Modify license to include dual licensing as GPL-2.0-only OR MIT
license for SoC and TI evm device tree files. This allows for Linux
kernel device tree to be used in other Operating System ecosystems
such as Zephyr or FreeBSD.
While at this, update the GPL-2.0 to be GPL-2.0-only to be in sync
with latest SPDX conventions (GPL-2.0 is deprecated).
While at this, update the TI copyright year to sync with current year
to indicate license change (and add it at least for one file which was
missing TI copyright).
Cc: Christian Gmeiner <christian.gmeiner@gmail.com>
Cc: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Cc: Matthias Schiffer <matthias.schiffer@ew.tq-group.com>
Cc: Pierre Gondois <pierre.gondois@arm.com>
Cc: Roger Quadros <rogerq@kernel.org>
Cc: Tony Lindgren <tony@atomide.com>
Cc: Wadim Egorov <w.egorov@phytec.de>
Acked-by: Christian Gmeiner <christian.gmeiner@gmail.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Matthias Schiffer <matthias.schiffer@ew.tq-group.com>
Acked-by: Pierre Gondois <pierre.gondois@arm.com>
Acked-by: Roger Quadros <rogerq@kernel.org>
Acked-by: Tony Lindgren <tony@atomide.com>
Acked-by: Wadim Egorov <w.egorov@phytec.de>
Signed-off-by: Nishanth Menon <nm@ti.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20240122145539.194512-6-nm@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
bootph-all as phase tag was added to dt-schema
(dtschema/schemas/bootph.yaml) to describe various node usage during
boot phases with DT.
On TI K3 AM642 SoC, only esm nodes are exclusively used by R5
bootloader, rest of the dts nodes with bootph-* are used by later boot
stages also.
Add bootph-all for all other nodes that are used in the bootloader on
K3 AM642 SoC, and bootph-pre-ram is not needed specifically for any
other node in kernel dts.
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/20230911172902.1057417-2-nm@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
The am64x supports a single VTM module which is located in the main
domain with two associated temperature monitors located at different hot
spots on the die.
Tested-by: Christian Gmeiner <christian.gmeiner@gmail.com>
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20230405215328.3755561-2-bb@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Drop bootargs and add aliases based on base pinout of SK as per [1] and
evm per [2].
Indices chosen attempt to maintain some level of consistency with
existing aliases.
While at this, drop a extra EoL. While this patch could be split, it
seems trivial to add additional cleanup steps.
[1] https://www.ti.com/lit/df/sprr432/sprr432.pdf
[2] https://www.ti.com/lit/zip/swrr171
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Roger Quadros <rogerq@kernel.org>
Link: https://lore.kernel.org/r/20230414073328.381336-11-nm@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
The DTS uses hardware register values directly in pin controller pin
configuration and not an abstraction of any form.
These definitions were previously put in the bindings header to avoid
code duplication and to provide some context meaning (name), but they
do not fit the purpose of bindings.
Store the constants in a header next to DTS and use them instead of
bindings.
Suggested-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Suggested-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Link: https://lore.kernel.org/all/c4d53e9c-dac0-8ccc-dc86-faada324beba@linaro.org/
Link: https://lore.kernel.org/r/20230315155228.1566883-3-nm@ti.com
Signed-off-by: Nishanth Menon <nm@ti.com>
Add the address space for the SA2UL in MAIN domain to the ranges property
of the cbass_main interconnect node so that the addresses within the
corresponding sram nodes and its children can be translated properly by
the relevant OF address API.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Jayesh Choudhary <j-choudhary@ti.com>
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Reviewed-by: Kamlesh Gurudasani <kamlesh@ti.com>
Link: https://lore.kernel.org/r/20220711085743.10128-2-j-choudhary@ti.com
AM64x SoCs have two ESM modules, with one in MAIN voltage domain and the
other in MCU voltage domain. The error output from Main ESM module can
be routed to the MCU ESM module. The error output of MCU ESM can be
configured to reset the device. The MCU ESM configuration address space
is already opened and this patch opens the MAIN ESM configuration
address space.
For ESM details please refer technical reference manual at
https://www.ti.com/lit/pdf/spruim2
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Christian Gmeiner <christian.gmeiner@gmail.com>
Link: https://lore.kernel.org/r/20220210172246.27871-1-hnagalla@ti.com
Add the needed bus mappings for the two main RTI memory ranges and
the required device tree nodes in the main domain.
Signed-off-by: Christian Gmeiner <christian.gmeiner@gmail.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Acked-By: Hari Nagalla <hnagalla@ti.com>
Link: https://lore.kernel.org/r/20220111134552.800704-1-christian.gmeiner@gmail.com
Signed-off-by: Nishanth Menon <nm@ti.com>
Since probe order of mmc can vary depending on device tree dependencies,
Lets try and introduce a consistent definition of what mmc0, 1 are
across platforms.
NOTE: Certain platforms may choose to have overrides due to various
legacy reasons, we permit that in the board specific alias definition.
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Aswath Govindraju <a-govindraju@ti.com>
Link: https://lore.kernel.org/r/20210915135415.5706-1-nm@ti.com
Add CPSW3g DT node with two external ports, MDIO and CPTS support. For
CPSW3g DMA channels the ASEL is set to 15 (AM642x per DMA channel coherency
feature), so that CPSW DMA channel participates in Coherency and thus avoid
need to cache maintenance for SKBs. This improves bidirectional TCP
performance by up to 100Mbps (on 1G link).
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Signed-off-by: Grygorii Strashko <grygorii.strashko@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20210304211038.12511-2-grygorii.strashko@ti.com
The AM642 SoC belongs to the K3 Multicore SoC architecture platform,
providing advanced system integration to enable applications such as
Motor Drives, PLC, Remote IO and IoT Gateways.
Some highlights of this SoC are:
* Dual Cortex-A53s in a single cluster, two clusters of dual Cortex-R5F
MCUs, and a single Cortex-M4F.
* Two Gigabit Industrial Communication Subsystems (ICSSG).
* Integrated Ethernet switch supporting up to a total of two external
ports.
* PCIe-GEN2x1L, USB3/USB2, 2xCAN-FD, eMMC and SD, UFS, OSPI memory
controller, QSPI, I2C, eCAP/eQEP, ePWM, ADC, among other
peripherals.
* Centralized System Controller for Security, Power, and Resource
Management (DMSC).
See AM64X Technical Reference Manual (SPRUIM2, Nov 2020)
for further details: https://www.ti.com/lit/pdf/spruim2
Introduce basic support for the AM642 SoC to enable ramdisk or MMC
boot. Introduce the sdhci, i2c, spi, and uart MAIN domain periperhals
under cbass_main and the i2c, spi, and uart MCU domain periperhals
under cbass_mcu.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Faiz Abbas <faiz_abbas@ti.com>
Signed-off-by: Aswath Govindraju <a-govindraju@ti.com>
Signed-off-by: Dave Gerlach <d-gerlach@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Tested-by: Kishon Vijay Abraham I <kishon@ti.com>
Reviewed-by: Grygorii Strashko <grygorii.strashko@ti.com>
Link: https://lore.kernel.org/r/20210226144257.5470-4-d-gerlach@ti.com
