Provide right compatible properties for Amlogic A1 Thermal Sensor
controller. A1 family supports only one thermal node - CPU thermal
sensor.
Signed-off-by: Dmitry Rokosov <ddrokosov@salutedevices.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240328191322.17551-2-ddrokosov@salutedevices.com
'st,passive_colling_temp' does not appear in the device-tree, 'reg' and
'#thermal-sensor-cells' are also missing in the device description.
Convert st,stih407-thermal binding to DT schema format in order to clean
unused 'st,passive_cooling_temp' and add missing properties.
Signed-off-by: Raphael Gallais-Pou <rgallaispou@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240320-thermal-v3-1-700296694c4a@gmail.com
- Fix memory leak in the error path at probe time in the Mediatek LVTS
driver (Christophe Jaillet).
- Fix control buffer enablement regression on Meditek MT7896 (Frank
Wunderlich).
- Drop spaces before TABs in different places: thermal-of, ST drivers
and Makefile (Geert Uytterhoeven).
- Adjust DT binding for NXP as fsl,tmu-range min/maxItems can vary
among several SoC versions (Fabio Estevam).
- Add support for the H616 THS controller on Sun8i platforms (Martin
Botka).
- Don't fail probe due to zone registration failure because there is
no trip points defined in the DT (Mark Brown).
- Support variable TMU array size for new platforms (Peng Fan).
- Adjust the DT binding for thermal-of and make the polling time not
required and assume it is zero when not found in the DT (Konrad
Dybcio).
- Add r8a779h0 support in both the DT and the rcar_gen3 driver (Geert
Uytterhoeven).
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Merge tag 'thermal-6.9-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These update thermal drivers for ARM platforms by adding new hardware
support (r8a779h0, H616 THS), addressing issues (Mediatek LVTS,
Mediatek MT7896, thermal-of) and cleaning up code.
Specifics:
- Fix memory leak in the error path at probe time in the Mediatek
LVTS driver (Christophe Jaillet)
- Fix control buffer enablement regression on Meditek MT7896 (Frank
Wunderlich)
- Drop spaces before TABs in different places: thermal-of, ST drivers
and Makefile (Geert Uytterhoeven)
- Adjust DT binding for NXP as fsl,tmu-range min/maxItems can vary
among several SoC versions (Fabio Estevam)
- Add support for the H616 THS controller on Sun8i platforms (Martin
Botka)
- Don't fail probe due to zone registration failure because there is
no trip points defined in the DT (Mark Brown)
- Support variable TMU array size for new platforms (Peng Fan)
- Adjust the DT binding for thermal-of and make the polling time not
required and assume it is zero when not found in the DT (Konrad
Dybcio)
- Add r8a779h0 support in both the DT and the rcar_gen3 driver (Geert
Uytterhoeven)"
* tag 'thermal-6.9-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/rcar_gen3: Add support for R-Car V4M
dt-bindings: thermal: rcar-gen3-thermal: Add r8a779h0 support
thermal/of: Assume polling-delay(-passive) 0 when absent
dt-bindings: thermal-zones: Don't require polling-delay(-passive)
thermal/drivers/qoriq: Fix getting tmu range
thermal/drivers/sun8i: Don't fail probe due to zone registration failure
thermal/drivers/sun8i: Add support for H616 THS controller
thermal/drivers/sun8i: Add SRAM register access code
thermal/drivers/sun8i: Extend H6 calibration to support 4 sensors
thermal/drivers/sun8i: Explain unknown H6 register value
dt-bindings: thermal: sun8i: Add H616 THS controller
soc: sunxi: sram: export register 0 for THS on H616
dt-bindings: thermal: qoriq-thermal: Adjust fsl,tmu-range min/maxItems
thermal: Drop spaces before TABs
thermal/drivers/mediatek: Fix control buffer enablement on MT7896
thermal/drivers/mediatek/lvts_thermal: Fix a memory leak in an error handling path
Document support for the Thermal Sensor/Chip Internal Voltage
Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4M
(R8A779H0) SoC.
Just like on other R-Car Gen4 SoCs, interrupts are not routed to the
INTC-AP (GIC) but to the Error Control Module (ECM).
Signed-off-by: Duy Nguyen <duy.nguyen.rh@renesas.com>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/b3d135f8b63b9fe2d0f0aa2e48c8a2211b2e947e.1709722342.git.geert+renesas@glider.be
Currently, thermal zones associated with providers that have interrupts
for signaling hot/critical trips are required to set a polling-delay
of 0 to indicate no polling. This feels a bit backwards.
Assume 0 (no polling) when these properties are not defined.
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240125-topic-thermal-v1-1-3c9d4dced138@linaro.org
This controller is similar to the H6, but covers four sensors and uses
slightly different calibration methods.
Also the H616 requires to poke a bit in the SYS_CFG register range for
correct operation, so add a phandle property to point there.
Signed-off-by: Martin Botka <martin.botka@somainline.org>
Signed-off-by: Andre Przywara <andre.przywara@arm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Vasily Khoruzhick <anarsoul@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240219153639.179814-3-andre.przywara@arm.com
The number of fsl,tmu-range entries vary among the several NXP SoCs.
- lx2160a has two fsl,tmu-range entries (fsl,qoriq-tmu compatible)
- imx8mq has four fsl,tmu-range entries. (fsl,imx8mq-tmu compatible)
- imx93 has seven fsl,tmu-range entries. (fsl,qoriq-tmu compatible)
Change minItems and maxItems accordingly.
This fixes the following schema warning:
imx93-11x11-evk.dtb: tmu@44482000: fsl,tmu-range: 'oneOf' conditional failed, one must be fixed:
[2147483866, 2147483881, 2147483906, 2147483946, 2147484006, 2147484071, 2147484086] is too long
Signed-off-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240104124952.1975160-1-festevam@gmail.com
Convert the da9062 PMIC device tree binding documentation to json-schema.
Document the missing gpio child node for da9062.
While at it, update description with link to product information and
example.
The missing child node with of_compatible defined in MFD_CELL_OF is
causing the below warning message:
da9062-gpio: Failed to locate of_node [id: -1]
So, make all child nodes with of_compatible defined in struct mfd_cell
as required property for da906{1,2} devices.
The "gpio-controller" and "#gpio-cells" properties are defined in the
parent instead of gpio child node as there are existing driver users
based on these parent properties.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Link: https://lore.kernel.org/r/20240131102656.3379-7-biju.das.jz@bp.renesas.com
Signed-off-by: Lee Jones <lee@kernel.org>
Convert the da906{1,2} thermal device tree binding documentation to
json-schema.
Update MAINTAINERS entries and description by referring to
dlg,da9062-thermal.yaml binding file.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20240131102656.3379-5-biju.das.jz@bp.renesas.com
Signed-off-by: Lee Jones <lee@kernel.org>
Clean up the examples by adding newline separators, moving 'reg'
properties after 'compatible' and dropping unused labels.
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231130174114.13122-3-johan+linaro@kernel.org
The ADC Thermal Monitor is part of an SPMI PMIC, which in turn sits on
an SPMI bus.
Fixes: db03874b85 ("dt-bindings: thermal: qcom: add HC variant of adc-thermal monitor bindings")
Fixes: e8ffd6c075 ("dt-bindings: thermal: qcom: add adc-thermal monitor bindings")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231130174114.13122-2-johan+linaro@kernel.org
Document the critical-action property to describe the thermal action
the OS should perform after the critical temperature is reached.
The possible values are "shutdown" and "reboot".
The motivation for introducing the critical-action property is that
different systems may need different thermal actions when the critical
temperature is reached.
For example, in a desktop PC, it is desired that a shutdown happens
after the critical temperature is reached.
However, in some embedded cases, such behavior does not suit well,
as the board may be unattended in the field and rebooting may be a
better approach.
The bootloader may also benefit from this new property as it can check
the SoC temperature and in case the temperature is above the critical
point, it can trigger a shutdown or reboot accordingly.
Signed-off-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231129124330.519423-1-festevam@gmail.com
Add the missing 'thermal-sensor-cells' property which is required for
every thermal sensor as it's used when using phandles.
And add the thermal-sensor.yaml reference.
In fact, it was a careless mistake when submitting the driver that
caused it to not work properly. So the fix is necessary, although it
will result in the ABI break.
Fixes: 72684d99a8 ("thermal: dt-bindings: add loongson-2 thermal")
Cc: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/6d69362632271ab0af9a5fbfa3bc46a0894f1d54.1700817227.git.zhoubinbin@loongson.cn
This helps validating DTS files. Introduced changes:
1. Improved title
2. Simplified description (dropped "This describes the device tree...")
3. Dropped undocumented "reset-names" from example
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231117052214.24554-1-zajec5@gmail.com
This property is defined in thermal-sensor.yaml. Reference this file and
constraint '#thermal-sensor-cells' to 0 for imx-thermal.
Fixes the warning:
arch/arm/boot/dts/nxp/imx/imx6q-mba6a.dtb: tempmon:
'#thermal-sensor-cells' does not match any of the regexes: 'pinctrl-[0-9]+'
From schema: Documentation/devicetree/bindings/thermal/imx-thermal.yaml
Signed-off-by: Alexander Stein <alexander.stein@ew.tq-group.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231012080033.2715241-2-alexander.stein@ew.tq-group.com
Add compatibility string for the thermal sensors on sa8775p platform.
Signed-off-by: Priyansh Jain <quic_priyjain@quicinc.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230926085948.23046-2-quic_priyjain@quicinc.com
imx8dxl also contains the SCU thermal block.
Add an entry for 'fsl,imx8dxl-sc-thermal'.
Cc: Rafael J. Wysocki <rafael@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amitk@kernel.org>
Signed-off-by: Fabio Estevam <festevam@denx.de>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230926122957.341094-5-festevam@gmail.com
Just as unevaluatedProperties or additionalProperties are required at
the top level of schemas, they should (and will) also be required for
child node schemas. That ensures only documented properties are
present for any node.
Add unevaluatedProperties as needed, and then add any missing properties
flagged by the addition.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230926164500.101593-1-robh@kernel.org
Add compatible string for mt7988 lvts application processor.
Signed-off-by: Frank Wunderlich <frank-w@public-files.de>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230922055020.6436-2-linux@fw-web.de
Amit Kucheria has not been participating in kernel development in any
way or form for quite some time, so it is not useful to list him as a
designated reviewer for the thermal subsystem or as the thermal zone DT
binding maintainer.
Remove him from the THERMAL entry in MAINTAINERS and list Daniel Lezcano
as the new thermal zone DT binding maintainer.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
- Check if the Tegra BPMP supports the trip points in order to set the
.set_trips callback (Mikko Perttunen).
- Add new Loongson-2 thermal sensor along with the DT bindings (Yinbo
Zhu).
- Use IS_ERR_OR_NULL() helper to replace a double test on the TI
bandgap sensor (Li Zetao).
- Remove redundant platform_set_drvdata() calls, as there are no
corresponding calls to platform_get_drvdata(), from a bunch of
drivers (Andrei Coardos).
- Switch the Mediatek LVTS mode to filtered in order to enable
interrupts (Nícolas F. R. A. Prado).
- Fix Wvoid-pointer-to-enum-cast warning on the Exynos TMU (Krzysztof
Kozlowski).
- Remove redundant dev_err_probe(), because the underlying function
already called it, from the Mediatek sensor (Chen Jiahao).
- Free calibration nvmem after reading it on sun8i (Mark Brown).
- Remove useless comment from the sun8i driver (Yangtao Li).
- Make tsens_xxxx_nvmem static to fix a sparse warning on QCom
tsens (Min-Hua Chen).
- Remove error message at probe deferral on imx8mm (Ahmad Fatoum).
- Fix parameter check in lvts_debugfs_init() with IS_ERR() on
Mediatek LVTS (Minjie Du).
- Fix interrupt routine and configuratoin for Mediatek LVTS (Nícolas
F. R. A. Prado).
- Drop unused .get_trip_type(), .get_trip_temp() and .get_trip_hyst()
thermal zone callbacks from the core and rework the .get_trend()
one to take a trip point pointer as an argument (Rafael Wysocki).
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Merge tag 'thermal-6.6-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly updates of thermal control drivers for ARM platforms,
new thermal control support for Loongson-2 and a couple of core
cleanups made possible by recent changes merged previously.
Specifics:
- Check if the Tegra BPMP supports the trip points in order to set
the .set_trips callback (Mikko Perttunen)
- Add new Loongson-2 thermal sensor along with the DT bindings (Yinbo
Zhu)
- Use IS_ERR_OR_NULL() helper to replace a double test on the TI
bandgap sensor (Li Zetao)
- Remove redundant platform_set_drvdata() calls, as there are no
corresponding calls to platform_get_drvdata(), from a bunch of
drivers (Andrei Coardos)
- Switch the Mediatek LVTS mode to filtered in order to enable
interrupts (Nícolas F. R. A. Prado)
- Fix Wvoid-pointer-to-enum-cast warning on the Exynos TMU (Krzysztof
Kozlowski)
- Remove redundant dev_err_probe(), because the underlying function
already called it, from the Mediatek sensor (Chen Jiahao)
- Free calibration nvmem after reading it on sun8i (Mark Brown)
- Remove useless comment from the sun8i driver (Yangtao Li)
- Make tsens_xxxx_nvmem static to fix a sparse warning on QCom tsens
(Min-Hua Chen)
- Remove error message at probe deferral on imx8mm (Ahmad Fatoum)
- Fix parameter check in lvts_debugfs_init() with IS_ERR() on
Mediatek LVTS (Minjie Du)
- Fix interrupt routine and configuratoin for Mediatek LVTS (Nícolas
F. R. A. Prado)
- Drop unused .get_trip_type(), .get_trip_temp() and .get_trip_hyst()
thermal zone callbacks from the core and rework the .get_trend()
one to take a trip point pointer as an argument (Rafael Wysocki)"
* tag 'thermal-6.6-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (29 commits)
thermal: core: Rework .get_trend() thermal zone callback
thermal: core: Drop unused .get_trip_*() callbacks
thermal/drivers/tegra-bpmp: Check if BPMP supports trip points
thermal: dt-bindings: add loongson-2 thermal
thermal/drivers/loongson-2: Add thermal management support
thermal/drivers/ti-soc-thermal: Use helper function IS_ERR_OR_NULL()
thermal/drivers/generic-adc: Removed unneeded call to platform_set_drvdata()
thermal/drivers/max77620_thermal: Removed unneeded call to platform_set_drvdata()
thermal/drivers/mediatek/auxadc_thermal: Removed call to platform_set_drvdata()
thermal/drivers/sun8i_thermal: Remove unneeded call to platform_set_drvdata()
thermal/drivers/broadcom/brcstb_thermal: Removed unneeded platform_set_drvdata()
thermal/drivers/mediatek/lvts_thermal: Make readings valid in filtered mode
thermal/drivers/k3_bandgap: Remove unneeded call to platform_set_drvdata()
thermal/drivers/k3_j72xx_bandgap: Removed unneeded call to platform_set_drvdata()
thermal/drivers/broadcom/sr-thermal: Removed call to platform_set_drvdata()
thermal/drivers/samsung: Fix Wvoid-pointer-to-enum-cast warning
thermal/drivers/db8500: Remove redundant of_match_ptr()
thermal/drivers/mediatek: Clean up redundant dev_err_probe()
thermal/drivers/sun8i: Free calibration nvmem after reading it
thermal/drivers/sun8i: Remove unneeded comments
...
DT core:
- Add support for generating DT nodes for PCI devices. This is the
groundwork for applying overlays to PCI devices containing
non-discoverable downstream devices.
- DT unittest additions to check reverted changesets, to test for
refcount issues, and to test unresolved symbols. Also, various
clean-ups of the unittest along the way.
- Refactor node and property manipulation functions to better share code
with old API and changeset API
- Refactor changeset print functions to a common implementation
- Move some platform_device specific functions into of_platform.c
Bindings:
- Treewide fixing of typos
- Treewide clean-up of SPDX tags to use 'OR' consistently
- Last chunk of dropping unnecessary quotes. With that, the check
for unnecessary quotes is enabled in yamllint.
- Convert ftgmac100, zynqmp-genpd, pps-gpio, syna,rmi4, and qcom,ssbi
bindings to DT schema format
- Add Allwinner V3s xHCI USB, Saef SF-TC154B display, QCom SM8450 Inline
Crypto Engine, QCom SM6115 UFS, QCom SDM670 PDC interrupt controller,
Arm 2022 Cortex cores, and QCom IPQ9574 Crypto bindings
- Fixes for Rockchip DWC PCI binding
- Ensure all properties are evaluated on USB connector schema
- Fix dt-check-compatible script to find of_device_id instances with
compiler annotations
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Merge tag 'devicetree-for-6.6' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Add support for generating DT nodes for PCI devices. This is the
groundwork for applying overlays to PCI devices containing
non-discoverable downstream devices.
- DT unittest additions to check reverted changesets, to test for
refcount issues, and to test unresolved symbols. Also, various
clean-ups of the unittest along the way.
- Refactor node and property manipulation functions to better share
code with old API and changeset API
- Refactor changeset print functions to a common implementation
- Move some platform_device specific functions into of_platform.c
Bindings:
- Treewide fixing of typos
- Treewide clean-up of SPDX tags to use 'OR' consistently
- Last chunk of dropping unnecessary quotes. With that, the check for
unnecessary quotes is enabled in yamllint.
- Convert ftgmac100, zynqmp-genpd, pps-gpio, syna,rmi4, and qcom,ssbi
bindings to DT schema format
- Add Allwinner V3s xHCI USB, Saef SF-TC154B display, QCom SM8450
Inline Crypto Engine, QCom SM6115 UFS, QCom SDM670 PDC interrupt
controller, Arm 2022 Cortex cores, and QCom IPQ9574 Crypto bindings
- Fixes for Rockchip DWC PCI binding
- Ensure all properties are evaluated on USB connector schema
- Fix dt-check-compatible script to find of_device_id instances with
compiler annotations"
* tag 'devicetree-for-6.6' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (64 commits)
dt-bindings: usb: Add V3s compatible string for OHCI
dt-bindings: usb: Add V3s compatible string for EHCI
dt-bindings: display: panel: mipi-dbi-spi: add Saef SF-TC154B
dt-bindings: vendor-prefixes: document Saef Technology
dt-bindings: thermal: lmh: update maintainer address
of: unittest: Fix of_unittest_pci_node() kconfig dependencies
dt-bindings: crypto: ice: Document sm8450 inline crypto engine
dt-bindings: ufs: qcom: Add ICE to sm8450 example
dt-bindings: ufs: qcom: Add sm6115 binding
dt-bindings: ufs: qcom: Add reg-names property for ICE
dt-bindings: yamllint: Enable quoted string check
dt-bindings: Drop remaining unneeded quotes
of: unittest-data: Fix whitespace - angular brackets
of: unittest-data: Fix whitespace - indentation
of: unittest-data: Fix whitespace - blank lines
of: unittest-data: Convert remaining overlay DTS files to sugar syntax
of: overlay: unittest: Add test for unresolved symbol
of: unittest: Add separators to of_unittest_overlay_high_level()
of: unittest: Cleanup partially-applied overlays
of: unittest: Merge of_unittest_apply{,_revert}_overlay_check()
...
Add the Loongson-2 thermal binding with DT schema format using
json-schema.
Signed-off-by: Yinbo Zhu <zhuyinbo@loongson.cn>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230817021007.10350-2-zhuyinbo@loongson.cn
Convert the Tegra thermal bindings from the free-form text format to
json-schema.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Add marvell,armada-ap807-thermal compatible for the AP807 die.
Signed-off-by: Alex Leibovich <alexl@marvell.com>
Reviewed-by: Stefan Chulski <stefanc@marvell.com>
Signed-off-by: Russell King (Oracle) <rmk+kernel@armlinux.org.uk>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/E1qA7yP-00Ea4o-FS@rmk-PC.armlinux.org.uk
MSM8909 uses the TSENS v0.1 block similar to other SoCs like MDM9607.
Document the "qcom,msm8909-tsens" compatible in the existing schema.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-5-5eb632235ba7@kernkonzept.com
Since the SoC compatibles must be followed by the IP version compatible
(e.g. compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1";) it is
redundant to list all the SoC compatibles again in the if statement.
It will already match the IP-version compatible.
The list has already become inconsistent since for example
"qcom,msm8939-tsens" is covered by the if statement but is not listed
there explicitly like the other SoCs.
Simplify this by dropping the redundant SoC compatibles. ipq8064 and
msm8960 are still needed because they do not have an IP-version
compatible.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-4-5eb632235ba7@kernkonzept.com
Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ec9799504fe5a141e107bb78955d8d427f00553f.1686125196.git.quic_varada@quicinc.com
Convert the DT binding document for bcm2835-thermal from .txt to YAML.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230604121223.9625-10-stefan.wahren@i2se.com
The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516-topic-lost_tsens_bindings-v1-2-99715746ddb1@linaro.org
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs check
warning (Stefan Wahren).
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten).
- Fix comments for the cpuidle_cooling_register() function to match the
function prototype (Chenggang Wang).
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno).
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen).
- Use of_address_to_resource() in the Mediatek driver (Rob Herring).
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski).
- Clean up the step-wise thermal governor (Zhang Rui).
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano).
- Clean up the ACPI thermal driver a bit (Daniel Lezcano).
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki).
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Merge tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly cleanups on top of the previously merged thermal
control changes plus some driver fixes and the removal of the Intel
Menlow thermal driver.
Specifics:
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix comments for the cpuidle_cooling_register() function to match
the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
- Clean up the step-wise thermal governor (Zhang Rui)
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano)
- Clean up the ACPI thermal driver a bit (Daniel Lezcano)
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki)"
* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
dt-bindings: thermal: qcom-tsens: Correct unit address
thermal/drivers/mediatek: Use of_address_to_resource()
thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
thermal/drivers/mediatek: Add temperature constraints to validate read
Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
thermal/drivers/cpuidle_cooling: Delete unmatched comments
dt-bindings: thermal: Use generic ADC node name in examples
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
Match unit-address to first reg entry.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230420072429.36255-1-krzysztof.kozlowski@linaro.org
Update the examples to reflect a future requirement for the generic
`channel` node name on ADC channel nodes, while conveying the board name
of the channel in a label instead.
Signed-off-by: Marijn Suijten <marijn.suijten@somainline.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230410202917.247666-4-marijn.suijten@somainline.org
Currently the dtbs_check for imx6 generates warnings like this:
['fsl,imx6sll-tempmon', 'fsl,imx6sx-tempmon'] is too long
So add them to the devicetree binding.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230410205803.45853-4-stefan.wahren@i2se.com
Cleanup bindings dropping unneeded quotes. Once all these are fixed,
checking for this can be enabled in yamllint.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230327170233.4109156-1-robh@kernel.org
Add a new compatible for the thermal sensor device on RK3588 SoCs.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-8-sebastian.reichel@collabora.com
Just as unevaluatedProperties or additionalProperties are required at
the top level of schemas, they should (and will) also be required for
child node schemas. That ensures only documented properties are
present.
Add unevaluatedProperties or additionalProperties as appropriate, and
then add any missing properties flagged by the addition.
Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Lee Jones <lee@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230124230228.372305-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Add the binding documentation for the thermal support on MT8365 SoC.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-1-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
DT core:
- Add node lifecycle unit tests
- Add of_property_present() helper aligned with fwnode API
- Print more information on reserved regions on boot
- Update dtc to upstream v1.6.1-66-gabbd523bae6e
- Use strscpy() to instead of strncpy() in DT core
- Add option for schema validation on %.dtb targets
Bindings:
- Add/fix support for listing multiple patterns in DT_SCHEMA_FILES
- Rework external memory controller/bus bindings to properly support
controller specific child node properties
- Convert loongson,ls1x-intc, fcs,fusb302, sil,sii8620, Rockchip RK3399
PCIe, Synquacer I2C, and Synquacer EXIU bindings to DT schema format
- Add RiscV SBI PMU event mapping binding
- Add missing contraints on Arm SCMI child node allowed properties
- Add a bunch of missing Socionext UniPhier glue block bindings and
example fixes
- Various fixes for duplicate or conflicting type definitions on DT
properties
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Merge tag 'devicetree-for-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Add node lifecycle unit tests
- Add of_property_present() helper aligned with fwnode API
- Print more information on reserved regions on boot
- Update dtc to upstream v1.6.1-66-gabbd523bae6e
- Use strscpy() to instead of strncpy() in DT core
- Add option for schema validation on %.dtb targets
Bindings:
- Add/fix support for listing multiple patterns in DT_SCHEMA_FILES
- Rework external memory controller/bus bindings to properly support
controller specific child node properties
- Convert loongson,ls1x-intc, fcs,fusb302, sil,sii8620, Rockchip
RK3399 PCIe, Synquacer I2C, and Synquacer EXIU bindings to DT
schema format
- Add RiscV SBI PMU event mapping binding
- Add missing contraints on Arm SCMI child node allowed properties
- Add a bunch of missing Socionext UniPhier glue block bindings and
example fixes
- Various fixes for duplicate or conflicting type definitions on DT
properties"
* tag 'devicetree-for-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (66 commits)
dt-bindings: regulator: Add mps,mpq7932 power-management IC
of: dynamic: Fix spelling mistake "kojbect" -> "kobject"
dt-bindings: drop Sagar Kadam from SiFive binding maintainership
dt-bindings: sram: qcom,imem: document sm8450
dt-bindings: interrupt-controller: convert loongson,ls1x-intc.txt to json-schema
dt-bindings: arm: Add Cortex-A715 and X3
of: dynamic: add lifecycle docbook info to node creation functions
of: add consistency check to of_node_release()
of: do not use "%pOF" printk format on node with refcount of zero
of: unittest: add node lifecycle tests
of: update kconfig unittest help
of: add processing of EXPECT_NOT to of_unittest_expect
of: prepare to add processing of EXPECT_NOT to of_unittest_expect
of: Use preferred of_property_read_* functions
of: Use of_property_present() helper
of: Add of_property_present() helper
of: reserved_mem: Use proper binary prefix
dt-bindings: Fix multi pattern support in DT_SCHEMA_FILES
of: reserved-mem: print out reserved-mem details during boot
dt-bindings: serial: restrict possible child node names
...
Document support for the Thermal Sensor/Chip Internal Voltage
Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H
(R8A779G0) SoC.
Unlike most other R-Car Gen3 and Gen4 SoCs, it has 4 instead of 3
sensors, so increase the maximum number of reg tuples.
Just like other R-Car Gen4 SoCs, interrupts are not routed to the
INTC-AP but to the ECM.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/11f740522ec479011cc8eef6bb450603be394def.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add LVTS thermal controllers dt-binding definition for mt8192 and mt8195.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230209105628.50294-3-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The msm8974 platform uses two sets of calibration data, add a special
case to handle both of them.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-4-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Allow specifying the exact calibration mode and calibration data as nvmem
cells, rather than specifying just a single calibration data blob.
Note, unlike the vendor kernel the calibration data uses hw_ids rather
than software sensor indices (to match actual tsens usage in
thermal zones).
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-3-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When adding support for msm8976 it was thought that msm8956 would reuse
the same compat. However checking the vendor kernel revealed that these
two platforms use different slope values for calculating the calibration
data.
Add new compatible for the tsens on msm8956 SoC.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the
Qualcomm PMIC Thermal Monitoring ADC. Based on downstream sources, the
new compatible for TM7 differs from older TM5 by allowing configuring
per sensor decimation, time measurement and number of sample averaging -
unlike one configuration per entire device. This was not reflected in
the bindings, therefore comment the new compatible as incomplete as it
might change and its ABI is no stable.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230113090107.18498-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Prior to adding dt-bindings for SoC-dependent controllers, rename the
thermal node and its parent node to the generic names in the example.
And drop a parent node of the thermal-sensor as it is not directly
necessary.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221213082449.2721-7-hayashi.kunihiko@socionext.com
Signed-off-by: Rob Herring <robh@kernel.org>
The Devicetree bindings document does not have to say in the title that
it is a "Devicetree binding" or a "schema", but instead just describe
the hardware.
Manual updates to various binding titles, including capitalizing them.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # opp
Link: https://lore.kernel.org/r/20221216163815.522628-10-krzysztof.kozlowski@linaro.org
[robh: add trivial-devices.yaml and net/can/microchip,mcp251xfd.yaml]
Signed-off-by: Rob Herring <robh@kernel.org>
The Devicetree bindings document does not have to say in the title that
it is a "binding", but instead just describe the hardware.
Drop trailing "bindings" in various forms (also with trailing full
stop):
find Documentation/devicetree/bindings/ -type f -name '*.yaml' \
-not -name 'trivial-devices.yaml' \
-exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \;
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media
Acked-by: Sebastian Reichel <sre@kernel.org> # power
Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq
Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring <robh@kernel.org>
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada).
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong).
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi).
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson).
- Convert generic-adc-thermal to DT schema (Rob Herring).
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy).
- Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel).
- Add support for IPQ8074 in the tsens thermal driver along with the DT
bindings (Robert Marko).
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi).
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut).
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle).
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold).
- Add HWMon support for the imx8mm board (Alexander Stein).
- Remove pointless include from the power allocator governor (Christophe
JAILLET).
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski).
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss).
- Demote error log of thermal zone register to debug in the tsens QCom
driver (Manivannan Sadhasivam).
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof).
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar).
- Fix the irq handler return value in the LMh driver (Bjorn Andersson).
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König).
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Merge tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are updates of assorted thermal drivers, mostly for ARM
platforms, generally isolated and fairly straightforward, and the
recent Intel HFI driver fix for systems without HFI support.
Specifics:
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada)
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido
Schimmel)
- Add support for IPQ8074 in the tsens thermal driver along with the
DT bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add HWMon support for the imx8mm board (Alexander Stein)
- Remove pointless include from the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug in the tsens
QCom driver (Manivannan Sadhasivam)
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof)
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn
Andersson)
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König)"
* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
thermal/drivers/imx_sc_thermal: Drop empty platform remove function
thermal/drivers/qcom/lmh: Fix irq handler return value
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
dt-bindings: thermal: k3-j72xx: elaborate on binding description
thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
thermal/drivers/qcom: Demote error log of thermal zone register to debug
thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
thermal/core/power allocator: Remove a useless include
thermal/drivers/imx8mm: Add hwmon support
thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
thermal/drivers/imx: Add support for loading calibration data from OCOTP
...
The Qualcomm SM8550 platform has three instances of the tsens block,
add a compatible for these instances.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221114-narmstrong-sm8550-upstream-tsens-v1-0-0e169822830f@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The TSU block on the RZ/Five SoC is identical to one found on the RZ/G2UL
SoC. "renesas,r9a07g043-tsu" compatible string will be used on the
RZ/Five SoC so to make this clear, update the comment to include RZ/Five
SoC.
No driver changes are required as generic compatible string
"renesas,rzg2l-tsu" will be used as a fallback on RZ/Five SoC.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20221115121629.1181667-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Only some of TI's J721E SoCs will need a eFuse register range mapped to
determine if they're affected by TI's i2128 erratum. All other SoC will
not need this eFuse range to function properly
Update the bindings for the k3_j72xx_bandgap thermal driver so other
devices will only need two register ranges
Signed-off-by: Bryan Brattlof <bb@ti.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-7-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Elaborate on the function of this device node as well as some of the
properties this node uses.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-6-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Narrow number of interrupts per variants: SC8280XP, SM6350 and SM8450.
The compatibles are already used and described. They only missed the
constraints of number of interrupts.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221116113140.69587-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Document compatible string 'mediatek,mt7986-thermal' for V3 thermal
unit found in MT7986 SoCs.
'mediatek,mt7981-thermal' is also added as it is identical with the
thermal unit of MT7986.
Signed-off-by: Daniel Golle <daniel@makrotopia.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with
calibration values from OCOTP. Document optional phandle to OCOTP nvmem
provider.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Marek Vasut <marex@denx.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it
only uses one IRQ, so tsens v2 compatible cannot be used as the fallback.
We also have to make sure that correct interrupts are set according to
compatibles, so populate interrupt information per compatibles.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-1-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert the 'generic-adc-thermal' binding to DT schema format.
The binding said '#thermal-sensor-cells' should be 1, but all in tree
users are 0 and 1 doesn't make sense for a single channel.
Drop the example's related providers and consumers of the
'generic-adc-thermal' node as the convention is to not have those in
the examples.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221011175235.3191509-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
DT Bindings:
- Various LED binding conversions and clean-ups. Convert the ir-spi-led,
pwm-ir-tx, and gpio-ir-tx LED bindings to schemas. Consistently
reference LED common.yaml or multi-led schemas and disallow undefined
properties.
- Convert IDT 89HPESx, pwm-clock, st,stmipid02, Xilinx PCIe hosts,
and fsl,imx-fb bindings to schema
- Add ata-generic, Broadcom u-boot environment, and dynamic MTD
sub-partitions bindings.
- Make all SPI based displays reference spi-peripheral-props.yaml
- Fix some schema property regex's which should be fixed strings or were
missing start/end anchors
- Remove 'status' in examples, again...
DT Core:
- Fix a possible NULL dereference in overlay functions
- Fix kexec reading 32-bit "linux,initrd-{start,end}" values (which
never worked)
- Add of_address_count() helper to count number of 'reg' entries
- Support .dtso extension for DT overlay source files. Rename staging
and unittest overlay files.
- Update dtc to upstream v1.6.1-63-g55778a03df61
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Merge tag 'devicetree-for-6.2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT Bindings:
- Various LED binding conversions and clean-ups. Convert the
ir-spi-led, pwm-ir-tx, and gpio-ir-tx LED bindings to schemas.
Consistently reference LED common.yaml or multi-led schemas and
disallow undefined properties.
- Convert IDT 89HPESx, pwm-clock, st,stmipid02, Xilinx PCIe hosts,
and fsl,imx-fb bindings to schema
- Add ata-generic, Broadcom u-boot environment, and dynamic MTD
sub-partitions bindings.
- Make all SPI based displays reference spi-peripheral-props.yaml
- Fix some schema property regex's which should be fixed strings or
were missing start/end anchors
- Remove 'status' in examples, again...
DT Core:
- Fix a possible NULL dereference in overlay functions
- Fix kexec reading 32-bit "linux,initrd-{start,end}" values (which
never worked)
- Add of_address_count() helper to count number of 'reg' entries
- Support .dtso extension for DT overlay source files. Rename staging
and unittest overlay files.
- Update dtc to upstream v1.6.1-63-g55778a03df61"
* tag 'devicetree-for-6.2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (42 commits)
dt-bindings: leds: Add missing references to common LED schema
dt-bindings: leds: intel,lgm: Add missing 'led-gpios' property
of: overlay: fix null pointer dereferencing in find_dup_cset_node_entry() and find_dup_cset_prop()
dt-bindings: lcdif: Fix constraints for imx8mp
media: dt-bindings: atmel,isc: Drop unneeded unevaluatedProperties
dt-bindings: Drop Jee Heng Sia
dt-bindings: thermal: cooling-devices: Add missing cache related properties
dt-bindings: leds: irled: ir-spi-led: convert to DT schema
dt-bindings: leds: irled: pwm-ir-tx: convert to DT schema
dt-bindings: leds: irled: gpio-ir-tx: convert to DT schema
dt-bindings: leds: mt6360: rework to match multi-led
dt-bindings: leds: lp55xx: rework to match multi-led
dt-bindings: leds: lp55xx: switch to preferred 'gpios' suffix
dt-bindings: leds: lp55xx: allow label
dt-bindings: leds: use unevaluatedProperties for common.yaml
dt-bindings: thermal: tsens: Add SM6115 compatible
of/kexec: Fix reading 32-bit "linux,initrd-{start,end}" values
dt-bindings: display: Convert fsl,imx-fb.txt to dt-schema
dt-bindings: Add missing start and/or end of line regex anchors
dt-bindings: qcom,pdc: Add missing compatibles
...
The examples' cache nodes are incomplete as 'cache-unified' and
'cache-level' are required cache properties.
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221104162450.1982114-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Document compatible for tsens on Qualcomm SM6115 platform
according to downstream dts it ship v2.4 of IP
Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221130200950.144618-3-a39.skl@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
'cpus' is a common property, and it is now defined in dtschema schemas,
so drop the type references in the tree.
Acked-by: Suzuki K Poulose <suzuki.poulse@arm.com>
Acked-by: Bjorn Andersson <andersson@kernel.org>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20221111212857.4104308-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
The reference by path (&{/cpus/cpu@101/thermal-idle}) in the example causes
an error with new version of dtc:
FATAL ERROR: Can't generate fixup for reference to path &{/cpus/cpu@100/thermal-idle}
This is because the examples are built as an overlay and absolute paths
are not valid as references must be by label. The path was also not
resolvable because, by default, examples are placed under 'example-N'
nodes.
As the example contains top-level nodes, the root node must be explicit for
the example to be extracted as-is. This changes the indentation for the
whole example, but the existing indentation is a mess of of random amounts.
Clean this up to be 4 spaces everywhere.
Link: https://lore.kernel.org/r/20221111162729.3381835-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
As per the new ADC7 architecture used by the Qualcomm PMICs, each PMIC
has the static Slave ID (SID) assigned by default. The primary PMIC
PMK8350 is responsible for collecting the temperature/voltage data from
the slave PMICs and exposing them via it's registers.
For getting the measurements from the slave PMICs, PMK8350 uses the
channel ID encoded with the SID of the relevant PMIC. So far, the
dt-binding for the slave PMIC PM8350 assumed that there will be only
one PM8350 in a system. So it harcoded SID 1 with channel IDs.
But this got changed in platforms such as Lenovo X13s where there are a
couple of PM8350 PMICs available. So to address multiple PM8350s, change
the binding to accept the SID specified by the user and use it for
encoding the channel ID.
It should be noted that, even though the SID is static it is not
globally unique. Only the primary PMIC has the unique SID id 0.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20221103095810.64606-2-manivannan.sadhasivam@linaro.org
DT core:
- Fix node refcounting in of_find_last_cache_level()
- Constify device_node in of_device_compatible_match()
- Fix 'dma-ranges' handling in bus controller nodes
- Fix handling of initrd start > end
- Improve error reporting in of_irq_init()
- Taint kernel on DT unittest running
- Use strscpy instead of strlcpy
- Add a build target, dt_compatible_check, to check for
compatible strings used in kernel sources against compatible strings
in DT schemas.
- Handle DT_SCHEMA_FILES changes when rebuilding
DT bindings:
- LED bindings for MT6370 PMIC
- Convert Mediatek mtk-gce mailbox, MIPS CPU interrupt controller,
mt7621 I2C, virtio,pci-iommu, nxp,tda998x, QCom fastrpc, qcom,pdc,
and arm,versatile-sysreg to DT schema format
- Add nvmem cells to u-boot,env schema
- Add more LED_COLOR_ID definitions
- Require 'opp-table' uses to be a node
- Various schema fixes to match QEMU 'virt' DT usage
- Tree wide dropping of redundant 'Device Tree Binding' in schema titles
- More (unevaluated|additional)Properties fixes in schema child nodes
- Drop various redundant minItems equal to maxItems
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Merge tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Fix node refcounting in of_find_last_cache_level()
- Constify device_node in of_device_compatible_match()
- Fix 'dma-ranges' handling in bus controller nodes
- Fix handling of initrd start > end
- Improve error reporting in of_irq_init()
- Taint kernel on DT unittest running
- Use strscpy instead of strlcpy
- Add a build target, dt_compatible_check, to check for compatible
strings used in kernel sources against compatible strings in DT
schemas.
- Handle DT_SCHEMA_FILES changes when rebuilding
DT bindings:
- LED bindings for MT6370 PMIC
- Convert Mediatek mtk-gce mailbox, MIPS CPU interrupt controller,
mt7621 I2C, virtio,pci-iommu, nxp,tda998x, QCom fastrpc, qcom,pdc,
and arm,versatile-sysreg to DT schema format
- Add nvmem cells to u-boot,env schema
- Add more LED_COLOR_ID definitions
- Require 'opp-table' uses to be a node
- Various schema fixes to match QEMU 'virt' DT usage
- Tree wide dropping of redundant 'Device Tree Binding' in schema
titles
- More (unevaluated|additional)Properties fixes in schema child nodes
- Drop various redundant minItems equal to maxItems"
* tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (62 commits)
of: base: Shift refcount decrement in of_find_last_cache_level()
dt-bindings: leds: Add MediaTek MT6370 flashlight
dt-bindings: leds: mt6370: Add MediaTek MT6370 current sink type LED indicator
dt-bindings: mailbox: Convert mtk-gce to DT schema
of: base: make of_device_compatible_match() accept const device node
of: Fix "dma-ranges" handling for bus controllers
of: fdt: Remove unused struct fdt_scan_status
dt-bindings: display: st,stm32-dsi: Handle data-lanes in DSI port node
dt-bindings: timer: Add power-domains for TI timer-dm on K3
dt: Add a check for undocumented compatible strings in kernel
kbuild: take into account DT_SCHEMA_FILES changes while checking dtbs
dt-bindings: interrupt-controller: migrate MIPS CPU interrupt controller text bindings to YAML
dt-bindings: i2c: migrate mt7621 text bindings to YAML
dt-bindings: power: gpcv2: correct patternProperties
dt-bindings: virtio: Convert virtio,pci-iommu to DT schema
dt-bindings: timer: arm,arch_timer: Allow dual compatible string
dt-bindings: arm: cpus: Add kryo240 compatible
dt-bindings: display: bridge: nxp,tda998x: Convert to json-schema
dt-bindings: nvmem: u-boot,env: add basic NVMEM cells
dt-bindings: remoteproc: qcom,adsp: enforce smd-edge schema
...
When the thermal zone description was converted to yaml schema, the
required 'trips' property was forgotten.
The initial text bindings was describing:
"
[ ... ]
* Thermal zone nodes
The thermal zone node is the node containing all the required info
for describing a thermal zone, including its cooling device bindings. The
thermal zone node must contain, apart from its own properties, one sub-node
containing trip nodes and one sub-node containing all the zone cooling maps.
Required properties:
- polling-delay: The maximum number of milliseconds to wait between polls
Type: unsigned when checking this thermal zone.
Size: one cell
- polling-delay-passive: The maximum number of milliseconds to wait
Type: unsigned between polls when performing passive cooling.
Size: one cell
- thermal-sensors: A list of thermal sensor phandles and sensor specifier
Type: list of used while monitoring the thermal zone.
phandles + sensor
specifier
- trips: A sub-node which is a container of only trip point nodes
Type: sub-node required to describe the thermal zone.
Optional property:
- cooling-maps: A sub-node which is a container of only cooling device
Type: sub-node map nodes, used to describe the relation between trips
and cooling devices.
[ ... ]
"
Now the schema describes:
"
[ ... ]
required:
- polling-delay
- polling-delay-passive
- thermal-sensors
[ ... ]
"
Add the missing 'trips' property in the required properties.
Fixed: 1202a442a3 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220809085629.509116-3-daniel.lezcano@linaro.org
Bindings:
- Add spi-peripheral-props.yaml references to various SPI device
bindings
- Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm CCN
PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and arm-firmware-suite
bindings to DT schema format
- New bindings for Arm virtual platforms display, Qualcomm IMEM memory
region, Samsung S5PV210 ChipID, EM Microelectronic EM3027 RTC, and
arm,cortex-a78ae
- Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
quanta, and densitron
- Add missing MSI and IOMMU properties to host-generic-pci
- Remove bindings for removed EFM32 platform
- Remove old chosen.txt binding (replaced by schema)
- Treewide add missing type information for properties
- Treewide fixing of typos and its vs. it's in bindings. Its all good
now.
- Drop unnecessary quoting in power related schemas
- Several LED binding updates which didn't get picked up
- Move various bindings to proper directories
DT core code:
- Convert unittest GPIO related tests to use fwnode
- Check ima-kexec-buffer against memory bounds
- Print reserved-memory allocation/reservation failures as errors
- Cleanup early_init_dt_reserve_memory_arch()
- Simplify of_overlay_fdt_apply() tail
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Merge tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- Add spi-peripheral-props.yaml references to various SPI device
bindings
- Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm
CCN PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and
arm-firmware-suite bindings to DT schema format
- New bindings for Arm virtual platforms display, Qualcomm IMEM
memory region, Samsung S5PV210 ChipID, EM Microelectronic EM3027
RTC, and arm,cortex-a78ae
- Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
quanta, and densitron
- Add missing MSI and IOMMU properties to host-generic-pci
- Remove bindings for removed EFM32 platform
- Remove old chosen.txt binding (replaced by schema)
- Treewide add missing type information for properties
- Treewide fixing of typos and its vs. it's in bindings. Its all good
now.
- Drop unnecessary quoting in power related schemas
- Several LED binding updates which didn't get picked up
- Move various bindings to proper directories
DT core code:
- Convert unittest GPIO related tests to use fwnode
- Check ima-kexec-buffer against memory bounds
- Print reserved-memory allocation/reservation failures as errors
- Cleanup early_init_dt_reserve_memory_arch()
- Simplify of_overlay_fdt_apply() tail"
* tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (65 commits)
dt-bindings: mtd: microchip,mchp48l640: use spi-peripheral-props.yaml
dt-bindings: power: supply: drop quotes when not needed
dt-bindings: power: reset: drop quotes when not needed
dt-bindings: power: drop quotes when not needed
dt-bindings: PCI: host-generic-pci: Allow IOMMU and MSI properties
of/fdt: declared return type does not match actual return type
devicetree/bindings: correct possessive "its" typos
dt-bindings: net: convert emac_rockchip.txt to YAML
dt-bindings: eeprom: microchip,93lc46b: move to eeprom directory
dt-bindings: eeprom: at25: use spi-peripheral-props.yaml
dt-bindings: display: use spi-peripheral-props.yaml
dt-bindings: watchdog: qcom,pm8916-wdt: convert to dtschema
dt-bindings: power: reset: qcom,pon: use absolute path to other schema
dt-bindings: iio/dac: adi,ad5766: Add missing type to 'output-range-microvolts'
dt-bindings: power: supply: charger-manager: Add missing type for 'cm-battery-stat'
dt-bindings: panel: raydium,rm67191: Add missing type to 'video-mode'
of/fdt: Clean up early_init_dt_reserve_memory_arch()
dt-bindings: PCI: fsl,imx6q-pcie: Add missing type for 'reset-gpio-active-high'
dt-bindings: rtc: Add EM Microelectronic EM3027 bindings
dt-bindings: rtc: ds1307: Convert to json-schema
...
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to be
used by the different sensors when registering a thermal zone
(Daniel Lezcano).
- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba).
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
Sang).
- Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
Kozlowski).
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano).
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof).
- Fix array underflow in prep_lookup_table (Dan Carpenter).
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun).
- Fix typos in comments detected on sun8i by Coccinelle (Julia
Lawall).
- Fix typos in comments on rzg2l (Biju Das).
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li).
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov).
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer).
- Fix typo in the comments for the 'tmon' tool (Slark Xiao).
- Make the thermal core use ida_alloc()/free() directly instead of
ida_simple_get()/ida_simple_remove() that have been deprecated
(keliu).
- Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal control
driver (Rafael Wysocki).
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Merge tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These start a rework of the handling of trip points in the thermal
core, improve the cpufreq/devfreq cooling device handling, update some
thermal control drivers and the tmon utility and clean up code.
Specifics:
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to
be used by the different sensors when registering a thermal zone
(Daniel Lezcano).
- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba).
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3
(Wolfram Sang).
- Convert the QCom tsens DT binding to the dtsformat format
(Krzysztof Kozlowski).
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano).
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof).
- Fix array underflow in prep_lookup_table (Dan Carpenter).
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun).
- Fix typos in comments detected on sun8i by Coccinelle (Julia
Lawall).
- Fix typos in comments on rzg2l (Biju Das).
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li).
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov).
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer).
- Fix typo in the comments for the 'tmon' tool (Slark Xiao).
- Make the thermal core use ida_alloc()/free() directly instead of
ida_simple_get()/ida_simple_remove() that have been deprecated
(keliu).
- Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal
control driver (Rafael Wysocki)"
* tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits)
thermal/of: Initialize trip points separately
thermal/of: Use thermal trips stored in the thermal zone
thermal/core: Add thermal_trip in thermal_zone
thermal/core: Rename 'trips' to 'num_trips'
thermal/core: Move thermal_set_delay_jiffies to static
thermal/core: Remove unneeded EXPORT_SYMBOLS
thermal/of: Move thermal_trip structure to thermal.h
thermal/of: Remove the device node pointer for thermal_trip
thermal/of: Replace device node match with device node search
thermal/core: Remove duplicate information when an error occurs
thermal/core: Avoid calling ->get_trip_temp() unnecessarily
thermal/tools/tmon: Fix typo 'the the' in comment
thermal/tools/tmon: Include pthread and time headers in tmon.h
thermal/ti-soc-thermal: Fix comment typo
thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
thermal/drivers/u8500: Remove unnecessary print function dev_err()
thermal/drivers/rzg2l: Fix comments
thermal/drivers/sun8i: Fix typo in comment
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
...
global variable, fix comments and rework the trace information
(Lukasz Luba)
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn)
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
Sang)
- Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
Kozlowski)
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano)
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof)
- Fix array underflow in prep_lookup_table (Dan Carpenter)
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun)
- Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall)
- Fix typos in comments on rzg2l (Biju Das)
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li)
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov)
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer)
- Fix typo in the comments for the 'tmon' tool (Slark Xiao)
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to be
used by the different sensors when registering a thermal zone
(Daniel Lezcano)
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Merge tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal control changes for 5.20-rc1 from Daniel Lezcano:
"- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba)
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn)
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
Sang)
- Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
Kozlowski)
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano)
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof)
- Fix array underflow in prep_lookup_table (Dan Carpenter)
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun)
- Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall)
- Fix typos in comments on rzg2l (Biju Das)
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li)
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov)
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer)
- Fix typo in the comments for the 'tmon' tool (Slark Xiao)
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to be
used by the different sensors when registering a thermal zone
(Daniel Lezcano)"
* tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (36 commits)
thermal/of: Initialize trip points separately
thermal/of: Use thermal trips stored in the thermal zone
thermal/core: Add thermal_trip in thermal_zone
thermal/core: Rename 'trips' to 'num_trips'
thermal/core: Move thermal_set_delay_jiffies to static
thermal/core: Remove unneeded EXPORT_SYMBOLS
thermal/of: Move thermal_trip structure to thermal.h
thermal/of: Remove the device node pointer for thermal_trip
thermal/of: Replace device node match with device node search
thermal/core: Remove duplicate information when an error occurs
thermal/core: Avoid calling ->get_trip_temp() unnecessarily
thermal/tools/tmon: Fix typo 'the the' in comment
thermal/tools/tmon: Include pthread and time headers in tmon.h
thermal/ti-soc-thermal: Fix comment typo
thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
thermal/drivers/u8500: Remove unnecessary print function dev_err()
thermal/drivers/rzg2l: Fix comments
thermal/drivers/sun8i: Fix typo in comment
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
...
Add support for R-Car S4. The S4 IP differs a bit from its siblings in
such way that it has 3 out of 4 TSC nodes for Linux and the interrupts
are not routed to the INTC-AP but to the ECM.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220610201701.7946-2-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When handling the V3U/r8a779a0 exception, avoid using 'not:' because
then its subschemas are far away in the 'else:' branch. Keep them
together using positive logic.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220610201701.7946-1-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert the Qualcomm QPNP PMIC Temperature Alarm to DT Schema.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220608112702.80873-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
In order to replace the fsl,scu txt file from bindings/arm/freescale,
we need to split it between the right subsystems. This patch documents
separately the 'thermal' child node of the SCU main node.
Signed-off-by: Abel Vesa <abel.vesa@nxp.com>
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Bindings:
- Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm, qcom,i2c-qup,
qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new props), qcom,smp2p, TI
timer, Mediatek gnss, Mediatek topckgen, Mediatek apmixedsys, Mediatek
infracfg, fsl,ls-extirq, fsl,layerscape-dcfg, QCom PMIC SPMI,
rda,8810pl-timer, Xilinx zynqmp_ipi, uniphier-pcie, and Ilitek
touchscreen controllers
- Convert various Arm Ltd peripheral IP bindings to schemas
- New bindings for Menlo board CPLD, DH electronics board CPLD,
Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751
GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and Microchip/SMSC
LAN95xx USB Ethernet controllers
- Add vendor prefix for Enclustra
- Add various compatible string additions
- Various example fixes and cleanups
- Remove unused hisilicon,hi6220-reset binding
- Treewide fix properties missing type definition
- Drop some empty and unreferenced .txt bindings
- Documentation improvements for writing schemas
DT driver core:
- Drop static IRQ resources for DT platform devices as IRQ setup is
dynamic and drivers have all been converted to use platform_get_irq()
and friends
- Rework memory allocations and frees for overlays
- Continue overlay notifier callbacks on successful calls and add
unittests
- Handle 'interrupts-extended' in early DT IRQ setup
- Fix of_property_read_string() errors to match documentation
- Ignore disabled nodes in FDT API calls
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Merge tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm,
qcom,i2c-qup, qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new
props), qcom,smp2p, TI timer, Mediatek gnss, Mediatek topckgen,
Mediatek apmixedsys, Mediatek infracfg, fsl,ls-extirq,
fsl,layerscape-dcfg, QCom PMIC SPMI, rda,8810pl-timer, Xilinx
zynqmp_ipi, uniphier-pcie, and Ilitek touchscreen controllers
- Convert various Arm Ltd peripheral IP bindings to schemas
- New bindings for Menlo board CPLD, DH electronics board CPLD,
Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751
GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and
Microchip/SMSC LAN95xx USB Ethernet controllers
- Add vendor prefix for Enclustra
- Add various compatible string additions
- Various example fixes and cleanups
- Remove unused hisilicon,hi6220-reset binding
- Treewide fix properties missing type definition
- Drop some empty and unreferenced .txt bindings
- Documentation improvements for writing schemas
DT driver core:
- Drop static IRQ resources for DT platform devices as IRQ setup is
dynamic and drivers have all been converted to use
platform_get_irq() and friends
- Rework memory allocations and frees for overlays
- Continue overlay notifier callbacks on successful calls and add
unittests
- Handle 'interrupts-extended' in early DT IRQ setup
- Fix of_property_read_string() errors to match documentation
- Ignore disabled nodes in FDT API calls"
* tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (86 commits)
of/irq: fix typo in comment
dt-bindings: Fix properties without any type
Revert "dt-bindings: mailbox: qcom-ipcc: add missing properties into example"
dt-bindings: input: touchscreen: ilitek_ts_i2c: Absorb ili2xxx bindings
dt-bindings: timer: samsung,exynos4210-mct: define strict clock order
dt-bindings: timer: samsung,exynos4210-mct: drop unneeded minItems
dt-bindings: timer: cdns,ttc: drop unneeded minItems
dt-bindings: mailbox: zynqmp_ipi: convert to yaml
dt-bindings: usb: ci-hdrc-usb2: fix node node for ethernet controller
dt-bindings: net: add schema for Microchip/SMSC LAN95xx USB Ethernet controllers
dt-bindings: net: add schema for ASIX USB Ethernet controllers
of/fdt: Ignore disabled memory nodes
dt-bindings: arm: fix typos in compatible
dt-bindings: mfd: Add bindings child nodes for the Mediatek MT6360
dt-bindings: display: convert Arm Komeda to DT schema
dt-bindings: display: convert Arm Mali-DP to DT schema
dt-bindings: display: convert Arm HDLCD to DT schema
dt-bindings: display: convert PL110/PL111 to DT schema
dt-bindings: arm: convert vexpress-config to DT schema
dt-bindings: arm: convert vexpress-sysregs to DT schema
...
Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 J72XX supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220517172920.10857-2-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The Qualcomm SC8280XP platform has three instances of the tsens block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220503153436.960184-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add compatible for the LMh blocks found in the Qualcomm sc8180x
platform.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220502164504.3972938-2-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Document RZ/G2UL TSU bindings. The TSU block on RZ/G2UL is identical to one
found on RZ/G2L SoC. No driver changes are required as generic compatible
string "renesas,rzg2l-tsu" will be used as a fallback.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220501081930.23743-1-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add compatibility string for the thermal sensors on MSM8960/APQ8064
platforms.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220406002648.393486-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add documentation for PMIC5 Gen2 ADC_TM peripheral.
It is used for monitoring ADC channel thresholds for PMIC7-type
PMICs. It is present on PMK8350, like PMIC7 ADC and can be used
to monitor up to 8 ADC channels, from any of the PMIC7 PMICs
on a target, through PBS(Programmable Boot Sequence).
Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1648991869-20899-2-git-send-email-quic_jprakash@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Document RZ/V2L TSU bindings. The TSU block on RZ/V2L is identical to one
found on RZ/G2L SoC. No driver changes are required as generic compatible
string "renesas,rzg2l-tsu" will be used as a fallback.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220308212315.4551-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
- Drop unused 'max-link-speed' in Apple PCIe
- More redundant 'maxItems/minItems' schema fixes
- Support values for pinctrl 'drive-push-pull' and 'drive-open-drain'
- Fix redundant 'unevaluatedProperties' in MT6360 LEDs binding
- Add missing 'power-domains' property to Cadence UFSHC
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Merge tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree fixes from Rob Herring:
- Drop unused 'max-link-speed' in Apple PCIe
- More redundant 'maxItems/minItems' schema fixes
- Support values for pinctrl 'drive-push-pull' and 'drive-open-drain'
- Fix redundant 'unevaluatedProperties' in MT6360 LEDs binding
- Add missing 'power-domains' property to Cadence UFSHC
* tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux:
dt-bindings: pci: apple,pcie: Drop max-link-speed from example
dt-bindings: Drop redundant 'maxItems/minItems' in if/then schemas
dt-bindings: pinctrl: Allow values for drive-push-pull and drive-open-drain
dt-bindings: leds-mt6360: Drop redundant 'unevaluatedProperties'
dt-bindings: ufs: cdns,ufshc: Add power-domains
Another round of removing redundant minItems/maxItems when 'items' list is
specified. This time it is in if/then schemas as the meta-schema was
failing to check this case.
If a property has an 'items' list, then a 'minItems' or 'maxItems' with the
same size as the list is redundant and can be dropped. Note that is DT
schema specific behavior and not standard json-schema behavior. The tooling
will fixup the final schema adding any unspecified minItems/maxItems.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # For MMC
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for IIO
Link: https://lore.kernel.org/r/20220503162738.3827041-1-robh@kernel.org
Krzysztof Kozlowski's @canonical.com email stopped working, so switch to
generic @kernel.org account for all Devicetree bindings.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Link: https://lore.kernel.org/r/20220330074016.12896-2-krzysztof.kozlowski@linaro.org
- Add Krzysztof Kozlowski as co-maintainer for DT bindings providing
much needed help.
- DT schema validation now takes DTB files as input rather than
intermediate YAML files. This decouples the validation from the source
level syntax information. There's a bunch of schema fixes as a result
of switching to DTB based validation which exposed some errors
and incomplete schemas and examples.
- Kbuild improvements to explicitly warn users running 'make
dt_binding_check' on missing yamllint
- Expand DT_SCHEMA_FILES kbuild variable to take just a partial filename
or path instead of the full path to 1 file.
- Convert various bindings to schema format: mscc,vsc7514-switch,
multiple GNSS bindings, ahci-platform, i2c-at91, multiple UFS
bindings, cortina,gemini-sata-bridge, cortina,gemini-ethernet, Atmel
SHA, Atmel TDES, Atmel AES, armv7m-systick, Samsung Exynos display
subsystem, nuvoton,npcm7xx-timer, samsung,s3c2410-i2c, zynqmp_dma,
msm/mdp4, rda,8810pl-uart
- New schemas for u-boot environment variable partition, TI clksel
- New compatible strings for Renesas RZ/V2L SoC
- Vendor prefixes for Xen, HPE, deprecated Synopsys, deprecated HiSilicon
- Add/fix schemas for QEMU Arm 'virt' machine
- Drop unused of_alias_get_alias_list() function
- Add a script to check DT unittest EXPECT message output. Pass messages
also now print by default at PR_INFO level to help test automation.
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Merge tag 'devicetree-for-5.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
- Add Krzysztof Kozlowski as co-maintainer for DT bindings providing
much needed help.
- DT schema validation now takes DTB files as input rather than
intermediate YAML files. This decouples the validation from the
source level syntax information. There's a bunch of schema fixes as a
result of switching to DTB based validation which exposed some errors
and incomplete schemas and examples.
- Kbuild improvements to explicitly warn users running 'make
dt_binding_check' on missing yamllint
- Expand DT_SCHEMA_FILES kbuild variable to take just a partial
filename or path instead of the full path to 1 file.
- Convert various bindings to schema format: mscc,vsc7514-switch,
multiple GNSS bindings, ahci-platform, i2c-at91, multiple UFS
bindings, cortina,gemini-sata-bridge, cortina,gemini-ethernet, Atmel
SHA, Atmel TDES, Atmel AES, armv7m-systick, Samsung Exynos display
subsystem, nuvoton,npcm7xx-timer, samsung,s3c2410-i2c, zynqmp_dma,
msm/mdp4, rda,8810pl-uart
- New schemas for u-boot environment variable partition, TI clksel
- New compatible strings for Renesas RZ/V2L SoC
- Vendor prefixes for Xen, HPE, deprecated Synopsys, deprecated
HiSilicon
- Add/fix schemas for QEMU Arm 'virt' machine
- Drop unused of_alias_get_alias_list() function
- Add a script to check DT unittest EXPECT message output. Pass
messages also now print by default at PR_INFO level to help test
automation.
* tag 'devicetree-for-5.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (96 commits)
dt-bindings: kbuild: Make DT_SCHEMA_LINT a recursive variable
dt-bindings: nvmem: add U-Boot environment variables binding
dt-bindings: ufs: qcom: Add SM6350 compatible string
dt-bindings: dmaengine: sifive,fu540-c000: include generic schema
dt-bindings: gpio: pca95xx: drop useless consumer example
Revert "of: base: Introduce of_alias_get_alias_list() to check alias IDs"
dt-bindings: virtio,mmio: Allow setting devices 'dma-coherent'
dt-bindings: gnss: Add two more chips
dt-bindings: gnss: Rewrite sirfstar binding in YAML
dt-bindings: gnss: Modify u-blox to use common bindings
dt-bindings: gnss: Rewrite common bindings in YAML
dt-bindings: ata: ahci-platform: Add rk3568-dwc-ahci compatible
dt-bindings: ata: ahci-platform: Add power-domains property
dt-bindings: ata: ahci-platform: Convert DT bindings to yaml
dt-bindings: kbuild: Use DTB files for validation
dt-bindings: kbuild: Pass DT_SCHEMA_FILES to dt-validate
dt-bindings: Add QEMU virt machine compatible
dt-bindings: arm: Convert QEMU fw-cfg to DT schema
dt-bindings: i2c: at91: Add SAMA7G5 compatible strings list
dt-bindings: i2c: convert i2c-at91 to json-schema
...
