Rework the currently unused __for_each_thermal_trip() to pass original
pointers to struct thermal_trip objects to the callback, so it can be
used for updating trip data (e.g. temperatures), rename it to
for_each_thermal_trip() and make it available to modular drivers.
Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add a new field called priv to struct thermal_trip to allow thermal
drivers to store pointers to their local data associated with trip
points.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Introduce a new helper function, thermal_zone_device_exec(), that can
be used by drivers to run a given callback routine under the zone lock.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Since commit 3d439b1a2a ("thermal/core: Alloc-copy-free the thermal zone
parameters structure"), thermal_zone_device_register() allocates a copy
of the tzp argument and callers need not explicitly manage its lifetime.
This means the function no longer cares about the parameter being
mutable, so constify it.
No functional change.
Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There are still some drivers needing to play with the thermal zone
device internals. That is not the best but until we can figure out if
the information is really needed, let's encapsulate the field used in
the thermal zone device structure, so we can move forward relocating
the thermal zone device structure definition in the thermal framework
private headers.
Some drivers are accessing tz->device, that implies they need to have
the knowledge of the thermal_zone_device structure but we want to
self-encapsulate this structure and reduce the scope of the structure
to the thermal core only.
By adding this wrapper, these drivers won't need the thermal zone
device structure definition and are no longer an obstacle to its
relocation to the private thermal core headers.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The functions thermal_of_zone_register() and
thermal_of_zone_unregister() are no longer needed from the drivers as
the devm_ variant is always used.
Make them static in the C file and remove their declaration from thermal.h
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-2-daniel.lezcano@linaro.org
Introduce a core thermal API function, thermal_cooling_device_update(),
for updating the max_state value for a cooling device and rearranging
its statistics in sysfs after a possible change of its ->get_max_state()
callback return value.
That callback is now invoked only once, during cooling device
registration, to populate the max_state field in the cooling device
object, so if its return value changes, it needs to be invoked again
and the new return value needs to be stored as max_state. Moreover,
the statistics presented in sysfs need to be rearranged in general,
because there may not be enough room in them to store data for all
of the possible states (in the case when max_state grows).
The new function takes care of that (and some other minor things
related to it), but some extra locking and lockdep annotations are
added in several places too to protect against crashes in the cases
when the statistics are not present or when a stale max_state value
might be used by sysfs attributes.
Note that the actual user of the new function will be added separately.
Link: https://lore.kernel.org/linux-pm/53ec1f06f61c984100868926f282647e57ecfb2d.camel@intel.com/
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
In order to get the thermal zone id but without directly accessing the
thermal zone device structure, add an accessor.
Use the accessor in the hwmon_scmi and acpi_thermal.
No functional change intented.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed via the exported
thermal.h header. This structure should stay private the thermal core
code. In order to encapsulate the structure, let's add an accessor to
get the 'type' of the thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Provide an accessor to the 'devdata' structure and make use of it in
the different drivers.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Mark Brown <broonie@kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
It is slightly better to make the ACPI thermal helper functions retrieve
the trip point temperature only instead of doing the full trip point
initialization, because they are also used for updating some already
registered trip points, in which case initializing a new trip just
in order to update the temperature of an existing one is somewhat
wasteful.
Modify the ACPI thermal helpers accordingly and update their users.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
The set_trip_temp() callback is used when changing the trip temperature
through sysfs. As it is called with the thermal-zone-device lock held
it must not use thermal_zone_get_trip() directly or it will deadlock.
Fixes: 78c3e2429be8 ("thermal/drivers/qcom: Use generic thermal_zone_get_trip() function")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Link: https://lore.kernel.org/r/20221214131617.2447-2-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The thermal zone ops defines a set_trip callback where we can invoke
the backend driver to set an interrupt for the next trip point
temperature being crossed the way up or down, or setting the low level
with the hysteresis.
The ops is only called from the thermal sysfs code where the userspace
has the ability to modify a trip point characteristic.
With the effort of encapsulating the thermal framework core code,
let's create a thermal_zone_set_trip() which is the writable side of
the thermal_zone_get_trip() and put there all the ops encapsulation.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-4-daniel.lezcano@linaro.org
The thermal_zone_device_ops structure defines a set of ops family,
get_trip_temp(), get_trip_hyst(), get_trip_type(). Each of them is
returning a property of a trip point.
The result is the code is calling the ops everywhere to get a trip
point which is supposed to be defined in the backend driver. It is a
non-sense as a thermal trip can be generic and used by the backend
driver to declare its trip points.
Part of the thermal framework has been changed and all the OF thermal
drivers are using the same definition for the trip point and use a
thermal zone registration variant to pass those trip points which are
part of the thermal zone device structure.
Consequently, we can use a generic function to get the trip points
when they are stored in the thermal zone device structure.
This approach can be generalized to all the drivers and we can get rid
of the ops->get_trip_*. That will result to a much more simpler code
and make possible to rework how the thermal trip are handled in the
thermal core framework as discussed previously.
This change adds a function thermal_zone_get_trip() where we get the
thermal trip point structure which contains all the properties (type,
temp, hyst) instead of doing multiple calls to ops->get_trip_*.
That opens the door for trip point extension with more attributes. For
instance, replacing the trip points disabled bitmask with a 'disabled'
field in the structure.
Here we replace all the calls to ops->get_trip_* in the thermal core
code with a call to the thermal_zone_get_trip() function.
The thermal zone ops defines a callback to retrieve the critical
temperature. As the trip handling is being reworked, all the trip
points will be the same whatever the driver and consequently finding
the critical trip temperature will be just a loop to search for a
critical trip point type.
Provide such a generic function, so we encapsulate the ops
get_crit_temp() which can be removed when all the backend drivers are
using the generic trip points handling.
While at it, add the thermal_zone_get_num_trips() to encapsulate the
code more and reduce the grip with the thermal framework internals.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-2-daniel.lezcano@linaro.org
In cur_state_store(), the new state of the cooling device is received
from user-space and is not validated by the thermal core but the same is
left for the individual drivers to take care of. Apart from duplicating
the code it leaves possibility for introducing bugs where a driver may
not do it right.
Lets make the thermal core check the new state itself and store the max
value in the cooling device structure.
Link: https://lore.kernel.org/all/Y0ltRJRjO7AkawvE@kili/
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
On one of the Chrome system, if we define more than 12 trip points,
probe for thermal sensor fails with
"int3403 thermal: probe of INTC1046:03 failed with error -22"
and throws an error as
"thermal_sys: Error: Incorrect number of thermal trips".
The thermal_zone_device_register() interface needs maximum
number of trip points supported in a zone as an argument.
This number can't exceed THERMAL_MAX_TRIPS, which is currently
set to 12. To address this issue, THERMAL_MAX_TRIPS value
has to be increased.
This interface also has an argument to specify a mask of trips
which are writable. This mask is defined as an int.
This mask sets the ceiling for increasing maximum number of
supported trips. With the current implementation, maximum number
of trips can be supported is 31.
Also, THERMAL_MAX_TRIPS macro is used in one place only.
So, remove THERMAL_MAX_TRIPS macro and compare num_trips
directly with using a macro BITS_PER_TYPE(int)-1.
Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Reviewed-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The following changes are reworking entirely the thermal device tree
initialization. The old version is kept until the different drivers
using it are converted to the new API.
The old approach creates the different actors independently. This
approach is the source of the code duplication in the thermal OF
because a thermal zone is created but a sensor is registered
after. The thermal zones are created unconditionnaly with a fake
sensor at init time, thus forcing to provide fake ops and store all
the thermal zone related information in duplicated structures. Then
the sensor is initialized and the code looks up the thermal zone name
using the device tree. Then the sensor is associated to the thermal
zone, and the sensor specific ops are called with a second level of
indirection from the thermal zone ops.
When a sensor is removed (with a module unload), the thermal zone
stays there with the fake sensor.
The cooling device associated with a thermal zone and a trip point is
stored in a list, again duplicating information, using the node name
of the device tree to match afterwards the cooling devices.
The new approach is simpler, it creates a thermal zone when the sensor
is registered and destroys it when the sensor is removed. All the
matching between the cooling device, trip points and thermal zones are
done using the device tree, as well as bindings. The ops are no longer
specific but uses the generic ones provided by the thermal framework.
When the old code won't have any users, it can be removed and the
remaining thermal OF code will be much simpler.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-2-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The thermal trip points are properties of a thermal zone and the
different sub systems should be able to save them in the thermal zone
structure instead of having their own definition.
Give the opportunity to the drivers to create a thermal zone with
thermal trips which will be accessible directly from the thermal core
framework.
As we added the thermal trip points structure in the thermal zone,
let's extend the thermal zone register function to have the thermal
trip structures as a parameter and store it in the 'trips' field of
the thermal zone structure.
The thermal zone contains the trip point, we can store them directly
when registering the thermal zone. That will allow another step
forward to remove the duplicate thermal zone structure we find in the
thermal_of code.
Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220722200007.1839356-9-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
In order to use thermal trips defined in the thermal structure, rename
the 'trips' field to 'num_trips' to have the 'trips' field containing the
thermal trip points.
Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220722200007.1839356-8-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The structure thermal_trip is now generic and will be usable by the
different sensor drivers in place of their own structure.
Move its definition to thermal.h to make it accessible.
Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20220722200007.1839356-5-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The trends DROP_FULL and RAISE_FULL are not used and were never used
in the past AFAICT. Remove these conditions as they seems to not be
handled anywhere.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220629151012.3115773-2-daniel.lezcano@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The sensor driver which register through thermal_of interface doesn't
have an option to get thermal zone mode change notification from
thermal core.
Add support for change_mode ops in thermal_of interface so that sensor
driver can use this ops for mode change notification.
Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Link: https://lore.kernel.org/r/1646767586-31908-1-git-send-email-quic_manafm@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
There are two pairs of declarations for thermal_cooling_device_register()
and thermal_of_cooling_device_register(), and only one set was changed
in a recent patch, so the other one now causes a compile-time warning:
drivers/net/wireless/mediatek/mt76/mt7915/init.c: In function 'mt7915_thermal_init':
drivers/net/wireless/mediatek/mt76/mt7915/init.c:134:48: error: passing argument 1 of 'thermal_cooling_device_register' discards 'const' qualifier from pointer target type [-Werror=discarded-qualifiers]
134 | cdev = thermal_cooling_device_register(wiphy_name(wiphy), phy,
| ^~~~~~~~~~~~~~~~~
In file included from drivers/net/wireless/mediatek/mt76/mt7915/init.c:7:
include/linux/thermal.h:407:39: note: expected 'char *' but argument is of type 'const char *'
407 | thermal_cooling_device_register(char *type, void *devdata,
| ~~~~~~^~~~
Change the dummy helper functions to have the same arguments as the
normal version.
Fixes: f991de53a8 ("thermal: make device_register's type argument const")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210722090717.1116748-1-arnd@kernel.org
thermal_notify_framework just updates for a single trip point where as
thermal_zone_device_update does other bookkeeping like updating the
temperature of the thermal zone and setting the next trip point. The only
driver that was using thermal_notify_framework was updated in the previous
patch to use thermal_zone_device_update instead. Since there are no users
for thermal_notify_framework remove it.
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210122023406.3500424-3-thara.gopinath@linaro.org
We want to have any kind of name for the cooling devices as we do no
longer want to rely on auto-numbering. Let's replace the cooling
device's fixed array by a char pointer to be allocated dynamically
when registering the cooling device, so we don't limit the length of
the name.
Rework the error path at the same time as we have to rollback the
allocations in case of error.
Tested with a dummy device having the name:
"Llanfairpwllgwyngyllgogerychwyrndrobwllllantysiliogogogoch"
A village on the island of Anglesey (Wales), known to have the longest
name in Europe.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Ido Schimmel <idosch@nvidia.com>
Link: https://lore.kernel.org/r/20210314111333.16551-1-daniel.lezcano@linaro.org
The change of the cooling device state should be used by the governor
or at least by the core code, not by the drivers themselves.
Remove the API usage and move the function declaration to the internal
headers.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20210118173824.9970-1-daniel.lezcano@linaro.org
The code does no longer use the ms unit based fields to set the
delays as they are replaced by the jiffies.
Remove them and replace their user to use the jiffies version instead.
Cc: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Peter Kästle <peter@piie.net>
Acked-by: Hans de Goede <hdegoede@redhat.com>
Link: https://lore.kernel.org/r/20201216220337.839878-3-daniel.lezcano@linaro.org
The delays are stored in ms units and when the polling function is
called this delay is converted into jiffies at each call.
Instead of doing the conversion again and again, compute the jiffies
at init time and use the value directly when setting the polling.
Cc: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20201216220337.839878-1-daniel.lezcano@linaro.org
The code was reorganized in 2012 with the commit 0c01ebbfd3.
The main change is a loop on the trip points array and a unconditional
call to the throttle() ops of the governors for each of them even if
the trip temperature is not reached yet.
With this change, the 'forced_passive' is no longer checked in the
thermal_zone_device_update() function but in the step wise governor's
throttle() callback.
As the force_passive does no belong to the trip point array, the
thermal_zone_device_update() can not compare with the specified
passive temperature, thus does not detect the passive limit has been
crossed. Consequently, throttle() is never called and the
'forced_passive' branch is unreached.
In addition, the default processor cooling device is not automatically
bound to the thermal zone if there is not passive trip point, thus the
'forced_passive' can not operate.
If there is an active trip point, then the throttle function will be
called to mitigate at this temperature and the 'forced_passive' will
override the mitigation of the active trip point in this case but with
the default cooling device bound to the thermal zone, so usually a
fan, and that is not a passive cooling effect.
Given the regression exists since more than 8 years, nobody complained
and at the best of my knowledge there is no bug open in
https://bugzilla.kernel.org, it is reasonable to say it is unused.
Remove the 'forced_passive' related code.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20201214233811.485669-1-daniel.lezcano@linaro.org
Currently there is no way to the sensors to directly call an ops in
interrupt mode without calling thermal_zone_device_update assuming all
the trip points are defined.
A sensor may want to do something special if a trip point is hot or
critical.
This patch adds the critical and hot ops to the thermal zone device,
so a sensor can directly invoke them or let the thermal framework to
call the sensor specific ones.
Tested-by: Kai-Heng Feng <kai.heng.feng@canonical.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20201210121514.25760-2-daniel.lezcano@linaro.org
1. devfreq_cooling.c: The variable *tz is not used in
devfreq_cooling_get_requested_power(), devfreq_cooling_state2power()
and devfreq_cooling_power2state().
2. cpufreq_cooling.c: After 84fe2cab48, the variable *tz is not used
anymore in cpufreq_get_requested_power(), cpufreq_state2power() and
cpufreq_power2state().
Remove the variable *tz.
Signed-off-by: zhuguangqing <zhuguangqing@xiaomi.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200914071101.13575-1-zhuguangqing83@gmail.com
This event is sent by the platform firmware to confirm that
user space thermal solution is alive. The response to this event
from the user space thermal solution is platform specific.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200915223650.406046-3-srinivas.pandruvada@linux.intel.com
Initially the thermal framework had a very simple notification
mechanism to send generic netlink messages to the userspace.
The notification function was never called from anywhere and the
corresponding dead code was removed. It was probably a first attempt
to introduce the netlink notification.
At LPC2018, the presentation "Linux thermal: User kernel interface",
proposed to create the notifications to the userspace via a kfifo.
The advantage of the kfifo is the performance. It is usually used from
a 1:1 communication channel where a driver captures data and sends it
as fast as possible to a userspace process.
The drawback is that only one process uses the notification channel
exclusively, thus no other process is allowed to use the channel to
get temperature or notifications.
This patch defines a generic netlink API to discover the current
thermal setup and adds event notifications as well as temperature
sampling. As any genetlink protocol, it can evolve and the versioning
allows to keep the backward compatibility.
In order to prevent the user from getting flooded with data on a
single channel, there are two multicast channels, one for the
temperature sampling when the thermal zone is updated and another one
for the events, so the user can get the events only without the
thermal zone temperature sampling.
Also, a list of commands to discover the thermal setup is added and
can be extended when needed.
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200706105538.2159-3-daniel.lezcano@linaro.org
set_mode() is only called when tzd's mode is about to change. Actual
setting is performed in thermal_core, in thermal_zone_device_set_mode().
The meaning of set_mode() callback is actually to notify the driver about
the mode being changed and giving the driver a chance to oppose such
change.
To better reflect the purpose of the method rename it to change_mode()
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-12-andrzej.p@collabora.com
Prepare for making the drivers not access tzd's private members.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
[staticize thermal_zone_device_set_mode()]
Signed-off-by: kernel test robot <lkp@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-7-andrzej.p@collabora.com
get_mode() is now redundant, as the state is stored in struct
thermal_zone_device.
Consequently the "mode" attribute in sysfs can always be visible, because
it is always possible to get the mode from struct tzd.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-6-andrzej.p@collabora.com
Prepare for changing the place where the mode is stored: now it is in
drivers, which might or might not implement get_mode()/set_mode() methods.
A lot of cleanup can be done thanks to storing it in struct tzd. The
get_mode() methods will become redundant.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-4-andrzej.p@collabora.com
All users of the function depends on THERMAL, no stub is
needed. Remove it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-9-daniel.lezcano@linaro.org
All callers of the functions depends on THERMAL, it is pointless to
define stubs. Remove them.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-8-daniel.lezcano@linaro.org
The thermal framework can not be compiled as a module. The IS_ENABLED
macro is useless here and can be replaced by an ifdef.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-7-daniel.lezcano@linaro.org
The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-6-daniel.lezcano@linaro.org
The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-5-daniel.lezcano@linaro.org
The struct thermal_trip is only used by the thermal internals, it is
pointless to export the definition in the global header.
Move the structure to the thermal_core.h internal header.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-4-daniel.lezcano@linaro.org
The exported IPA functions are used by the IPA. It is pointless to
declare the functions in the thermal.h file.
For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the code in the thermal core internal
header file.
As the users depends on THERMAL then it is pointless to have the stub,
remove them.
Take also the opportunity to fix checkpatch warnings/errors when
moving the code around.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-3-daniel.lezcano@linaro.org
The structure belongs to the thermal core internals but it is exported
in the include/linux/thermal.h
For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the structure in the thermal core internal
header file.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-2-daniel.lezcano@linaro.org
The default governor set at compilation time is a thermal internal
business, no need to export to the global thermal header.
Move the config options to the internal header.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-1-daniel.lezcano@linaro.org
The function thermal_zone_set_trips() is used by the thermal core code
in order to update the next trip points, there are no other users.
Move the function definition in the thermal_core.h, remove the
EXPORT_SYMBOL_GPL and document the function.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200331165449.30355-1-daniel.lezcano@linaro.org
Add "inline" to thermal_zone_of_get_sensor_id() function to avoid below
build warning of !defined(CONFIG_THERMAL_OF).
In file included from drivers/hwmon/hwmon.c:22:
include/linux/thermal.h:382:12: warning: 'thermal_zone_of_get_sensor_id'
defined but not used [-Wunused-function]
382 | static int thermal_zone_of_get_sensor_id(struct device_node *tz_np,
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reported-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1583222684-10229-1-git-send-email-Anson.Huang@nxp.com
This patch adds new API thermal_zone_of_get_sensor_id() to
provide the feature of getting sensor ID from DT thermal
zone's node. It's useful for thermal driver to register the
specific thermal zone devices from DT in a common way.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-2-git-send-email-Anson.Huang@nxp.com
Rename the thermal documentation files to ReST, add an
index for them and adjust in order to produce a nice html
output via the Sphinx build system.
At its new index.rst, let's add a :orphan: while this is not linked to
the main index.rst file, in order to avoid build warnings.
Signed-off-by: Mauro Carvalho Chehab <mchehab+samsung@kernel.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
- Remove the 'module' Kconfig option for thermal subsystem framework
because the thermal framework are required to be ready as early as
possible to avoid overheat at boot time (Daniel Lezcano)
- Fix a bug that thermal framework pokes disabled thermal zones upon
resume (Wei Wang)
- A couple of cleanups and trivial fixes on int340x thermal drivers
(Srinivas Pandruvada, Zhang Rui, Sumeet Pawnikar)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
drivers: thermal: processor_thermal: Downgrade error message
mlxsw: Remove obsolete dependency on THERMAL=m
hwmon/drivers/core: Simplify complex dependency
thermal/drivers/core: Fix typo in the option name
thermal/drivers/core: Remove depends on THERMAL in Kconfig
thermal/drivers/core: Remove module unload code
thermal/drivers/core: Remove the module Kconfig's option
thermal: core: skip update disabled thermal zones after suspend
thermal: make device_register's type argument const
thermal: intel: int340x: processor_thermal_device: simplify to get driver data
thermal/int3403_thermal: favor _TMP instead of PTYP
thermal_of_cooling_device_register() and thermal_cooling_device_register()
are typically called from driver probe functions, and
thermal_cooling_device_unregister() is called from remove functions. This
makes both a perfect candidate for device managed functions.
Introduce devm_thermal_of_cooling_device_register(). This function can
also be used to replace thermal_cooling_device_register() by passing a NULL
pointer as device node. The new function requires both struct device *
and struct device_node * as parameters since the struct device_node *
parameter is not always identical to dev->of_node.
Don't introduce a device managed remove function since it is not needed
at this point.
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
...because it can be, the buffer is strlcpy'd into a local buffer in a
thermal struct member.
Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This extends the sysfs interface for thermal cooling devices and exposes
some pretty useful statistics. These statistics have proven to be quite
useful specially while doing benchmarks related to the task scheduler,
where we want to make sure that nothing has disrupted the test,
specially the cooling device which may have put constraints on the CPUs.
The information exposed here tells us to what extent the CPUs were
constrained by the thermal framework.
The write-only "reset" file is used to reset the statistics.
The read-only "time_in_state_ms" file shows the time (in msec) spent by the
device in the respective cooling states, and it prints one line per
cooling state.
The read-only "total_trans" file shows single positive integer value
showing the total number of cooling state transitions the device has
gone through since the time the cooling device is registered or the time
when statistics were reset last.
The read-only "trans_table" file shows a two dimensional matrix, where
an entry <i,j> (row i, column j) represents the number of transitions
from State_i to State_j.
This is how the directory structure looks like for a single cooling
device:
$ ls -R /sys/class/thermal/cooling_device0/
/sys/class/thermal/cooling_device0/:
cur_state max_state power stats subsystem type uevent
/sys/class/thermal/cooling_device0/power:
autosuspend_delay_ms runtime_active_time runtime_suspended_time
control runtime_status
/sys/class/thermal/cooling_device0/stats:
reset time_in_state_ms total_trans trans_table
This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and
ARM 64-bit Hisilicon hikey960 board running Android.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Here, prototype of thermal_zone_device_register is not matching
with static inline thermal_zone_device_register. One is using
const thermal_zone_params. Other is using non-const.
Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Some BIOS implement ACPI notification code 0x83 to indicate active
relationship table(ART) and/or thermal relationship table(TRT) changes
to INT3400 device. This event needs to be propagated to user space so
that it can be handled by the user space thermal daemon.
Signed-off-by: Brian Bian <brian.bian@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The thermal core does not use the ability to look up pointers by ID, so
convert it from using an IDR to the more space-efficient IDA.
Signed-off-by: Matthew Wilcox <mawilcox@microsoft.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Finally, move the last thermal zone sysfs attributes to
tz->device.groups: trips attributes. This requires adding a
attribute_group to thermal_zone_device, creating it dynamically, and
then setting all trips attributes in it. The trips attribute is then
added to the tz->device.groups.
As the removal of all attributes are handled by device core, the device
remove calls are not needed anymore.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The .get_trend callback in struct thermal_zone_device_ops has
the prototype:
int (*get_trend) (struct thermal_zone_device *, int,
enum thermal_trend *);
whereas the .get_trend callback in struct thermal_zone_of_device_ops
has:
int (*get_trend)(void *, long *);
Streamline both prototypes and add the trip argument to the OF callback
aswell and use enum thermal_trend * instead of an integer pointer.
While the OF prototype may be the better one, this should be decided at
framework level and not on OF level.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This adds support for hardware-tracked trip points to the device tree
thermal sensor framework.
The framework supports an arbitrary number of trip points. Whenever
the current temperature is updated, the trip points immediately
below and above the current temperature are found. A .set_trips
callback is then called with the temperatures. If there is no trip
point above or below the current temperature, the passed trip
temperature will be -INT_MAX or INT_MAX respectively. In this callback,
the driver should program the hardware such that it is notified
when either of these trip points are triggered. When a trip point
is triggered, the driver should call `thermal_zone_device_update'
for the respective thermal zone. This will cause the trip points
to be updated again.
If .set_trips is not implemented, the framework behaves as before.
This patch is based on an earlier version from Mikko Perttunen
<mikko.perttunen@kapsi.fi>
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add apis for platform thermal drivers to query for slope and offset
attributes, which might be needed for temperature calculations.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In current of-thermal, the .set_trip_temp only support to
set trip_temp for SW. But some sensors support to set
trip_temp on hardware, so that can trigger interrupt,
shutdown or any other events.
This patch adds .set_trip_temp() callback in
thermal_zone_of_device_ops{}, so that the sensor device can
use it to set trip_temp on hardware.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The commit 17e8351a77 consistently use int for temperature,
however it missed a few in trip temperature and thermal_core.
In current codes, the trip->temperature used "unsigned long"
and zone->temperature used"int", if the temperature is negative
value, it will get wrong result when compare temperature with
trip temperature.
This patch can fix it.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In some cases, platform thermal driver may report invalid trip points,
thermal core should not take any action for these trip points.
This fixed a regression that bogus trip point starts to screw up thermal
control on some Lenovo laptops, after
commit bb431ba26c
Author: Zhang Rui <rui.zhang@intel.com>
Date: Fri Oct 30 16:31:47 2015 +0800
Thermal: initialize thermal zone device correctly
After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().
Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
CC: <stable@vger.kernel.org> #3.18+
Link: https://bugzilla.redhat.com/show_bug.cgi?id=1317190
Link: https://bugzilla.kernel.org/show_bug.cgi?id=114551
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add resource managed version of thermal_zone_of_sensor_register() and
thermal_zone_of_sensor_unregister().
This helps in reducing the code size in error path, remove of
driver remove callbacks and making proper sequence for deallocations.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When a new cooling device is registered, we need to update the
thermal zone to set the new registered cooling device to a proper
state.
This fixes a problem that the system is cool, while the fan devices
are left running on full speed after boot, if fan device is registered
after thermal zone device.
Here is the history of why current patch looks like this:
https://patchwork.kernel.org/patch/7273041/
CC: <stable@vger.kernel.org> #3.18+
Reference:https://bugzilla.kernel.org/show_bug.cgi?id=92431
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().
Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.
CC: <stable@vger.kernel.org> #3.18+
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
When the prototype for thermal_zone_bind_cooling_device
changed, the static inline wrapper function was left alone,
which in theory can cause build warnings:
I have seen this error in the past:
drivers/thermal/db8500_thermal.c: In function 'db8500_cdev_bind':
drivers/thermal/db8500_thermal.c:78:9: error: too many arguments to function 'thermal_zone_bind_cooling_device'
ret = thermal_zone_bind_cooling_device(thermal, i, cdev,
while this one no longer shows up, there is no doubt that
the prototype is still wrong, so let's just fix it anyway.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: 6cd9e9f629 ("thermal: of: fix cooling device weights in device tree")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The macros KELVIN_TO_CELSIUS and CELSIUS_TO_KELVIN actually convert
between deciKelvins and Celsius, so rename them to reflect that. While
at it, use a statement expression in DECI_KELVIN_TO_CELSIUS to prevent
expanding the argument multiple times and get rid of a few casts.
Signed-off-by: Rasmus Villemoes <linux@rasmusvillemoes.dk>
Acked-by: Darren Hart <dvhart@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The thermal core already has a function to get the maximum power of a
cooling device: power_actor_get_max_power(). Add a function to get the
minimum power of a cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Daniel Kurtz <djkurtz@chromium.org>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
thermal_zone_of_sensor_register is documented as returning a pointer
to either a valid thermal_zone_device on success, or a corresponding
ERR_PTR() value.
In contrast, the function returns NULL when THERMAL_OF is configured
off. Fix this.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal code uses int, long and unsigned long for temperatures
in different places.
Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.
'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.
Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Darren Hart <dvhart@linux.intel.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Reviewed-by: Peter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.
This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.
The constants are available through sysfs.
It is up to the device driver to determine
the usage of these values.
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.
This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.
The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add three optional callbacks to the cooling device interface to allow
them to express power. In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
A governor may need to store its current state between calls to
throttle(). That state depends on the thermal zone, so store it as
private data in struct thermal_zone_device.
The governors may have two new ops: bind_to_tz() and unbind_from_tz().
When provided, these functions let governors do some initialization
and teardown when they are bound/unbound to a tz and possibly store that
information in the governor_data field of the struct
thermal_zone_device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone. The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100. This complicates setups, as you need to know
in advance how many cooling devices you are going to have. If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone. Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.
This patch generalizes the concept of weight by allowing any number to
be a "weight". Weights are now relative to each other. Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.
It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to. This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100. If they do, you get the same behavior as
before. If they don't, fair share now works for that platform.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.
Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.
While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When CONFIG_THERMAL is not enabled, it is better to introduce
equivalent dummy functions in the exported header than to
introduce #ifdeffery in drivers using the function.
This will prevent issues such as that reported in:
http://www.spinics.net/lists/linux-next/msg31573.html
While at it switch over to IS_ENABLED for thermal macros
to allow for thermal framework to be built as framework
and relevant APIs be usable by relevant drivers as a result.
Reported-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The size of unsigned long varies between 32 and 64 bit systems while
the size of phandle arguments is always 32 bits per parameter.
On 64-bit systems, cooling devices registered via of-thermal apis fail
to bind when the min/max cooling state is specified as
THERMAL_NO_LIMIT (-1UL) as there is a mis-match between the value read
from the device tree (32bit) and the pre-processor define (64bit).
As we're unlikely to need cooling states larger than 32 bits, and for
consistency with the size of phandle arguments, explicitly limit
THERMAL_NO_LIMIT to 32 bits.
Reported-by: Hyungwoo Yang <hwoo.yang@gmail.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
include/linux/thermal.h contains definitions for the Thermal generic
netlink family, but none of the valuable information relevant to
user-space such as the Genl family name, multicast group, version or
command set and data types is exported to user-space.
Export all the relevant generic netlink information to user-space to
make this genl family usable by user-space, and while at it, export
THERMAL_NAME_LENGTH since it limits name length for thermal_hwmon
devices.
Kbuild and MAINTAINERS are also updated accordingly to reflect this new
file: include/uapi/linux/thermal.h.
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Before this change it was only possible to set get_temp() and get_trend()
methods to be used in the common code handling passing parameters via
device tree to "cpu-thermal" CPU thermal zone device.
Now it is possible to also set emulated value of temperature for debug
purposes.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
