Update the binding with the BCM74110 compatible string which denotes the
first device we need to support in a different process node requiring an
updated thermal equation.
Signed-off-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250116193842.758788-2-florian.fainelli@broadcom.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Preferred indentation for DTS examples in the bindings is 4-space. It
is also preferred not to have redundant/unused labels. No functional
change
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-22-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Simplify few bindings which already reference thermal-sensor.yaml schema
by dropping unneeded requiring of '#thermal-sensor-cells' and dropping
assigned-clocks properties (core schema allows it if 'clocks' are
there).
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-21-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
