Add Tegra264 compatible strings to APE subsystem device bindings:
- audio-graph-card: Due to different PLL clock rate.
- admaif: Due to 32 channels supported and register offset changes.
- i2s: Due to 32 channels supported and register offset changes.
- amx/adx: Due to 32 channels supported and register offset changes.
- asrc: Due to different ARAM address.
- ahub: Due to AHUB IPs number of instances updates.
- for future proofing the T264 compatibility is added for other device
nodes.
These bindings enable the enhanced audio features of Tegra264
while maintaining compatibility with existing platforms.
Signed-off-by: Sheetal <sheetal@nvidia.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20250512051747.1026770-3-sheetal@nvidia.com
Signed-off-by: Mark Brown <broonie@kernel.org>
Rename name-prefix.yaml into common DAI schema and document
'#sound-dai-cells' for completeness. The '#sound-dai-cells' cannot be
really constrained, as there are users with value of 0, 1 and 2, but at
least it brings definition to one common place.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221203160442.69594-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Mark Brown <broonie@kernel.org>
This patch adds YAML schema for DT bindings of few AHUB modules.
These devices will be registered as ASoC components and bindings
will be used on Tegra210 and later chips. The bindings for below
mentioned modules are added:
* SFC (Sampling Frequency Converter)
* MVC (Master Volume Control)
* AMX (Audio Multiplexer)
* ADX (Audio Demultiplexer)
* Mixer
Signed-off-by: Sameer Pujar <spujar@nvidia.com>
Cc: Rob Herring <robh+dt@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1631551342-25469-5-git-send-email-spujar@nvidia.com
Signed-off-by: Mark Brown <broonie@kernel.org>
