7-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-6-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-5-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-4-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Chen-Yu Tsai <wens@csie.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-3-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Device is a thermal sensor and all in-tree DTS provide
'#thermal-sensor-cells', so reference the thermal-sensor.yaml to
simplify it, bring the common definition of '#thermal-sensor-cells'
property and require it.
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Guillaume LA ROQUE <glaroque@baylibre.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-2-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
All Samsung Exynos SoCs Thermal Management Units have only one sensor,
so make '#thermal-sensor-cells' fixed at 0.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-1-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Emails to Anson Huang bounce:
Diagnostic-Code: smtp; 550 5.4.1 Recipient address rejected: Access denied.
Add IMX platform maintainers for bindings which would become orphaned.
Acked-by: Uwe Kleine-König <ukleinek@kernel.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Acked-by: Peng Fan <peng.fan@nxp.com>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com> # for I2C
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> # for IIO
Acked-by: Andi Shyti <andi.shyti@kernel.org>
Acked-by: Abel Vesa <abel.vesa@linaro.org>
Link: https://lore.kernel.org/r/20240617065828.9531-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
The temperature output register of the Loongson-2K2000 is defined in the
chip configuration domain, which is different from the Loongson-2K1000,
so it can't be fallbacked.
We need to use two groups of registers to describe it: the first group
is the high and low temperature threshold setting register; the second
group is the temperature output register.
It is true that this fix will cause ABI corruption, but it is necessary
otherwise the Loongson-2K2000 temperature sensor will not work properly.
Fixes: 72684d99a8 ("thermal: dt-bindings: add loongson-2 thermal")
Cc: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Huacai Chen <chenhuacai@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/5198999d679f1a1c3457385acb9fadfc85da1f1e.1713837379.git.zhoubinbin@loongson.cn
The thermal on the Loongson-2K0500 shares the design with the
Loongson-2K1000. Define corresponding compatible string, having the
loongson,ls2k1000-thermal as a fallback.
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Huacai Chen <chenhuacai@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/26524a63abd2d032e4c45efe6ce3fedb46841768.1713837379.git.zhoubinbin@loongson.cn