Add support for continuous data capture using triggered buffers for the
tmp006 sensor. The device features a "data ready" interrupt line which
is pulled down once a new measurement is ready to be read.
Signed-off-by: Antoni Pokusinski <apokusinski01@gmail.com>
Link: https://patch.msgid.link/20240908172153.177406-2-apokusinski01@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
MLX90635 is an Infra Red contactless temperature sensor most suitable
for consumer applications where measured object temperature is in range
between -20 to 100 degrees Celsius. It has improved accuracy for
measurements within temperature range of human body and can operate in
ambient temperature range between -20 to 85 degrees Celsius.
Driver provides simple power management possibility as it returns to
lowest possible power mode (Step sleep mode) in which temperature
measurements can still be performed, yet for continuous measuring it
switches to Continuous power mode where measurements constantly change
without triggering.
Signed-off-by: Crt Mori<cmo@melexis.com>
Link: https://lore.kernel.org/r/c6590e4fb8d993a5317b486a3e45e1bb6e9e3318.1701872051.git.cmo@melexis.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
TMP117 is a Digital temperature sensor with integrated Non-Volatile memory.
Add support for tmp117 driver in iio subsystem.
Datasheet: https://www.ti.com/lit/gpn/tmp117
Signed-off-by: Puranjay Mohan <puranjay12@gmail.com>
Reviewed-by: Andy Shevchenko <andy.shevchenko@gmail.com>
Reviewed-by: Lars-Peter Clausen <lars@metafoo.de>
Link: https://lore.kernel.org/r/20210407182147.77221-3-puranjay12@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
During commit 067fda1c06 ("iio: hid-sensors: move triggered buffer
setup into hid_sensor_setup_trigger"), the
iio_triggered_buffer_{setup,cleanup}() functions got moved under the
hid-sensor-trigger module.
The above change works fine, if any of the sensors get built. However, when
only the common hid-sensor-trigger module gets built (and none of the
drivers), then the IIO_TRIGGERED_BUFFER symbol isn't selected/enforced.
Previously, each driver would enforce/select the IIO_TRIGGERED_BUFFER
symbol. With this change the HID_SENSOR_IIO_TRIGGER (for the
hid-sensor-trigger module) will enforce that IIO_TRIGGERED_BUFFER gets
selected.
All HID sensor drivers select the HID_SENSOR_IIO_TRIGGER symbol. So, this
change removes the IIO_TRIGGERED_BUFFER enforcement from each driver.
Fixes: 067fda1c06 ("iio: hid-sensors: move triggered buffer setup into hid_sensor_setup_trigger")
Reported-by: Thomas Deutschmann <whissi@gentoo.org>
Cc: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Alexandru Ardelean <aardelean@deviqon.com>
Acked-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://lore.kernel.org/r/20210414084955.260117-1-aardelean@deviqon.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
This patch adds support for the Azoteq IQS620AT temperature sensor,
capable of reporting its absolute die temperature.
Signed-off-by: Jeff LaBundy <jeff@labundy.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
The LTC2983 is a Multi-Sensor High Accuracy Digital Temperature
Measurement System. It measures a wide variety of temperature sensors and
digitally outputs the result, in °C or °F, with 0.1°C accuracy and
0.001°C resolution. It can measure the temperature of all standard
thermocouples (type B,E,J,K,N,S,R,T), standard 2-,3-,4-wire RTDs,
thermistors and diodes.
Signed-off-by: Nuno Sá <nuno.sa@analog.com>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Add SPDX license identifiers to all Make/Kconfig files which:
- Have no license information of any form
These files fall under the project license, GPL v2 only. The resulting SPDX
license identifier is:
GPL-2.0-only
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch adds support for Maxim MAX31856 thermocouple
temperature sensor support.
More information can be found in:
https://www.maximintegrated.com/en/ds/MAX31856.pdf
NOTE: Driver support only Comparator Mode.
Signed-off-by: Paresh Chaudhary <paresh.chaudhary@rockwellcollins.com>
Signed-off-by: Matt Weber <matthew.weber@rockwellcollins.com>
Signed-off-by: Patrick Havelange <patrick.havelange@essensium.com>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Formatting of Kconfig files doesn't look so pretty, so just
take damp cloth and clean it up.
Signed-off-by: Enrico Weigelt, metux IT consult <info@metux.net>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Melexis has just released Infra Red temperature sensor MLX90632 used
for contact-less temperature measurement. Driver provides basic
functionality for reporting object (and ambient) temperature with
support for object emissivity.
Signed-off-by: Crt Mori <cmo@melexis.com>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Environmental temperature sensor is a hid defined sensor,
it measures temperature.
More information can be found in:
http://www.usb.org/developers/hidpage/HUTRR39b.pdf
According to IIO ABI definition, IIO_TEMP data output unit is
milli degrees Celsius. Add the unit convert from degree to milli degree.
Signed-off-by: Song Hongyan <hongyan.song@intel.com>
Acked-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
This patch adds support for TI TMP007 - 16 bit IR thermopile sensor with integrated Math engine.
Sensor takes care of calculating the object temperature with the help of calibrated constants stored in non-volatile memory,
thereby reducing the calculation overhead.
Signed-off-by: Manivannan Sadhasivam <manivannanece23@gmail.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Select IIO_BUFFER and IIO_TRIGGERED_BUFFER to compile maxim_thermocouple.
Signed-off-by: Alison Schofield <amsfield22@gmail.com>
Cc: Daniel Baluta <daniel.baluta@gmail.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Add initial driver support for MAX6675, and MAX31855 thermocouple chips.
Cc: Marek Vasut <marex@denx.de>
Cc: Matt Porter <mporter@konsulko.com>
Signed-off-by: Matt Ranostay <mranostay@gmail.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Support for TSYS02D temperature sensor
Signed-off-by: Ludovic Tancerel <ludovic.tancerel@maplehightech.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
Support for TSYS01 temperature sensor
Signed-off-by: Ludovic Tancerel <ludovic.tancerel@maplehightech.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
the TI TMP006 is a non-contact temperature sensor with I2C interface;
it measures the surface temperature of a distance object using a
thermopile to absorb IR energy emitted from the object
the sensor has two channels: IR sensor voltage (16-bit) and reference
temperature of the chip (14-bit); datasheet is here:
http://www.ti.com/lit/ds/symlink/tmp006.pdf
v2 (thanks to Grygorii Strashko, Lars-Peter Clausen, Jonathan Cameron
for review comments):
* power down device on driver remove
* use sign_extend32()
* style cleanup
* add comments what channel raw LSBs mean
* spelling of thermopile
Signed-off-by: Peter Meerwald <pmeerw@pmeerw.net>
Cc: Grygorii Strashko <grygorii.strashko@ti.com>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Jonathan Cameron <jic23@kernel.org>
Cc: LM Sensors <lm-sensors@lm-sensors.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
