Commit Graph

183 Commits

Author SHA1 Message Date
Linus Torvalds
115e74a29b soc: dt changes for 6.17
There are a few new variants of existing chips:
 
  - mt6572 is an older mobile phone chip from mediatek that was
    extremely popular a decade ago but never got upstreamed until now.
 
  - exynos2200 is a recent high-end mobile phone chip used in a
    few Samsung phones like the Galaxy S22
 
  - Renesas R-Car V4M-7 (R8A779H2) is an updated version of R-Car V4M
    (R8A779H0) and used in automotive applications
 
  - Tegra264 is a new chip from NVIDIA, but support is fairly minimal
    for now, and not much information is public about it.
 
 There are five more chips in a separate branch, as those are new
 chip families that I merged along with the necessary infrastructure.
 
 New board support is not that exciting, with a total of 33 newly
 added machines here:
 
  - Evaluation platforms for the chips above, plus TI am62d2 and
    Sophgo sg2042.
 
  - Six 32-bit industrial boards based on stm32, imx6 and am33 chips,
    plus eight 64-bit rockchips rk33xx/rk35xx, am62d2, t527, imx8 and
    imx95.
 
  - Two newly added ASPEED BMC based motherboards, and one that got
    removed
 
  - Phones and Tablets based on 32-bit mt6572, tegra30 and 64-bit
    msm8976 SoCs
 
  - Three Laptops based on Mediatek mt8186 and Qualcomm Snapdragon X1
 
  - A set-top box based on Amlogic meson-gxm.
 
 Updates for existing machines are spread over all the above families.
 One notable change here is support for the RP1 I/O chip used in
 Raspberry Pi 5.
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Merge tag 'soc-dt-6.17' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc

Pull SoC devicetree updates from Arnd Bergmann:
 "There are a few new variants of existing chips:

   - mt6572 is an older mobile phone chip from mediatek that was
     extremely popular a decade ago but never got upstreamed until now

   - exynos2200 is a recent high-end mobile phone chip used in a few
     Samsung phones like the Galaxy S22

   - Renesas R-Car V4M-7 (R8A779H2) is an updated version of R-Car V4M
     (R8A779H0) and used in automotive applications

   - Tegra264 is a new chip from NVIDIA, but support is fairly minimal
     for now, and not much information is public about it

  There are five more chips in a separate branch, as those are new chip
  families that I merged along with the necessary infrastructure.

  New board support is not that exciting, with a total of 33 newly added
  machines here:

   - Evaluation platforms for the chips above, plus TI am62d2 and Sophgo
     sg2042

   - Six 32-bit industrial boards based on stm32, imx6 and am33 chips,
     plus eight 64-bit rockchips rk33xx/rk35xx, am62d2, t527, imx8 and
     imx95

   - Two newly added ASPEED BMC based motherboards, and one that got
     removed

   - Phones and Tablets based on 32-bit mt6572, tegra30 and 64-bit
     msm8976 SoCs

   - Three Laptops based on Mediatek mt8186 and Qualcomm Snapdragon X1

   - A set-top box based on Amlogic meson-gxm

  Updates for existing machines are spread over all the above families.
  One notable change here is support for the RP1 I/O chip used in
  Raspberry Pi 5"

* tag 'soc-dt-6.17' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (606 commits)
  riscv: dts: sophgo: fix mdio node name for CV180X
  riscv: dts: sophgo: sophgo-srd3-10: reserve uart0 device
  riscv: dts: sophgo: add Sophgo SG2042_EVB_V2.0 board device tree
  riscv: dts: sophgo: add Sophgo SG2042_EVB_V1.X board device tree
  dt-bindings: riscv: add Sophgo SG2042_EVB_V1.X/V2.0 bindings
  riscv: dts: sophgo: add ethernet GMAC device for sg2042
  riscv: dts: sophgo: Enable ethernet device for Huashan Pi
  riscv: dts: sophgo: Add mdio multiplexer device for cv18xx
  riscv: dts: sophgo: Add ethernet device for cv18xx
  riscv: dts: sophgo: sg2044: add pmu configuration
  riscv: dts: sophgo: sg2044: add ziccrse extension
  riscv: dts: sophgo: add zfh for sg2042
  riscv: dts: sophgo: add ziccrse for sg2042
  riscv: dts: sophgo: Add xtheadvector to the sg2042 devicetree
  riscv: dts: sophgo: sg2044: add PCIe device support for SG2044
  riscv: dts: sophgo: sg2044: add MSI device support for SG2044
  riscv: dts: sophgo: add reset configuration for Sophgo CV1800 series SoC
  riscv: dts: sophgo: add reset generator for Sophgo CV1800 series SoC
  dt-bindings: soc: sophgo: Move SoCs/boards from riscv into soc, add SG2000
  riscv: dts: sophgo: sg2044: Add missing riscv,cbop-block-size property
  ...
2025-07-29 11:04:52 -07:00
Georgi Djakov
ca652cf0c2 Merge branch 'icc-milos' into icc-next
Add documentation and driver for the interconnect on the Milos SoC.

* icc-milos
  dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in Qualcomm Milos SoC
  interconnect: qcom: Add Milos interconnect provider driver

Link: https://lore.kernel.org/r/20250709-sm7635-icc-v3-0-c446203c3b3a@fairphone.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-22 14:41:12 +03:00
Luca Weiss
0f29e33fba dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in Qualcomm Milos SoC
Document the RPMh Network-On-Chip Interconnect of the Milos (e.g.
SM7635) SoC.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Link: https://lore.kernel.org/r/20250709-sm7635-icc-v3-1-c446203c3b3a@fairphone.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-21 19:41:07 +03:00
Konrad Dybcio
a234cffd04 dt-bindings: interconnect: qcom,msm8998-bwmon: Allow 'nonposted-mmio'
One of the BWMON instances on SM8750 requires that its MMIO space is
mapped specifically with the nE memory attribute.

Allow the nonposted-mmio property which instructs the OS to do so.

Signed-off-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250716-8750_cpubwmon-v4-1-12212098e90f@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18 17:54:58 +03:00
Raviteja Laggyshetty
a95571d8ff dt-bindings: interconnect: Add EPSS L3 compatible for QCS8300 SoC
Add Epoch Subsystem (EPSS) L3 interconnect provider binding for
QCS8300 SoC. As the EPSS hardware in QCS8300 and SA8775P are same,
added a family-level compatible for SA877P SoC. This shared fallback
compatible allows grouping of SoCs with similar hardware, reducing
the need to explicitly list each variant in the driver match table.

Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250711102540.143-2-raviteja.laggyshetty@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18 17:54:58 +03:00
Luca Weiss
a8d7161d1d dt-bindings: interconnect: qcom: Remove double colon from description
No double colon is necessary in the description. Fix it for all bindings
so future bindings won't have the same copy-paste mistake.

Reported-by: Rob Herring <robh@kernel.org>
Closes: https://lore.kernel.org/lkml/20250625150458.GA1182597-robh@kernel.org/
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250717-bindings-double-colon-v1-2-c04abc180fcd@fairphone.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-18 17:54:58 +03:00
Frank Wunderlich
bd9e0f5d90
dt-bindings: interconnect: add mt7988-cci compatible
Add compatible for Mediatek MT7988 SoC with mediatek,mt8183-cci fallback
which is taken by driver.

Signed-off-by: Frank Wunderlich <frank-w@public-files.de>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Georgi Djakov <djakov@kernel.org>
Link: https://lore.kernel.org/r/20250706132213.20412-8-linux@fw-web.de
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
2025-07-07 10:57:03 +02:00
Georgi Djakov
5fed7fe33c Merge branch 'icc-sa8775p' into icc-next
Add Epoch Subsystem (EPSS) L3 provider support on SA8775P SoCs.

Current interconnect framework is based on static IDs for creating node
and registering with framework. This becomes a limitation for topologies
where there are multiple instances of same interconnect provider.
Modified interconnect framework APIs to create and link icc node with
dynamic IDs, this will help to overcome the dependency on static IDs.

* icc-sa8775p
  dt-bindings: interconnect: Add EPSS L3 compatible for SA8775P
  interconnect: core: Add dynamic id allocation support
  interconnect: qcom: Add multidev EPSS L3 support
  interconnect: qcom: icc-rpmh: Add dynamic icc node id support
  interconnect: qcom: sa8775p: Add dynamic icc node id support

Link: https://lore.kernel.org/r/20250415095343.32125-1-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-05-19 17:09:50 +03:00
Krzysztof Kozlowski
af73692e7b dt-bindings: interconnect: Correct indentation and style in DTS example
DTS example in the bindings should be indented with 2- or 4-spaces and
aligned with opening '- |', so correct any differences like 3-spaces or
mixtures 2- and 4-spaces in one binding.  While re-indenting, drop
unused labels.

No functional changes here, but saves some comments during reviews of
new patches built on existing code.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: "Rob Herring (Arm)" <robh@kernel.org>
Link: https://lore.kernel.org/r/20250324125302.82167-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-04-28 17:46:35 +03:00
Raviteja Laggyshetty
289198fb51 dt-bindings: interconnect: Add EPSS L3 compatible for SA8775P
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on
SA8775P SoCs.
The L3 instance on the SA8775P SoC is similar to those on SoCs
like SM8250 and SC7280. These SoCs use the PERF register instead
of L3_REG for programming the performance level, which is managed
in the data associated with the target-specific compatibles.
Since the hardware remains the same across all EPSS-supporting SoCs,
the generic compatible is retained for all SoCs.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
Link: https://lore.kernel.org/r/20250415095343.32125-2-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-04-15 14:13:30 +03:00
Georgi Djakov
4cc0047169 Merge branch 'icc-sm8750' into icc-next
Add interconnect support for SM8750 SoC.

The Qualcomm Technologies, Inc. SM8750 SoC is the latest in the line of
consumer mobile device SoCs.

* icc-sm8750
  dt-bindings: interconnect: add interconnect bindings for SM8750
  interconnect: qcom: Add interconnect provider driver for SM8750
  interconnect: sm8750: Add missing const to static qcom_icc_desc

Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-0-3d9aad4200e9@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-14 00:13:23 +02:00
Shivnandan Kumar
94f51cbb34 dt-bindings: interconnect: qcom,msm8998-bwmon: Add SM8750 CPU BWMONs
Document the SM8750 BWMONs, which has one instance per cluster of
BWMONv4.

Signed-off-by: Shivnandan Kumar <quic_kshivnan@quicinc.com>
Signed-off-by: Melody Olvera <quic_molvera@quicinc.com>
Link: https://lore.kernel.org/r/20250113-sm8750_bwmon_master-v1-1-f082da3a3308@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-14 00:12:49 +02:00
Neil Armstrong
f56c1b6db5 dt-bindings: interconnect: OSM L3: Document sm8650 OSM L3 compatible
Document the OSM L3 found in the Qualcomm SM8650 platform.

Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250110-topic-sm8650-ddr-bw-scaling-v1-1-041d836b084c@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-13 20:00:25 +02:00
Lijuan Gao
576a67fbec dt-bindings: interconnect: qcom-bwmon: Document QCS615 bwmon compatibles
Document QCS615 BWMONs, which includes one BWMONv4 instance for CPU to
LLCC path bandwidth monitoring and one BWMONv5 instance for LLCC to DDR
path bandwidth monitoring.

Signed-off-by: Lijuan Gao <quic_lijuang@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20241218-add_bwmon_support_for_qcs615-v1-1-680d798a19e5@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-01-13 20:00:25 +02:00
Raviteja Laggyshetty
2102773c60 dt-bindings: interconnect: add interconnect bindings for SM8750
Add interconnect device bindings. These devices can be used
to describe any RPMh and NoC based interconnect devices.

Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
Signed-off-by: Melody Olvera <quic_molvera@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-1-3d9aad4200e9@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-12-17 14:05:37 +02:00
Georgi Djakov
b1fd28da86 Merge branch 'icc-sar2130p' into icc-next
Add driver for the network of connects present on the SAR2130P platform.

* icc-sar2130p
  dt-bindings: interconnect: qcom: document SAR2130P NoC
  interconnect: qcom: add support for SAR2130P

Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-0-c58c73dcd19d@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05 01:32:05 +02:00
Georgi Djakov
55aac0ea75 Merge branch 'icc-qcs615' into icc-next
Add interconnect dt-bindings and driver support for Qualcomm QCS615 SoC.

* icc-qcs615
  dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoC
  interconnect: qcom: add QCS615 interconnect provider driver

Link: https://lore.kernel.org/r/20240924143958.25-1-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05 01:30:52 +02:00
Georgi Djakov
3b7dd9d88c Merge branch 'icc-qcs8300' into icc-next
Add interconnect support for QCS8300 SoC

* icc-qcs8300
  dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS8300 SoC
  interconnect: qcom: add QCS8300 interconnect provider driver

Link: https://lore.kernel.org/r/20240910101013.3020-1-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05 01:28:34 +02:00
Jingyi Wang
c603accc26 dt-bindings: interconnect: qcom-bwmon: Document QCS8300 bwmon compatibles
Document QCS8300 BWMONs, which has two BWMONv4 instances for the CPU->LLCC
path and one BWMONv5 instance for LLCC->DDR path.

Signed-off-by: Jingyi Wang <quic_jingyw@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Link: https://lore.kernel.org/r/20240925-qcs8300_bwmon_binding-v1-1-a7bfd94b2854@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22 13:04:35 +03:00
Dmitry Baryshkov
bc2bb73216 dt-bindings: interconnect: qcom: document SAR2130P NoC
Add bindings for the Network of Connects (NoC) present on the
Qualcomm SAR2130P platform.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-1-c58c73dcd19d@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22 12:27:31 +03:00
Raviteja Laggyshetty
6c5e948f1f dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoC
Document the RPMh Network-On-Chip Interconnect of the QCS615 platform.

Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Link: https://lore.kernel.org/r/20240924143958.25-2-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22 11:30:02 +03:00
Raviteja Laggyshetty
6fa115569d dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS8300 SoC
Document the RPMh Network-On-Chip Interconnect of the QCS8300 platform.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
Link: https://lore.kernel.org/r/20240910101013.3020-2-quic_rlaggysh@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22 11:21:45 +03:00
Greg Kroah-Hartman
9d06852b24 interconnect changes for 6.12
This pull request contains the interconnect changes for the 6.12-rc1 merge
 window. It contains new drivers and fixes with the following highlights:
 
 Driver changes:
 - New driver for MSM8976 platforms
 - New driver for MSM8937 platforms
 - Enable sync_state for SM8250 platforms
 - Enable QoS support for QCS404
 - Add ab_coeff bandwidth adjustments for MSM8953
 - Drop the unsupported yet DISP nodes on SM8350 platforms
 - Fix missed num_nodes initialization in icc-clk driver
 - Misc DT and documentation fixes
 
 Signed-off-by: Georgi Djakov <djakov@kernel.org>
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Merge tag 'icc-6.12-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/djakov/icc into char-misc-next

Georgi writes:

interconnect changes for 6.12

This pull request contains the interconnect changes for the 6.12-rc1 merge
window. It contains new drivers and fixes with the following highlights:

Driver changes:
- New driver for MSM8976 platforms
- New driver for MSM8937 platforms
- Enable sync_state for SM8250 platforms
- Enable QoS support for QCS404
- Add ab_coeff bandwidth adjustments for MSM8953
- Drop the unsupported yet DISP nodes on SM8350 platforms
- Fix missed num_nodes initialization in icc-clk driver
- Misc DT and documentation fixes

Signed-off-by: Georgi Djakov <djakov@kernel.org>

* tag 'icc-6.12-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/djakov/icc:
  dt-bindings: interconnect: qcom: Do not require reg for sc8180x virt NoCs
  dt-bindings: interconnect: qcom-bwmon: Document SA8775p bwmon compatibles
  dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in description
  interconnect: qcom: msm8953: Add ab_coeff
  dt-bindings: interconnect: qcom: msm8939: Fix example
  interconnect: qcom: qcs404: Add regmaps and more bus descriptions
  interconnect: qcom: qcs404: Mark AP-owned nodes as such
  interconnect: qcom: Add MSM8937 interconnect provider driver
  interconnect: qcom: sm8250: Enable sync_state
  dt-bindings: interconnect: qcom,sm8350: drop DISP nodes
  interconnect: qcom: sm8350: drop DISP nodes
  dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoC
  interconnect: qcom: Add MSM8976 interconnect provider driver
  dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoC
  interconnect: icc-clk: Add missed num_nodes initialization
  dt-bindings: interconnect: qcom,rpmh: correct sm8150 camnoc
2024-09-06 19:17:16 +02:00
Georgi Djakov
f7d27c1cc8 Merge branch 'icc-misc' into icc-next
This series introduce new ICC drivers for some legacy socs
while at it also updates a bit of qcs404 driver which seems
to not receive much attention lately.

* icc-misc
  dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoC
  interconnect: qcom: Add MSM8976 interconnect provider driver
  dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoC
  interconnect: qcom: Add MSM8937 interconnect provider driver
  interconnect: qcom: qcs404: Mark AP-owned nodes as such
  interconnect: qcom: qcs404: Add regmaps and more bus descriptions
  dt-bindings: interconnect: qcom: msm8939: Fix example
  interconnect: qcom: msm8953: Add ab_coeff
  dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in description

Link: https://lore.kernel.org/all/20240709102728.15349-1-a39.skl@gmail.com/
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-26 01:36:14 +03:00
Georgi Djakov
0af96a3e95 dt-bindings: interconnect: qcom: Do not require reg for sc8180x virt NoCs
The virtual interconnect providers do not have their own IO address space,
but this is not documented in the DT schema and the following warnings are
reported by dtbs_check:

sc8180x-lenovo-flex-5g.dtb: interconnect-camnoc-virt: 'reg' is a required property
sc8180x-lenovo-flex-5g.dtb: interconnect-mc-virt: 'reg' is a required property
sc8180x-lenovo-flex-5g.dtb: interconnect-qup-virt: 'reg' is a required property
sc8180x-primus.dtb: interconnect-camnoc-virt: 'reg' is a required property
sc8180x-primus.dtb: interconnect-mc-virt: 'reg' is a required property
sc8180x-primus.dtb: interconnect-qup-virt: 'reg' is a required property

Fix this by adding them to the list of compatibles that do not require
the reg property.

Link: https://lore.kernel.org/r/20240730141016.1142608-1-djakov@kernel.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-26 01:35:50 +03:00
Tengfei Fan
647eaa8f54 dt-bindings: interconnect: qcom-bwmon: Document SA8775p bwmon compatibles
Document the compatibles used to describe the bwmons present on the
SA8775p platform.

Signed-off-by: Tengfei Fan <quic_tengfan@quicinc.com>
Link: https://lore.kernel.org/r/20240730-add_sa8775p_bwmon-v1-1-f4f878da29ae@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-26 01:34:16 +03:00
Adam Skladowski
69704bbbc0 dt-bindings: interconnect: qcom: msm8953: Fix 'See also' in description
"See also" in description seems to be wrongly defined,
make it inline with other yamls.

Fixes: 791ed23f73 ("dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC")
Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20240709102728.15349-10-a39.skl@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-24 02:54:43 +03:00
Adam Skladowski
123d2b96c1 dt-bindings: interconnect: qcom: msm8939: Fix example
For now example list snoc_mm as children of bimc which is obviously
not valid, drop bimc and move snoc_mm into snoc.

Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Link: https://lore.kernel.org/r/20240709102728.15349-8-a39.skl@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-24 02:54:43 +03:00
Adam Skladowski
4937dc0ffc dt-bindings: interconnect: qcom: Add Qualcomm MSM8937 NoC
Add bindings for Qualcomm MSM8937 Network-On-Chip interconnect devices.

Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20240709102728.15349-4-a39.skl@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23 21:19:38 +03:00
Adam Skladowski
e5b9032b1b dt-bindings: interconnect: qcom: Add Qualcomm MSM8976 NoC
Add bindings for Qualcomm MSM8976 Network-On-Chip interconnect devices.

Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20240709102728.15349-2-a39.skl@gmail.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23 21:19:16 +03:00
Rayyan Ansari
7d59b1ff71 dt-bindings: interconnect: qcom,rpmh: correct sm8150 camnoc
The sm8150 camnoc interconnect was mistakenly documented as
"qcom,sm8150-camnoc-noc", for which there is no reference to in
drivers or device tree.

Correct this to "qcom,sm8150-camnoc-virt".

Signed-off-by: Rayyan Ansari <rayyan.ansari@linaro.org>
Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240716144738.109823-1-rayyan.ansari@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23 18:39:29 +03:00
Konrad Dybcio
0710c3d304 dt-bindings: Batch-update Konrad Dybcio's email
Use my @kernel.org address everywhere.

Signed-off-by: Konrad Dybcio <konradybcio@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240726-topic-konrad_email-v1-3-f94665da2919@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2024-07-29 13:35:47 -06:00
Linus Torvalds
acc5965b9f Char/Misc and other driver changes for 6.11-rc1
Here is the "big" set of char/misc and other driver subsystem changes
 for 6.11-rc1.  Nothing major in here, just loads of new drivers and
 updates.  Included in here are:
   - IIO api updates and new drivers added
   - wait_interruptable_timeout() api cleanups for some drivers
   - MODULE_DESCRIPTION() additions for loads of drivers
   - parport out-of-bounds fix
   - interconnect driver updates and additions
   - mhi driver updates and additions
   - w1 driver fixes
   - binder speedups and fixes
   - eeprom driver updates
   - coresight driver updates
   - counter driver update
   - new misc driver additions
   - other minor api updates
 
 All of these, EXCEPT for the final Kconfig build fix for 32bit systems,
 have been in linux-next for a while with no reported issues.  The
 Kconfig fixup went in 29 hours ago, so might have missed the latest
 linux-next, but was acked by everyone involved.
 
 Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Merge tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc

Pull char / misc and other driver updates from Greg KH:
 "Here is the "big" set of char/misc and other driver subsystem changes
  for 6.11-rc1. Nothing major in here, just loads of new drivers and
  updates. Included in here are:

   - IIO api updates and new drivers added

   - wait_interruptable_timeout() api cleanups for some drivers

   - MODULE_DESCRIPTION() additions for loads of drivers

   - parport out-of-bounds fix

   - interconnect driver updates and additions

   - mhi driver updates and additions

   - w1 driver fixes

   - binder speedups and fixes

   - eeprom driver updates

   - coresight driver updates

   - counter driver update

   - new misc driver additions

   - other minor api updates

  All of these, EXCEPT for the final Kconfig build fix for 32bit
  systems, have been in linux-next for a while with no reported issues.
  The Kconfig fixup went in 29 hours ago, so might have missed the
  latest linux-next, but was acked by everyone involved"

* tag 'char-misc-6.11-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (330 commits)
  misc: Kconfig: exclude mrvl-cn10k-dpi compilation for 32-bit systems
  misc: delete Makefile.rej
  binder: fix hang of unregistered readers
  misc: Kconfig: add a new dependency for MARVELL_CN10K_DPI
  virtio: add missing MODULE_DESCRIPTION() macro
  agp: uninorth: add missing MODULE_DESCRIPTION() macro
  spmi: add missing MODULE_DESCRIPTION() macros
  dev/parport: fix the array out-of-bounds risk
  samples: configfs: add missing MODULE_DESCRIPTION() macro
  misc: mrvl-cn10k-dpi: add Octeon CN10K DPI administrative driver
  misc: keba: Fix missing AUXILIARY_BUS dependency
  slimbus: Fix struct and documentation alignment in stream.c
  MAINTAINERS: CC dri-devel list on Qualcomm FastRPC patches
  misc: fastrpc: use coherent pool for untranslated Compute Banks
  misc: fastrpc: support complete DMA pool access to the DSP
  misc: fastrpc: add missing MODULE_DESCRIPTION() macro
  misc: fastrpc: Add missing dev_err newlines
  misc: fastrpc: Use memdup_user()
  nvmem: core: Implement force_ro sysfs attribute
  nvmem: Use sysfs_emit() for type attribute
  ...
2024-07-19 15:55:08 -07:00
Georgi Djakov
226e58b209 Merge branch 'icc-rpmh-qos' into icc-next
This series adds QoS support for QNOC type device which can be found on
SC7280 platform. It adds support for programming priority,
priority forward disable and urgency forwarding. This helps in
priortizing the traffic originating from different interconnect masters
at NOC (Network On Chip).

* icc-rpmh-qos
  dt-bindings: interconnect: add clock property to enable QOS on SC7280
  interconnect: qcom: icc-rpmh: Add QoS configuration support
  interconnect: qcom: sc7280: enable QoS configuration
  interconnect: qcom: Fix DT backwards compatibility for QoS

Link: https://lore.kernel.org/r/20240607173927.26321-1-quic_okukatla@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-07-04 22:45:20 +03:00
Georgi Djakov
19990ff048 Merge branch 'icc-msm8953' into icc-next
Add interconnect driver for MSM8953-based devices.

* icc-msm8953
  dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC
  interconnect: qcom: Add MSM8953 driver

Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-0-a70d582182dc@mainlining.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-07-04 22:41:12 +03:00
Vladimir Lypak
791ed23f73 dt-bindings: interconnect: qcom: Add Qualcomm MSM8953 NoC
Add the device-tree bindings for interconnect providers
used on MSM8953 platform.

Signed-off-by: Vladimir Lypak <vladimir.lypak@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org>
Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-1-a70d582182dc@mainlining.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-28 21:11:14 +03:00
Sibi Sankar
530c66142e dt-bindings: interconnect: qcom,msm8998-bwmon: Add X1E80100 BWMON instances
Document X1E80100 BWMONs, which has multiple (one per cluster) BWMONv4
instances for the CPU->LLCC path and one BWMONv5 instance for LLCC->DDR
path.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com>
Acked-by: Georgi Djakov <djakov@kernel.org>
Link: https://lore.kernel.org/r/20240624092214.146935-3-quic_sibis@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2024-06-25 23:22:43 -05:00
Sibi Sankar
f92e224e7a dt-bindings: interconnect: qcom,msm8998-bwmon: Remove opp-table from the required list
Remove opp-table from the required list as the bindings shouldn't care
where the OPP tables (referenced by the operating-points-v2 property)
comes from.

Suggested-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Georgi Djakov <djakov@kernel.org>
Link: https://lore.kernel.org/r/20240624092214.146935-2-quic_sibis@quicinc.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2024-06-25 23:22:43 -05:00
Odelu Kukatla
6822b0c92b dt-bindings: interconnect: add clock property to enable QOS on SC7280
Add clock property to enable the clocks required for accessing
QoS configuration registers.

Signed-off-by: Odelu Kukatla <quic_okukatla@quicinc.com>
Acked-by: "Rob Herring (Arm)" <robh@kernel.org>
Link: https://lore.kernel.org/r/20240607173927.26321-4-quic_okukatla@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-24 15:20:27 +03:00
AngeloGioacchino Del Regno
1a8009e108 dt-bindings: interconnect: Add MediaTek EMI Interconnect bindings
Add bindings for the MediaTek External Memory Interface Interconnect,
which providers support system bandwidth requirements through Dynamic
Voltage Frequency Scaling Resource Collector (DVFSRC) hardware.

This adds bindings for MediaTek MT8183 and MT8195 SoCs.

Note that this is modeled as a subnode of DVFSRC for multiple reasons:
 - Some SoCs have more than one interconnect on the DVFSRC (and two
   different kinds of EMI interconnect, and also a SMI interconnect);

 - Some boards will want to not enable the interconnect driver because
   some of those are not battery powered (so they just keep the knobs
   at full thrust from the bootloader and never care scaling busses);

 - Some DVFSRC interconnect features may depend on firmware.

Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20240610085735.147134-3-angelogioacchino.delregno@collabora.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-13 14:31:42 +03:00
Georgi Djakov
d1c1649113 Merge branch 'icc-sm7150' into icc-next
Add dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC.

* icc-sm7150
  dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings
  interconnect: qcom: Add SM7150 driver support

Link: https://lore.kernel.org/r/20240222174250.80493-1-danila@jiaxyga.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-29 22:43:01 +02:00
Danila Tikhonov
9c4058493b dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings
The Qualcomm SM7150 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.

Signed-off-by: Danila Tikhonov <danila@jiaxyga.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240222174250.80493-2-danila@jiaxyga.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-29 22:42:19 +02:00
Georgi Djakov
6025a81ae6 Merge branch 'icc-cleanup' into icc-next
* icc-cleanup
  interconnect: qcom: sm8550: Remove bogus per-RSC BCMs and nodes
  dt-bindings: interconnect: Remove bogus interconnect nodes
  interconnect: qcom: x1e80100: Remove bogus per-RSC BCMs and nodes
  interconnect: qcom: sa8775p: constify pointer to qcom_icc_node
  interconnect: qcom: sm8250: constify pointer to qcom_icc_node
  interconnect: qcom: sm6115: constify pointer to qcom_icc_node
  interconnect: qcom: sa8775p: constify pointer to qcom_icc_bcm
  interconnect: qcom: x1e80100: constify pointer to qcom_icc_bcm
  dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora address
  interconnect: constify of_phandle_args in xlate

Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-26 00:42:03 +02:00
Jeffrey Hugo
64eec95820 dt-bindings: interconnect: qcom,rpmh: Fix bouncing @codeaurora address
The servers for the @codeaurora domain have long been retired and any
messages sent there will bounce.  Fix Odelu's address in the binding to
match the .mailmap entry so that folks see the correct address when
looking at the documentation.

Signed-off-by: Jeffrey Hugo <quic_jhugo@quicinc.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20240202181748.4124411-1-quic_jhugo@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-19 10:16:28 +02:00
Adam Skladowski
47878b4512 dt-bindings: interconnect: Add Qualcomm MSM8909 DT bindings
Add bindings for Qualcomm MSM8909 Network-On-Chip interconnect devices.

[Stephan: Drop separate mm-snoc that exists downstream since it's
 actually the same NoC as SNoC in hardware]

Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Link: https://lore.kernel.org/r/20231220-icc-msm8909-v2-1-3b68bbed2891@kernkonzept.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-01-31 15:08:46 +02:00
Georgi Djakov
addb529540 Merge branch 'icc-qcm2290' into icc-next
More QCM2290-related patches to document the bandwidth monitor instance.

* icc-qcm2290
  dt-bindings: interconnect: qcom,msm8998-bwmon: Add QCM2290 bwmon instance

Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-12-15 00:43:01 +02:00
Georgi Djakov
c9de516ef6 Merge branch 'icc-sm6115' into icc-next
Add DT bindings and a driver for managing NoC providers on SM6115.

* icc-sm6115
  dt-bindings: interconnect: Add Qualcomm SM6115 NoC
  interconnect: qcom: Add SM6115 interconnect provider driver
  dt-bindings: interconnect: qcom,msm8998-bwmon: Add SM6115 bwmon instance
  interconnect: qcom: sm6115: Fix up includes

Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-2-bd8907b8cfd7@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-12-15 00:42:31 +02:00
Konrad Dybcio
85bfa5d497 dt-bindings: interconnect: qcom,msm8998-bwmon: Add QCM2290 bwmon instance
QCM2290 has a single BWMONv4 intance for CPU. Document it.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Link: https://lore.kernel.org/r/20231125-topic-rb1_feat-v3-3-4cbb567743bb@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-12-13 16:40:21 +02:00
Konrad Dybcio
80c5227af3 dt-bindings: interconnect: qcom,msm8998-bwmon: Add SM6115 bwmon instance
SM6115 has a single BWMONv4 intance for CPU. Document it.

Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231209-topic-6115iccdt-v1-1-f62da62b7276@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-12-13 16:23:31 +02:00
Konrad Dybcio
658902913c dt-bindings: interconnect: Add Qualcomm SM6115 NoC
Add bindings for Qualcomm SM6115 Network-On-Chip interconnect.

Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-1-bd8907b8cfd7@linaro.org
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-12-06 17:16:07 +02:00