Commit Graph

5 Commits

Author SHA1 Message Date
Krzysztof Kozlowski
a985dceccd dt-bindings: thermal: ti,j72xx: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-20-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
84e85359f4 dt-bindings: drop redundant part of title (end, part three)
The Devicetree bindings document does not have to say in the title that
it is a "binding", but instead just describe the hardware.

Drop trailing "bindings" in various forms (also with trailing full
stop):

  find Documentation/devicetree/bindings/ -type f -name '*.yaml' \
    -not -name 'trivial-devices.yaml' \
    -exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \;

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media
Acked-by: Sebastian Reichel <sre@kernel.org> # power
Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq
Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring <robh@kernel.org>
2022-12-16 11:41:49 -06:00
Bryan Brattlof
c4026d3e25 dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
Only some of TI's J721E SoCs will need a eFuse register range mapped to
determine if they're affected by TI's i2128 erratum. All other SoC will
not need this eFuse range to function properly

Update the bindings for the k3_j72xx_bandgap thermal driver so other
devices will only need two register ranges

Signed-off-by: Bryan Brattlof <bb@ti.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-7-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:41 +01:00
Bryan Brattlof
effe8db0a4 dt-bindings: thermal: k3-j72xx: elaborate on binding description
Elaborate on the function of this device node as well as some of the
properties this node uses.

Signed-off-by: Bryan Brattlof <bb@ti.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-6-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:25:41 +01:00
Keerthy
031c2952d1 dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 J72XX supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220517172920.10857-2-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:53 +02:00