Commit Graph

401 Commits

Author SHA1 Message Date
Aaron Kling
1d264d3a19 dt-bindings: thermal: tegra: Document Tegra210B01
Add the compatible string for Tegra210B01 SOC_THERM

Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Aaron Kling <webgeek1234@gmail.com>
Link: https://lore.kernel.org/r/20250720-t210b01-v2-5-9cb209f1edfc@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-21 22:23:39 +02:00
Aleksander Jan Bajkowski
a9302f8fbe dt-bindings: thermal: mediatek: Add fallback compatible string for MT7981 and MT8516
The ‘mediatek,mt7981-thermal’ and ‘mediatek,mt8516-thermal’ strings
aren't definied in the driver. Both should have fallback compatible
strings. This commit fixes this issue.

Fixes: 788494ba09 ("dt-bindings: thermal: convert Mediatek Thermal to the json-schema")
Signed-off-by: Aleksander Jan Bajkowski <olek2@wp.pl>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rafał Miłecki <rafal@milecki.pl>
Link: https://lore.kernel.org/r/20250712195904.6988-2-olek2@wp.pl
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-21 22:13:46 +02:00
Luca Weiss
47f4bef6e7 dt-bindings: thermal: qcom-tsens: document the Milos Temperature Sensor
Document the Temperature Sensor (TSENS) on the Milos SoC.

Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250713-sm7635-fp6-initial-v2-8-e8f9a789505b@fairphone.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-17 10:45:01 +02:00
Nicolas Frattaroli
75b98a2c35 dt-bindings: thermal: rockchip: document otp thermal trim
Several Rockchip SoCs, such as the RK3576, can store calibration trim
data for thermal sensors in OTP cells. This capability should be
documented.

Such a rockchip thermal sensor may reference cell handles that store
both a chip-wide trim for all the sensors, as well as cell handles
for each individual sensor channel pointing to that specific sensor's
trim value.

Additionally, the thermal sensor may optionally reference cells which
store the base in terms of degrees celsius and decicelsius that the trim
is relative to.

Each SoC that implements this appears to have a slightly different
combination of chip-wide trim, base, base fractional part and
per-channel trim, so which ones do which is documented in the bindings.

Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Nicolas Frattaroli <nicolas.frattaroli@collabora.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20250610-rk3576-tsadc-upstream-v6-4-b6e9efbf1015@collabora.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-16 22:11:27 +02:00
Nicolas Frattaroli
83f2ef0f1b dt-bindings: rockchip-thermal: Add RK3576 compatible
Add a new compatible for the thermal sensor device on the RK3576 SoC.

Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Nicolas Frattaroli <nicolas.frattaroli@collabora.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20250610-rk3576-tsadc-upstream-v6-2-b6e9efbf1015@collabora.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-16 22:11:19 +02:00
Sricharan Ramabadhran
77c6d28192 dt-bindings: thermal: qcom-tsens: Add ipq5018 compatible
IPQ5018 has tsens v1.0 block with 5 sensors of which 4 are in use
and 1 interrupt.

Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Sricharan Ramabadhran <quic_srichara@quicinc.com>
Signed-off-by: George Moussalem <george.moussalem@outlook.com>
Link: https://lore.kernel.org/r/DS7PR19MB88835BD1063C4D5451E14B0E9DCC2@DS7PR19MB8883.namprd19.prod.outlook.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-05-16 12:50:01 +02:00
Christian Marangi
fd55708d58 dt-bindings: thermal: Add support for Airoha EN7581 thermal sensor
Add support for Airoha EN7581 thermal sensor and monitor. This is a
simple sensor for the CPU or SoC Package that provide thermal sensor and
trip point for hot low and critical condition to fire interrupt and
react on the abnormal state.

Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250511185003.3754495-1-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-05-16 12:50:01 +02:00
Linus Torvalds
8868485d6b More thermal control updates for 6.15-rc1
- Use dev_err_probe() helpers to simplify the init code in the Qoriq
    thermal driver (Frank Li).
 
  - Power down the Qoriq's TMU at suspend time (Alice Guo).
 
  - Add ipq5332, ipq5424 compatible to the QCom's tsens thermal driver
    and TSENS enable / calibration support for V2 (Praveenkumar I).
 
  - Add missing rk3328 mapping entry (Trevor Woerner).
 
  - Remove duplicate struct declaration from the thermal core header
    file (Xueqin Luo).
 
  - Disable the monitoring mode during suspend in the LVTS Mediatek
    driver to prevent temperature acquisition glitches (Nícolas F. R. A.
    Prado).
 
  - Disable Stage 3 thermal threshold in the LVTS Mediatek driver
    because it disables the suspend ability and does not have an
    interrupt handler (Nícolas F. R. A. Prado).
 
  - Fix low temperature offset interrupt in the LVTS Mediatek driver
    to prevent multiple interrupts from triggering when the system is at
    its normal functionning temperature (Nícolas F. R. A. Prado).
 
  - Enable interrupts in the LVTS Mediatek driver only on sensors that
    are in use (Nícolas F. R. A. Prado).
 
  - Add the BCM74110 compatible DT binding and the corresponding code
    to support a chip based on a different process node than previous
    chips (Florian Fainelli).
 
  - Correct indentation and style in DTS example (Krzysztof Kozlowski).
 
  - Unify hexadecimal annotatation in the rcar_gen3 driver (Niklas
    Söderlund).
 
  - Factor out the code logic to read fuses on Gen3 and Gen4 in the
    rcar_gen3 thermal driver (Niklas Söderlund).
 
  - Drop unused driver data from the QCom's spmi temperature alarm
    driver (Johan Hovold).
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Merge tag 'thermal-6.15-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull more thermal control updates from Rafael Wysocki:
 "These are mostly assorted updates of thermal drivers used on ARM
  platforms:

   - Use dev_err_probe() helpers to simplify the init code in the Qoriq
     thermal driver (Frank Li)

   - Power down the Qoriq's TMU at suspend time (Alice Guo)

   - Add ipq5332, ipq5424 compatible to the QCom's tsens thermal driver
     and TSENS enable / calibration support for V2 (Praveenkumar I)

   - Add missing rk3328 mapping entry (Trevor Woerner)

   - Remove duplicate struct declaration from the thermal core header
     file (Xueqin Luo)

   - Disable the monitoring mode during suspend in the LVTS Mediatek
     driver to prevent temperature acquisition glitches (Nícolas F. R.
     A. Prado)

   - Disable Stage 3 thermal threshold in the LVTS Mediatek driver
     because it disables the suspend ability and does not have an
     interrupt handler (Nícolas F. R. A. Prado)

   - Fix low temperature offset interrupt in the LVTS Mediatek driver to
     prevent multiple interrupts from triggering when the system is at
     its normal functionning temperature (Nícolas F. R. A. Prado)

   - Enable interrupts in the LVTS Mediatek driver only on sensors that
     are in use (Nícolas F. R. A. Prado)

   - Add the BCM74110 compatible DT binding and the corresponding code
     to support a chip based on a different process node than previous
     chips (Florian Fainelli)

   - Correct indentation and style in DTS example (Krzysztof Kozlowski)

   - Unify hexadecimal annotatation in the rcar_gen3 driver (Niklas
     Söderlund)

   - Factor out the code logic to read fuses on Gen3 and Gen4 in the
     rcar_gen3 thermal driver (Niklas Söderlund)

   - Drop unused driver data from the QCom's spmi temperature alarm
     driver (Johan Hovold)"

* tag 'thermal-6.15-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal/drivers/qcom-spmi-temp-alarm: Drop unused driver data
  thermal: rcar_gen3: Reuse logic to read fuses on Gen3 and Gen4
  thermal: rcar_gen3: Use lowercase hex constants
  dt-bindings: thermal: Correct indentation and style in DTS example
  thermal/drivers/brcmstb_thermal: Add support for BCM74110
  dt-bindings: thermal: Update for BCM74110
  thermal/drivers/mediatek/lvts: Only update IRQ enable for valid sensors
  thermal/drivers/mediatek/lvts: Start sensor interrupts disabled
  thermal/drivers/mediatek/lvts: Disable low offset IRQ for minimum threshold
  thermal/drivers/mediatek/lvts: Disable Stage 3 thermal threshold
  thermal/drivers/mediatek/lvts: Disable monitor mode during suspend
  thermal: core: Remove duplicate struct declaration
  thermal/drivers/rockchip: Add missing rk3328 mapping entry
  thermal/drivers/tsens: Add TSENS enable and calibration support for V2
  dt-bindings: thermal: tsens: Add ipq5332, ipq5424 compatible
  thermal/drivers/qoriq: Power down TMU on system suspend
  thermal/drivers/qoriq: Use dev_err_probe() simplify the code
2025-04-01 16:51:44 -07:00
Krzysztof Kozlowski
5ad72c2b24 dt-bindings: thermal: Correct indentation and style in DTS example
DTS example in the bindings should be indented with 2- or 4-spaces and
aligned with opening '- |', so correct any differences like 3-spaces or
mixtures 2- and 4-spaces in one binding.

No functional changes here, but saves some comments during reviews of
new patches built on existing code.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Chen-Yu Tsai <wens@csie.org>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250107131027.246608-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-03-25 20:52:04 +01:00
Florian Fainelli
2395a02809 dt-bindings: thermal: Update for BCM74110
Update the binding with the BCM74110 compatible string which denotes the
first device we need to support in a different process node requiring an
updated thermal equation.

Signed-off-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250116193842.758788-2-florian.fainelli@broadcom.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-03-25 20:52:04 +01:00
Praveenkumar I
1a685e2b3f dt-bindings: thermal: tsens: Add ipq5332, ipq5424 compatible
The IPQ5332 and IPQ5424 use TSENS v2.3.3 IP with combined interrupt.
RPM is not available in these SoCs, hence adding new compatible
to have the sensor enablement and calibration function. Also add
nvmem-cell-names.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Manikanta Mylavarapu <quic_mmanikan@quicinc.com>
Link: https://lore.kernel.org/r/20250210120436.821684-2-quic_mmanikan@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-03-25 20:52:03 +01:00
Ahmad Fatoum
738b785693 dt-bindings: thermal: give OS some leeway in absence of critical-action
An operating system may allow its user to configure the action to be
undertaken on critical overtemperature events.

However, the bindings currently mandate an absence of the critical-action
property to be equal to critical-action = "shutdown", which would mean any
differing user configuration would violate the bindings.

Resolve this by documenting the absence of the property to mean that the
OS gets to decide.

Link: https://lkml.kernel.org/r/20250217-hw_protection-reboot-v3-10-e1c09b090c0c@pengutronix.de
Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Cc: Benson Leung <bleung@chromium.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Fabio Estevam <festevam@denx.de>
Cc: Guenter Roeck <groeck@chromium.org>
Cc: Jonathan Corbet <corbet@lwn.net>
Cc: Liam Girdwood <lgirdwood@gmail.com>
Cc: Lukasz Luba <lukasz.luba@arm.com>
Cc: Mark Brown <broonie@kernel.org>
Cc: Matteo Croce <teknoraver@meta.com>
Cc: Matti Vaittinen <mazziesaccount@gmail.com>
Cc: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Rui Zhang <rui.zhang@intel.com>
Cc: Sascha Hauer <kernel@pengutronix.de>
Cc: "Serge E. Hallyn" <serge@hallyn.com>
Cc: Tzung-Bi Shih <tzungbi@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
2025-03-16 23:24:14 -07:00
Rayyan Ansari
fed79caaf7 dt-bindings: thermal: qcom-tsens: Document ipq6018 temperature sensor
Document the ipq6018 temperature sensor, which is used in ipq6018.dtsi
and is compatible with the ipq8074 temperature sensor.

Signed-off-by: Rayyan Ansari <rayyan.ansari@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240716133803.82907-1-rayyan.ansari@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2025-01-07 08:35:34 -06:00
Barnabás Czémán
fd9d75ef46 dt-bindings: thermal: tsens: Add MSM8937
Document the compatible string for tsens v1.4 block found in MSM8937.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org>
Link: https://lore.kernel.org/r/20241113-msm8917-v6-4-c348fb599fef@mainlining.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-11-13 16:21:18 +01:00
Dmitry Baryshkov
59e127d58c dt-bindings: thermal: qcom-tsens: Add SAR2130P compatible
Document compatible for thermal sensors on Qualcomm SAR2130P platform.

Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20241027-sar2130p-tsens-v1-1-8dee27fc02ae@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-11-13 16:17:57 +01:00
Linus Torvalds
2a17bb8c20 Devicetree updates for v6.12:
DT Bindings:
 - Drop duplicate devices in trivial-devices.yaml
 
 - Add a common serial peripheral device schema and reference it in
   serial device schemas.
 
 - Convert nxp,lpc1850-wdt, zii,rave-wdt, ti,davinci-wdt,
   snps,archs-pct, fsl,bcsr, fsl,fpga-qixis-i2c, fsl,fpga-qixis,
   fsl,cpm-enet, fsl,cpm-mdio, fsl,ucc-hdlc, maxim,ds26522,
   aspeed,ast2400-cvic, aspeed,ast2400-vic, fsl,ftm-timer,
   ti,davinci-timer, fsl,rcpm, and qcom,ebi2 to DT schema
 
 - Add support for rockchip,rk3576-wdt, qcom,apss-wdt-sa8255p,
   fsl,imx8qm-irqsteer, qcom,pm6150-vib, qcom,sa8255p-pdc, isil,isl69260,
   ti,tps546d24, and lpc32xx DMA mux
 
 - Drop duplicate nvidia,tegra186-ccplex-cluster.yaml and
   mediatek,mt6795-sys-clock.yaml
 
 - Add arm,gic ESPI and EPPI interrupt type specifiers
 
 - Add another batch of legacy compatible strings which we have no
   intention of documenting
 
 - Add dmas/dma-names properties to FSL lcdif
 
 - Fix wakeup-source reference to m8921-keypad.yaml
 
 - Treewide fixes of typos in bindings
 
 DT Core:
 - Update dtc/libfdt to upstream version v1.7.0-95-gbcd02b523429
 
 - More conversions to scoped iterators and __free() initializer
 
 - Handle overflows in address resources on 32-bit systems
 
 - Extend extracting compatible strings in sources from function
   parameters
 
 - Use of_property_present() in DT unittest
 
 - Clean-up of_irq_to_resource() to use helpers
 
 - Support #msi-cells=<0> in of_msi_get_domain()
 
 - Improve the kerneldoc for of_property_match_string()
 
 - kselftest: Ignore nodes that have ancestors disabled
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Merge tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

Pull devicetree updates from Rob Herring:
 "DT Bindings:

   - Drop duplicate devices in trivial-devices.yaml

   - Add a common serial peripheral device schema and reference it in
     serial device schemas.

   - Convert nxp,lpc1850-wdt, zii,rave-wdt, ti,davinci-wdt,
     snps,archs-pct, fsl,bcsr, fsl,fpga-qixis-i2c, fsl,fpga-qixis,
     fsl,cpm-enet, fsl,cpm-mdio, fsl,ucc-hdlc, maxim,ds26522,
     aspeed,ast2400-cvic, aspeed,ast2400-vic, fsl,ftm-timer,
     ti,davinci-timer, fsl,rcpm, and qcom,ebi2 to DT schema

   - Add support for rockchip,rk3576-wdt, qcom,apss-wdt-sa8255p,
     fsl,imx8qm-irqsteer, qcom,pm6150-vib, qcom,sa8255p-pdc,
     isil,isl69260, ti,tps546d24, and lpc32xx DMA mux

   - Drop duplicate nvidia,tegra186-ccplex-cluster.yaml and
     mediatek,mt6795-sys-clock.yaml

   - Add arm,gic ESPI and EPPI interrupt type specifiers

   - Add another batch of legacy compatible strings which we have no
     intention of documenting

   - Add dmas/dma-names properties to FSL lcdif

   - Fix wakeup-source reference to m8921-keypad.yaml

   - Treewide fixes of typos in bindings

  DT Core:

   - Update dtc/libfdt to upstream version v1.7.0-95-gbcd02b523429

   - More conversions to scoped iterators and __free() initializer

   - Handle overflows in address resources on 32-bit systems

   - Extend extracting compatible strings in sources from function
     parameters

   - Use of_property_present() in DT unittest

   - Clean-up of_irq_to_resource() to use helpers

   - Support #msi-cells=<0> in of_msi_get_domain()

   - Improve the kerneldoc for of_property_match_string()

   - kselftest: Ignore nodes that have ancestors disabled"

* tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (59 commits)
  dt-bindings: watchdog: Add rockchip,rk3576-wdt compatible
  dt-bindings: cpu: Drop duplicate nvidia,tegra186-ccplex-cluster.yaml
  dt-bindings: clock: mediatek: Drop duplicate mediatek,mt6795-sys-clock.yaml
  of/irq: Use helper to define resources
  of/irq: Make use of irq_get_trigger_type()
  dt-bindings: clk: vc5: Make SD/OE pin configuration properties not required
  drivers/of: Improve documentation for match_string
  of: property: Do some clean up with use of __free()
  dt-bindings: watchdog: qcom-wdt: document support on SA8255p
  dt-bindings: interrupt-controller: fsl,irqsteer: Document fsl,imx8qm-irqsteer
  dt-bindings: interrupt-controller: arm,gic: add ESPI and EPPI specifiers
  dt-bindings: dma: Add lpc32xx DMA mux binding
  dt-bindings: trivial-devices: Drop duplicate "maxim,max1237"
  dt-bindings: trivial-devices: Drop duplicate LM75 compatible devices
  dt-bindings: trivial-devices: Deprecate "ad,ad7414"
  dt-bindings: trivial-devices: Drop incorrect and duplicate at24 compatibles
  dt-bindings: wakeup-source: update reference to m8921-keypad.yaml
  dt-bindings: interrupt-controller: qcom-pdc: document support for SA8255p
  dt-bindings: Fix various typos
  of: address: Unify resource bounds overflow checking
  ...
2024-09-19 08:38:51 +02:00
Yu-Chun Lin
a7fcc23274 dt-bindings: Fix various typos
Corrected several typos in Documentation/devicetree/bindings files.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Kuan-Wei Chiu <visitorckw@gmail.com>
Reviewed-by: Matti Vaittinen <mazziesaccount@gmail.com>
Signed-off-by: Yu-Chun Lin <eleanor15x@gmail.com>
Link: https://lore.kernel.org/r/20240905151943.2792056-1-eleanor15x@gmail.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2024-09-13 14:01:34 -05:00
Nikunj Kela
f41e6475ff dt-bindings: thermal: tsens: document support on SA8255p
Add compatible for sensors representing support on SA8255p.

Signed-off-by: Nikunj Kela <quic_nkela@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240828203721.2751904-14-quic_nkela@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-09-02 13:12:54 +02:00
George Stark
77545bdfe4 dt-bindings: thermal: amlogic,thermal: add optional power-domains
On newer SoCs, the thermal hardware can require a power domain to
operate so add corresponding optional property.

Signed-off-by: George Stark <gnstark@salutedevices.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240710223214.2348418-3-gnstark@salutedevices.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-09-02 12:43:20 +02:00
Linus Torvalds
0ffb8a4c96 Devicetree updates for v6.11:
DT Bindings:
 - Convert and add a bunch of IBM FSI related bindings
 
 - Add a new schema listing legacy compatibles which will (probably)
   never be documented. This will silence various checks warning about
   them.
 
 - Add bindings for Sierra Wireless mangOH Green SPI IoT interface, new
   Arm 2024 Cortex and Neoverse CPUs, QCom sc8180x PDC, QCom SDX75 GPI
   DMA, imx8mp/imx8qxp fsl,irqsteer, and Renesas RZ/G2UL CRU and CSI-2
   blocks
 
 - Convert Spreadtrum sprd-timer, FSL cpm_qe, FSL fsl,ls-scfg-msi, FSL
   q(b)man-*, FSL qoriq-mc, and img,pdc-wdt bindings to DT schema
 
 - Drop obsolete stericsson,abx500.txt
 
 DT core:
 - Update dtc to upstream version v1.7.0-93-g1df7b047fe43
 
 - Add support to run DT validation on DTs with applied overlays
 
 - Add helper for creating boolean properties in dynamic nodes and use
   that for dynamic PCI nodes
 
 - Clean-up early parsing of '#{address,size}-cells'
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Merge tag 'devicetree-for-6.11' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

Pull devicetree updates from Rob Herring:
 "DT Bindings:

   - Convert and add a bunch of IBM FSI related bindings

   - Add a new schema listing legacy compatibles which will (probably)
     never be documented. This will silence various checks warning about
     them.

   - Add bindings for Sierra Wireless mangOH Green SPI IoT interface,
     new Arm 2024 Cortex and Neoverse CPUs, QCom sc8180x PDC, QCom SDX75
     GPI DMA, imx8mp/imx8qxp fsl,irqsteer, and Renesas RZ/G2UL CRU and
     CSI-2 blocks

   - Convert Spreadtrum sprd-timer, FSL cpm_qe, FSL fsl,ls-scfg-msi, FSL
     q(b)man-*, FSL qoriq-mc, and img,pdc-wdt bindings to DT schema

   - Drop obsolete stericsson,abx500.txt

  DT core:

   - Update dtc to upstream version v1.7.0-93-g1df7b047fe43

   - Add support to run DT validation on DTs with applied overlays

   - Add helper for creating boolean properties in dynamic nodes and use
     that for dynamic PCI nodes

   - Clean-up early parsing of '#{address,size}-cells'"

* tag 'devicetree-for-6.11' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (39 commits)
  dt-bindings: timer: sprd-timer: convert to YAML
  dt-bindings: incomplete-devices: document devices without bindings
  dt-bindings: trivial-devices: document the Sierra Wireless mangOH Green SPI IoT interface
  scripts/dtc: Update to upstream version v1.7.0-93-g1df7b047fe43
  dt-bindings: soc: fsl: Add fsl,ls1028a-reset for reset syscon node
  dt-bindings: soc: fsl: cpm_qe: convert to yaml format
  dt-bindings: i2c: i2c-fsi: Convert to json-schema
  dt-bindings: fsi: Document the FSI Hub Controller
  dt-bindings: fsi: Document the AST2700 FSI controller
  dt-bindings: fsi: ast2600-fsi-master: Convert to json-schema
  dt-bindings: fsi: ibm,i2cr-fsi-master: Reference common FSI controller
  dt-bindings: fsi: Document the FSI controller common properties
  dt-bindings: fsi: Document the IBM SBEFIFO engine
  dt-bindings: fsi: p9-occ: Convert to json-schema
  dt-bindings: fsi: Document the IBM SCOM engine
  dt-bindings: fsi: fsi2spi: Document SPI controller child nodes
  dt-bindings: interrupt-controller: convert fsl,ls-scfg-msi to yaml
  dt-bindings: soc: fsl: Convert q(b)man-* to yaml format
  dt-bindings: misc: fsl,qoriq-mc: convert to yaml format
  dt-bindings: drop stale Anson Huang from maintainers
  ...
2024-07-17 18:07:31 -07:00
Rob Herring (Arm)
6f48290b1a dt-bindings: thermal: Drop 'trips' node as required
It is possible to have thermal zones which don't have any trip points.
These zones in effect simply represent a temperature sensor without any
action associated with it. While the schema has always required a
'trips' node, users have existed for a long time without it. Update the
schema to match reality.

Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709150154.3272825-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
fd1f85b2e7 dt-bindings: thermal: qoriq: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-12-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
f062dc5cca dt-bindings: thermal: cleanup examples indentation
Preferred indentation for DTS examples in the bindings is 4-space.  It
is also preferred not to have redundant/unused labels. No functional
change

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-22-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
bbb4c17939 dt-bindings: thermal: simplify few bindings
Simplify few bindings which already reference thermal-sensor.yaml schema
by dropping unneeded requiring of '#thermal-sensor-cells' and dropping
assigned-clocks properties (core schema allows it if 'clocks' are
there).

Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-21-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
a985dceccd dt-bindings: thermal: ti,j72xx: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-20-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
323a6134e7 dt-bindings: thermal: ti,am654: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-19-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
17cdc4717d dt-bindings: thermal: st,stm32: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-18-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
f9b2d6b840 dt-bindings: thermal: sprd: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-17-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
28b3175105 dt-bindings: thermal: socionext,uniphier: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-16-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
bf1163bb00 dt-bindings: thermal: rzg2l: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-15-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
9abcf4ac35 dt-bindings: thermal: rockchip: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-14-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
7410853a1d dt-bindings: thermal: rcar-gen3: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-13-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
80c3fda5de dt-bindings: thermal: qcom-tsens: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-11-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
c1bca276d8 dt-bindings: thermal: qcom-spmi-adc-tm5: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-10-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
df300226f6 dt-bindings: thermal: qcom-spmi-adc-tm-hc: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-9-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
b760aeec3d dt-bindings: thermal: nvidia,tegra30-tsensor: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-8-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
b6f4d62c53 dt-bindings: thermal: nvidia,tegra186-bpmp: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-7-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
57fa7d6687 dt-bindings: thermal: imx8mm: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-6-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
2410427cc8 dt-bindings: thermal: generic-adc: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-5-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
0ae2a1a614 dt-bindings: thermal: brcm,avs-ro: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-4-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
e8eca74902 dt-bindings: thermal: allwinner,sun8i-a83t-ths: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Chen-Yu Tsai <wens@csie.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-3-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
da1f72fbe7 dt-bindings: thermal: amlogic: reference thermal-sensor schema
Device is a thermal sensor and all in-tree DTS provide
'#thermal-sensor-cells', so reference the thermal-sensor.yaml to
simplify it, bring the common definition of '#thermal-sensor-cells'
property and require it.

Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Guillaume LA ROQUE <glaroque@baylibre.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-2-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
f5a890927e dt-bindings: thermal: samsung,exynos: specify cells
All Samsung Exynos SoCs Thermal Management Units have only one sensor,
so make '#thermal-sensor-cells' fixed at 0.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-1-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
97e32381d0 dt-bindings: thermal: correct thermal zone node name limit
Linux kernel uses thermal zone node name during registering thermal
zones and has a hard-coded limit of 20 characters, including terminating
NUL byte.  The bindings expect node names to finish with '-thermal'
which is eight bytes long, thus we have only 11 characters for the reset
of the node name (thus 10 for the pattern after leading fixed character).

Reported-by: Rob Herring <robh@kernel.org>
Closes: https://lore.kernel.org/all/CAL_JsqKogbT_4DPd1n94xqeHaU_J8ve5K09WOyVsRX3jxxUW3w@mail.gmail.com/
Fixes: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Cc: stable@vger.kernel.org
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240702145248.47184-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Abel Vesa
b18ce693a2 dt-bindings: thermal: qcom-tsens: Document the X1E80100 Temperature Sensor
Document the Temperature Sensor (TSENS) on the X1E80100 Platform.

Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20240628-x1e80100-bindings-thermal-qcom-tsens-v2-1-4843d4c2ba24@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Abdulrasaq Lawani
bb6972fad9 dt-bindings: thermal: convert hisilicon-thermal.txt to dt-schema
Convert the hisilicon SoCs tsensor txt bindings to dt-schema

Signed-off-by: Abdulrasaq Lawani <abdulrasaqolawani@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240618-hisilicon-thermal-dt-bindings-conversion-v4-1-7eba97fbe6d0@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
499f5e3c7c dt-bindings: drop stale Anson Huang from maintainers
Emails to Anson Huang bounce:

  Diagnostic-Code: smtp; 550 5.4.1 Recipient address rejected: Access denied.

Add IMX platform maintainers for bindings which would become orphaned.

Acked-by: Uwe Kleine-König <ukleinek@kernel.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Acked-by: Peng Fan <peng.fan@nxp.com>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com> # for I2C
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> # for IIO
Acked-by: Andi Shyti <andi.shyti@kernel.org>
Acked-by: Abel Vesa <abel.vesa@linaro.org>
Link: https://lore.kernel.org/r/20240617065828.9531-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2024-07-09 07:40:17 -06:00
Binbin Zhou
c8c4353685 dt-bindings: thermal: loongson,ls2k-thermal: Fix incorrect compatible definition
The temperature output register of the Loongson-2K2000 is defined in the
chip configuration domain, which is different from the Loongson-2K1000,
so it can't be fallbacked.

We need to use two groups of registers to describe it: the first group
is the high and low temperature threshold setting register; the second
group is the temperature output register.

It is true that this fix will cause ABI corruption, but it is necessary
otherwise the Loongson-2K2000 temperature sensor will not work properly.

Fixes: 72684d99a8 ("thermal: dt-bindings: add loongson-2 thermal")
Cc: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Huacai Chen <chenhuacai@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/5198999d679f1a1c3457385acb9fadfc85da1f1e.1713837379.git.zhoubinbin@loongson.cn
2024-04-23 12:40:30 +02:00
Binbin Zhou
25c7d8472f dt-bindings: thermal: loongson,ls2k-thermal: Add Loongson-2K0500 compatible
The thermal on the Loongson-2K0500 shares the design with the
Loongson-2K1000. Define corresponding compatible string, having the
loongson,ls2k1000-thermal as a fallback.

Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Huacai Chen <chenhuacai@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/26524a63abd2d032e4c45efe6ce3fedb46841768.1713837379.git.zhoubinbin@loongson.cn
2024-04-23 12:40:30 +02:00
Nicolas Pitre
78c88534e5 dt-bindings: thermal: mediatek: Add LVTS thermal controller definition for MT8188
Add LVTS thermal controller definition for MT8188.

Signed-off-by: Nicolas Pitre <npitre@baylibre.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240402032729.2736685-13-nico@fluxnic.net
2024-04-23 12:40:30 +02:00